Bidirectional temperature communication between controller and converter for multiple phase buck converters

US9673703B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9673703-B2
Application numberUS-201314409746-A
CountryUS
Kind codeB2
Filing dateJun 19, 2013
Priority dateJun 28, 2012
Publication dateJun 6, 2017
Grant dateJun 6, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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A converter arrangement, in particular a switched DC/DC converter arrangement, comprises a control die and a converter die. The control die comprises a control logic for generating a control signal and a control output for controlling the converter die by means of the control signal. The converter die comprises at least one converter that is designed for converting an input signal into an output signal in dependence on the control signal, wherein the control signal can be received at a control input. A single-line interface connects the control output to the control input.

First claim

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We claim: 1. A converter arrangement, particularly a switched DC/DC converter arrangement, comprising: a control die that comprises a control logic for generating a control signal and further comprises a control output for controlling a converter die by means of the control signal, the converter die that comprises at least one converter and is designed for converting an input signal into an output signal in dependence on the control signal, wherein the control signal can be received at a control input, and a single-line interface that connects the control output to the control input, wherein the control die features a temperature input, wherein the converter die features a temperature output, wherein a second single-line interface connects the temperature input to the temperature output, and wherein a bidirectional communication is designed for transmitting the temperature signal from the temperature output to the temperature input, and for receiving a configuration signal from the temperature output at the temperature input. 2. The converter arrangement according to claim 1 , wherein the single-line interface is designed for bidirectional communication between the control output and the control input. 3. The converter arrangement according to claim 2 , wherein the bidirectional communication is designed for transmitting the control signal from the control output to the control input and for receiving a current signal from the control input at the control output, wherein the current signal is dependent on a coil current flowing through a coil that can be connected to the at least one converter. 4. The converter arrangement according to claim 3 , wherein the control logic of the control die generates the control signal in dependence on the current signal. 5. The converter arrangement according to claim 1 , wherein the converter die comprises: the at least one converter that features switches, a converter control logic that is connected to the control input and respectively connected to the switches via driver stages, and a current source that is connected to the control input and coupled to a current meter. 6. The converter arrangement according to claim 1 , wherein the second single-line interface is designed for bidirectional communication between the temperature input and the temperature output. 7. The converter arrangement according to claim 1 , wherein the converter die features means for generating a temperature signal, and wherein the temperature signal is dependent on the temperature of the converter die and made available at the temperature output. 8. The converter arrangement according to claim 1 , wherein the control die comprises a plurality of control logics that respectively feature a control output and the converter die comprises a plurality of converters that respectively feature a control input. 9. The converter arrangement according to claim 8 , wherein the plurality of control logics is integrated into a common semiconductor chip and the plurality of converters is integrated into another common semiconductor chip. 10. A converter arrangement, particularly a switched DC/DC converter arrangement, comprising: a control die that comprises a control logic for generating a control signal and further comprises a control output for controlling a converter die by means of the control signal, the converter die that comprises at least one converter and is designed for converting an input signal into an output signal in dependence on the control signal, wherein the control signal can be received at a control input, and a single-line interface that connects the control output to the control input, wherein the control die features a temperature input, wherein the converter die features a temperature output, wherein a second single-line interface connects the temperature input to the temperature output, wherein a bidirectional communication is designed for transmitting the temperature signal from the temperature output to the temperature input, and for receiving a configuration signal from the temperature output at the temperature input, wherein the control logic, in dependence on the configuration signal, switches the converter die on or off and/or makes available a bias current at the converter die. 11. The converter arrangement according to claim 1 or 10 , wherein the control logic comprises a feedback input that is connected to a feedback output of the converter die by means of an interface which communicates in one direction only in order to receive a feedback signal, and the feedback signal is dependent on the output signal, and the control signal is dependent on the feedback signal. 12. The converter arrangement according to claim 11 , wherein the control logic comprises a comparator that is coupled to the feedback input and designed for generating a comparison signal by comparing the current signal and the feedback signal. 13. The converter arrangement according to claim 12 , wherein the control logic comprises a modulator for modulating the control signal by means of pulse-width modulation, wherein the pulse-width modulation is carried out in dependence on the comparison signal of the comparator and the modulated control signal defines a duty factor of the at least one converter. 14. The converter arrangement according to claim 11 , wherein the plurality of control logics feature the same feedback input, wherein the feedback input is respectively connected to the feedback outputs of the plurality of converters. 15. A method for operating a converter arrangement, particularly for operating a switched DC/DC converter arrangement, comprising the steps of: generating a control signal by means of a control logic of a control die in order to control a converter die, transmitting the control signal by means of a first single-line interface that connects a control output of the control die to a control input of the converter die, receiving the control signal at the control input of the converter die, and converting an input signal into an output signal in dependence on the control signal by means of at least one converter of the converter die, wherein the control die features a temperature input, wherein the converter die features a temperature output, wherein a second single-line interface connects the temperature input to the temperature output, and wherein a bidirectional communication is designed for transmitting the temperature signal from the temperature output to the temperature input, and for receiving a configuration signal from the temperature output at the temperature input.

Assignees

Inventors

Classifications

  • H02M7/003Primary

    Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

  • with a plurality of power processing stages connected in parallel · CPC title

  • H02M3/158Primary

    including plural semiconductor devices as final control devices for a single load · CPC title

  • H02M3/155Primary

    using semiconductor devices only · CPC title

  • Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

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What does patent US9673703B2 cover?
A converter arrangement, in particular a switched DC/DC converter arrangement, comprises a control die and a converter die. The control die comprises a control logic for generating a control signal and a control output for controlling the converter die by means of the control signal. The converter die comprises at least one converter that is designed for converting an input signal into an outpu…
Who is the assignee on this patent?
Ams Ag
What technology area does this patent fall under?
Primary CPC classification H02M7/003. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 06 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).