Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
US-9676969-B2 · Jun 13, 2017 · US
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Kuroda Kyoko patents
Kuroda Kyoko holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Oct 4, 2016 |
| Latest publication | Jun 13, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Composition set, conductive substrate and method of producing the same, and conductive adhesive composition
US-9676969-B2 · Jun 13, 2017 · US
Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
US-9457406-B2 · Oct 4, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H05K3/105 | 2 |
| H05K3/1283 | 2 |
| H05K1/097 | 2 |
| H05K2203/1157 | 2 |
| B22F9/24 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 2 |
| Chemistry & Metallurgy | 2 |
| Electricity | 2 |
| Cross-Sectional Technologies | 2 |