Method of making a flexible circuit electrode array

Patent metadata

Field	Value
Publication number	US-9669209-B2
Application number	US-201615132177-A
Country	US
Kind code	B2
Filing date	Apr 18, 2016
Priority date	Apr 28, 2005
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on said polymer base layer and said metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.

First claim

The invention claimed is:

1. A method of making a flexible circuit electrode array comprising:
providing a substrate;
depositing a polymer base layer on the substrate;
depositing a first metal layer on said polymer base layer;
patterning said first metal to form first metal traces, electrodes and bond pads;
depositing a polymer interlayer on said polymer base layer and said metal traces, electrodes and bond pads;
depositing a second metal layer on said polymer interlayer;
patterning said second metal layer to form second metal traces, electrodes and bond pads;
depositing a polymer top layer on said polymer interlayer and said second metal traces, electrodes and bond pads
patterning said polymer top layer and said polymer interlayer to expose said first bond pads and electrodes and said second bond pads and electrodes; removing the substrate from the polymer base layer to form a flexible circuit; and
embedding the flexible circuit in an curved polymer body, made of polymer softer than said polymer base layer, such that the curved polymer body bonded to a back side and around the edges of the flexible circuit.

2. The method according to claim 1 , further comprising repeating the steps of depositing metal layers patterning and depositing polymer interlayers to create additional trace layers.

3. The method according to claim 1 , wherein the steps of patterning polymer are etching by reactive plasma.

4. The method according to claim 1 , wherein the steps of patterning polymer are etching by RIE.

5. The method according to claim 1 , wherein the steps of patterning polymer are etching by Ion milling.

6. The method according to claim 1 , wherein the steps of patterning metal layers is wet etching.

7. The method according to claim 1 , wherein the steps of patterning metal layers is dry etching.

8. The method according to claim 1 , further comprising plating electrodes through openings in the polymer top layer.

9. The method according to claim 8 , wherein the step of plating is electroplating.

10. The method according to claim 9 , wherein the step of plating is electroplating platinum grey.

11. The method according to claim 8 , wherein the step of plating is plating electrodes to protrude above the polymer top layer.

12. The method according to claim 11 , wherein the protruding electrodes are shaped as a circle, star, square, ring or other geometric arrangement.

13. The method according to claim 1 , wherein the steps of depositing polymer are depositing polyimide, thermoplastic polyimide, silicone, parylene, LCP polymers, epoxy resin, PEEK, TPE, or mixtures thereof.

14. The method according to claim 1 , wherein the steps of depositing metal are depositing titanium, platinum, palladium, iridium, gold, silver, niobium, titanium nitride, iridium oxide, ruthenium, ruthenium oxide, rhodium or other biocompatible metals or metal alloys or metal layers.

15. The method according to claim 1 , wherein the steps of depositing metal include depositing an adhesion layer and a conducting layer.

16. The method according to claim 15 , wherein the adhesion layer contains titanium.

17. The method according to claim 15 , wherein the conducting layer includes platinum.

18. The method according to claim 1 , further comprising forming openings in the interlayer and depositing vias through the interlayer connecting at least one of the first metal traces with the second metal traces.

19. The method according to claim 1 , wherein the polymer body is curved to match the curvature of a retina.

Assignees

• Second Sight Medical Products Inc

Inventors

• Neysmith Jordan
• Greenberg Robert
• Little James
• Mech Brian
• Talbot Neil
• Yao Qingfang
• Zhou Dao Min

Classifications

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K3/0017

  Etching of the substrate by chemical or physical means · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title