Method for coating zinc die-cast parts, multi-layered coating for the protection of zinc die-cast parts, and coated zinc die-cast part
US-2024254631-A1 · Aug 1, 2024 · US
Method for treating Cu thin sheet
US9676060B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9676060-B2 |
| Application number | US-201314032699-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 20, 2013 |
| Priority date | Mar 24, 2011 |
| Publication date | Jun 13, 2017 |
| Grant date | Jun 13, 2017 |
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- Title
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Abstract
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A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters D 50 of both DBA and RM employed fall within 0.1 to 100 μm, the median diameter D 50 of DBA is larger than the median diameter D 50 of RM, and both the distribution ratio D 90 /D 10 of DBA and the distribution ratio D 90 /D 10 of RM are 4.0 or less.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for treating a Cu thin sheet, comprising the steps of: supplying a slurry in which a diffusion bonding aid and a reinforcing material are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer, wherein (a) a Ni or Ni—Cr alloy powder is used as the diffusion bonding aid, (b) a carbide base metal compound, a nitride base metal compound, or a boride base metal compound is used as the reinforcing material, and the weight ratio of the diffusion bonding aid to the reinforcing material is specified to be 80:20 to 50:50, and (c) the median diameters D 50 of both the diffusion bonding aid and the reinforcing material fall within 0.1 to 100 μm, the median diameter D 50 of the diffusion bonding aid is larger than the median diameter D 50 of the reinforcing material, the distribution ratio D 90 /D 10 of the diffusion bonding aid is 1.8 or less, and the distribution ratio D 90 /D 10 of the reinforcing material is 4.0 or less. 2. The method for treating a Cu thin sheet, according to claim 1 , wherein the predetermined portion is less than the total area of the thin sheet.
Assignees
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Classifications
without Mo and W · CPC title
Build-up welding · CPC title
at least one of the workpieces being of copper or another noble metal · CPC title
with nickel or cobalt as the next major constituent · CPC title
Supplementary information concerning processes or compositions relating to powder metallurgy · CPC title
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- What does patent US9676060B2 cover?
- A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, so…
- Who is the assignee on this patent?
- Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification C23C24/10. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jun 13 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).