Acoustic wave device

Patent metadata

Field	Value
Publication number	US-9667221-B2
Application number	US-201414463441-A
Country	US
Kind code	B2
Filing date	Aug 19, 2014
Priority date	Feb 27, 2012
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

An acoustic wave device includes: a first chip that includes a first substrate, and a first filter formed on a first surface of the first substrate; and a second chip that includes a second substrate, and a second filter formed on a second surface of the second substrate, the second surface being located in a plane different from the first surface.

First claim

What is claimed is:

1. An acoustic wave device comprising:
a first chip that includes a first substrate, and a first filter formed on a first surface of the first substrate;
a second chip that includes a second substrate, and a second filter formed on a second surface of the second substrate, the second surface being located in a plane different from the first surface;
a third substrate that includes a plurality of laminated insulating layers including a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer,
wherein
the first surface and the second surface are directed to a same direction,
the first chip is mounted on the first insulating layer and is embedded in the second insulating layer;
the third insulating layer is located on the second insulating layer and overlaps with the first chip and the second chip in a planar view; and
the second chip is mounted on the third insulating layer, overlaps with the first chip in the planar view and is embedded in the fourth insulating layer.

2. The acoustic wave device according to claim 1 , wherein
a pass band of the first filter differs from a pass band of the second filter.

3. The acoustic wave device according to claim 1 , wherein
the first chip includes a first terminal that is formed on the first surface, connected to the first filter, and inputs or outputs a signal from/to the outside of the first chip, and
the second chip includes a second terminal that is formed on the second surface, connected to the second filter, and inputs or outputs a signal from/to the outside of the second chip.

4. The acoustic wave device according to claim 1 , comprising:
a component provided on the third substrate; and
a wiring that is provided on the third substrate, and connects the component to the first chip and the second chip.

5. The acoustic wave device according to claim 1 , wherein
the first filter is a transmission filter connected between a common terminal and a transmission terminal, and
the second filter is a reception filter connected between the common terminal and a reception terminal.

6. The acoustic wave device according to claim 1 , wherein
the first filter and the second filter are unconnected to each other.

7. The acoustic wave device according to claim 1 , wherein
the first substrate and the second substrate are piezoelectric substrates, and
at least one of the first filter and the second filter includes an IDT (Interdigtal Transducer).

8. The acoustic wave device according to claim 1 , wherein
at least one of the first filter and the second filter includes a piezoelectric thin film resonator.

9. An acoustic wave device comprising:
a first chip that includes a first substrate, and a first filter formed on a first surface of the first substrate;
a second chip that includes a second substrate, and a second filter formed on a second surface of the second substrate, the second surface being located in a plane different from the first surface; and
a third substrate that includes a plurality of laminated insulating layers,
wherein:
the second surface is directed to a direction opposite to a direction in which the first surface is directed;
the first chip and the second chip are embedded in a same insulating layer out of the plurality of laminated insulating layers;
a pass band of the first filter differs from a pass band of the second filter;
the first chip includes a first terminal that is formed on the first surface, connected to the first filter, and inputs a signal from the outside of the first chip;
the second chip includes a second terminal that is formed on the second surface, connected to the second filter, and outputs a signal to the outside of the second chip;
the first filter is a transmission filter connected between a common terminal and a transmission terminal formed on a bottom surface of the third substrate;
the second filter is a reception filter connected between the common terminal and a reception terminal formed on a bottom surface of the third substrate;
the transmission terminal and the first terminal are connected by a first wire that does not run between the first chip and the second chip; and
the reception terminal and the second terminal are connected by a second wire that does not run between the first chip and the second chip.

10. An acoustic wave device comprising:
a first chip that includes a first substrate, and a first filter formed on a first surface of the first substrate;
a second chip that includes a second substrate, and a second filter formed on a second surface of the second substrate, the second surface being located in a plane different from the first surface; and
a third substrate that includes a plurality of laminated insulating layers,
wherein:
the second surface is directed to a direction opposite to a direction in which the first surface is directed;
the first chip and the second chip are embedded in a same insulating layer out of the plurality of laminated insulating layers;
a pass band of the first filter differs from a pass band of the second filter;
the first chip includes a first terminal that is formed on the first surface, connected to the first filter, and inputs a signal from the outside of the first chip and a second terminal that is formed on the first surface, connected to the first filter, and outputs a signal to the outside of the first chip;
the second chip includes a third terminal that is formed on the second surface, connected to the second filter, and inputs a signal from the outside of the second chip and a fourth terminal that is formed on the second surface, connected to the second filter, and outputs a signal to the outside of the first chip;
the first filter is connected between a first input terminal and a first output terminal, the first input terminal and the first output terminal formed on a bottom surface of the third substrate;
the second filter is connected between a second input terminal and a second output terminal, the second input terminal and the second output terminal formed on the bottom surface of the third substrate;
the first filter and the second filter are unconnected to each other in the third substrate;
the first input terminal and the first terminal are connected by a first wire that does not run between the first chip and the second chip;
the first output terminal and the second terminal are connected by a second wire that does not run between the first chip and the second chip;
the second input terminal and the third terminal are connected by a third wire that does not run between the first chip and the second chip; and
the second output terminal and the fourth terminal are connected by a fourth wire that does not run between the first chip and the second chip.

Assignees

• Taiyo Yuden Kk

Inventors

• Kawachi Osamu
• Uehara Kensei

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H03H9/0538 Primary

  Constructional combinations of supports or holders with electromechanical or other electronic elements · CPC title

• H03H2009/0019

  Surface acoustic wave multichip · CPC title

• H03H9/059

  consisting of mounting pads or bumps · CPC title