Module board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9674970-B2
Application number	US-201213684608-A
Country	US
Kind code	B2
Filing date	Nov 26, 2012
Priority date	May 26, 2010
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin.

First claim

What is claimed is:

1. A module board, comprising:
a first board including an electronic component mounted on a first principal surface, the first board having a rectangular or substantially rectangular shape including first and second opposed sides, and third and fourth opposed sides extending in a direction perpendicular or substantially perpendicular to the first and second opposed sides; and
a second board including a hole arranged to house the electronic component; wherein
the first board is mounted on a first principal surface of the second board such that the electronic component is housed in the hole;
the first and second opposed sides of the first board overlap portions of the second board when viewed in a direction perpendicular to the first principal surface of the first board;
the third and fourth opposed sides of the first board overlap the hole so as to spaced away from the second board by a gap when viewed in the direction perpendicular to the first principal surface of the first board;
resin layers are located on both the first principal surface and a second principal surface of the second board, and an inside of the hole is filled with resin;
the resin layers are located on a second principal surface of the first board opposite to the first principal surface of the first board, on the first and second opposed sides of the first board, and on the third and fourth opposed sides of the first board; and
the first and second boards are made of a different material than a material from which the resin layers are made.

2. The module board according to claim 1 , wherein the electronic component housed in the hole protrudes from the second principal surface of the second board.

3. The module board according to claim 1 , wherein the first board includes a recess at the first principal surface of the first board, and the electronic component is mounted in the recess.

4. The module board according to claim 2 , wherein the first board includes a recess at the first principal surface of the first board, and the electronic component is mounted in the recess.

5. The module board according to claim 1 , wherein another electronic component is mounted on the second principal surface of the first board.

6. The module board according to claim 2 , wherein another electronic component is mounted on the second principal surface of the first board.

7. The module board according to claim 3 , wherein another electronic component is mounted on the second principal surface of the first board.

8. The module board according to claim 4 , wherein another electronic component is mounted on the second principal surface of the first board.

9. The module board according to claim 1 , wherein another electronic component is embedded in the first board.

10. The module board according to claim 2 , wherein another electronic component is embedded in the first board.

11. The module board according to claim 3 , wherein another electronic component is embedded in the first board.

12. The module board according to claim 4 , wherein another electronic component is embedded in the first board.

13. The module board according to claim 5 , wherein another electronic component is embedded in the first board.

14. The module board according to claim 6 , wherein another electronic component is embedded in the first board.

15. The module board according to claim 7 , wherein another electronic component is embedded in the first board.

16. The module board according to claim 8 , wherein another electronic component is embedded in the first board.

17. The module board according to claim 1 , wherein the hole is covered with the first board.

18. The module board according to claim 2 , wherein the hole is covered with the first board.

19. The module board according to claim 1 , wherein the resin layer that is located on the first principal surface of the second board completely covers the second principal surface of the first board opposite to the first principal surface of the first board such that the first board is embedded in the resin layer located on the first principal surface of the second board.

Assignees

• Murata Manufacturing Co

Inventors

• Yamamoto Issei
• Kamada Akihiko

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K2203/1316

  Moulded encapsulation of mounted components · CPC title

• H05K1/186

  manufactured by mounting on or connecting to patterned circuits before or during embedding · CPC title

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H01L2924/19105

  Electricity · mapped topic