Polymers for hard masks, hard mask compositions including the same, and methods for forming a pattern of a semiconductor device using a hard mask composition

Patent metadata

Field	Value
Publication number	US-9676892-B2
Application number	US-201615065119-A
Country	US
Kind code	B2
Filing date	Mar 9, 2016
Priority date	Mar 10, 2015
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

The present inventive concepts relate to a polymer for a hard mask, a hard mask composition including a polymer for a hard mask as described herein, and a method for forming a pattern of a semiconductor device using a hard mask composition as described herein. The polymer includes a structure represented by the following chemical formula 1.

In chemical formula 1, “A”, “Q”, “L”, “R 1 ”, “R 2 ”, “R 3 ”, and “n” are the same as defined in the specification.

First claim

What is claimed is:

1. A polymer comprising a structure represented by chemical formula 3:

wherein X is selected from the group consisting of O, S, and NH;
Q is a benzene group or a substituted or unsubstituted polycyclic aromatic group;
L is a C1 to C20 alkylene group;
R 1 and R 2 are each independently attached to one of the at least two aromatic rings and are each independently selected from the group consisting of hydrogen, a hydroxyl group, an amino group, and a substituted or unsubstituted C1 to C30 alkoxy group;
R 3 is hydrogen, a hydroxyl group, or a substituted or unsubstituted C1 to C30 alkoxy group; and
n is a natural number from 1 to 10.

2. The polymer of claim 1 , wherein the polymer comprises a structure represented by chemical formula 3a:

wherein n in the chemical formula 3a is a natural number from 1 to 10.

3. The polymer of claim 1 , wherein the substituted or unsubstituted polycyclic aromatic group includes a naphthalene group, an anthracene group, a pyrene group, or any combination thereof.

4. The polymer of claim 1 , wherein the polymer has a weight-average molecular weight of 1,000 to 10,000.

5. The polymer of claim 1 , wherein the polymer comprises a structure represented by chemical formula 3b:

wherein n in the chemical formulas 3a and 3b is a natural number from 1 to 10.

6. A hard mask composition comprising:
an organic solvent; and
the polymer of claim 1 .

7. The hard mask composition of claim 6 , wherein the polymer includes a structure represented by chemical formula 3a:

wherein n in chemical formula 3a is a natural number from 1 to 10.

8. The hard mask composition of claim 6 , wherein the substituted or unsubstituted polycyclic aromatic group includes a naphthalene group, an anthracene group, a pyrene group, or any combination thereof.

9. The hard mask composition of claim 6 , wherein the polymer is present in the hard mask composition in an amount in a range of about 2 wt % to about 20 wt % with respect to a total content of the hard mask composition.

10. The hard mask composition of claim 6 , wherein the organic solvent includes at least one of a glycol ether-based solvent, an acetate-based solvent, a ketone-based solvent, a hydroxypropionate-based solvent, a cabitol-based solvent, or a lactate or lactone-based solvent.

11. The hard mask composition of claim 6 , wherein the polymer comprises a structure represented by chemical formula 3b:

wherein n in the chemical formula 3b is a natural number from 1 to 10.

12. A method for forming a pattern of a semiconductor device, the method comprising:
forming a lower layer on a substrate;
forming a hard mask layer on the lower layer using the polymer of claim 1 ; and
patterning the hard mask layer to form a hard mask pattern,
wherein the patterning of the hard mask layer comprises:
forming photoresist patterns on the hard mask layer; and
etching the hard mask layer using the photoresist patterns as etch masks.

13. The method of claim 12 , wherein forming the hard mask layer comprises:
coating the hard mask composition on the lower layer using a spin-on-coating method; and
performing a bake process on the coated hard mask composition.

14. A polymer comprising a structure represented by chemical formula 2d:

wherein n is a natural number from 1 to 10.

15. A hard mask composition comprising:
an organic solvent; and
the polymer of claim 14 .

16. A method for forming a pattern of a semiconductor device, the method comprising:
forming a lower layer on a substrate;
forming a hard mask layer on the lower layer using the polymer of claim 14 ; and
patterning the hard mask layer to form a hard mask pattern,
wherein the patterning of the hard mask layer comprises:
forming photoresist patterns on the hard mask layer; and
etching the hard mask layer using the photoresist patterns as etch masks.

17. A polymer comprising a structure represented by one or more of chemical formulas 4b and 4c:

wherein n in chemical formulas 4b and 4c is a natural number from 1 to 10.

18. A hard mask composition comprising:
an organic solvent; and
the polymer of claim 17 .

19. A method for forming a pattern of a semiconductor device, the method comprising:
forming a lower layer on a substrate;
forming a hard mask layer on the lower layer using the polymer of claim 17 ; and
patterning the hard mask layer to form a hard mask pattern,
wherein the patterning of the hard mask layer comprises:
forming photoresist patterns on the hard mask layer; and
etching the hard mask layer using the photoresist patterns as etch masks.

Assignees

• Kim Myeong Koo
• Choi Ahreum
• Kim Boodeuk
• Yi Songse
• Choi Jungsik
• Samsung Electronics Co Ltd

Inventors

• Kim Myeong Koo
• Choi Ahreum
• Kim Boodeuk
• Yi Songse
• Choi Jungsik

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P14/6342 Primary

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title