Switching circuits having ferrite beads

Patent metadata

Field	Value
Publication number	US-9660640-B2
Application number	US-201615363987-A
Country	US
Kind code	B2
Filing date	Nov 29, 2016
Priority date	Jul 3, 2014
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

A circuit includes an electronic component package that comprises at least a first lead, a III-N device in the electronic component package, a gate driver, and a ferrite bead. The III-N device comprises a drain, gate, and source, where the source is coupled to the first lead. The gate driver comprises a first terminal and a second terminal, where the first terminal is coupled to the first lead. The ferrite bead is coupled between the gate of the III-N transistor and the second terminal of the gate driver. When switching, the deleterious effects of the parasitic inductance of the circuit gate loop are mitigated by the ferrite bead.

First claim

What is claimed is:

1. A circuit comprising:
an electronic component package comprising at first lead, a second lead, and a third lead;
a III-N device encased in the electronic component package, the III-N device comprising a depletion mode III-N transistor and an enhancement mode transistor, the depletion mode III-N transistor comprising a first drain, a first gate, and a first source, the enhancement mode transistor comprising a second drain, a second gate, and a second source, the first gate of the depletion mode III-N transistor and the second source of the enhancement mode transistor each coupled to the first lead, and the first drain coupled to the third lead;
a gate driver coupled to the second lead of the electronic component package; and
a ferrite bead encased in the electronic component package and coupled between the second gate of the enhancement mode transistor and the second lead; wherein
the first source of the depletion mode III-N transistor is coupled to the second drain of the enhancement mode transistor.

2. The circuit of claim 1 , wherein the electronic package further comprising a conductive structural base, wherein the depletion mode III-N transistor is a lateral III-N transistor, and wherein the first gate of the III-N transistor is electrically connected to the conductive structural base of the electronic package.

3. The circuit of claim 2 , wherein the second source of the enhancement mode transistor is electrically connected to the conductive structural base and the conductive structural base is directly coupled to the first lead.

4. The circuit of claim 1 , wherein the gate driver, the ferrite bead, the III-N device, and the first lead form a gate loop, the first lead has a parasitic inductance, and the ferrite bead is configured to reduce oscillations and electromagnetic interference in the gate loop due to the parasitic inductance.

5. The circuit of claim 1 , wherein the III-N device and the electronic component package form a low side switch, the first lead is coupled to a ground node, and the circuit further comprises a high side switch coupled between the third lead and a high voltage node, the high side switch comprising a high side gate coupled to a third terminal of the gate driver.

6. The circuit of claim 5 , comprising:
a processor coupled to the gate driver; and
memory storing executable instructions that, when executed by the processor, cause the processor to control the gate driver to operate the circuit as a half bridge.

7. The circuit of claim 5 , wherein;
the gate driver further comprises a first terminal and a second terminal, the first terminal being coupled to the first lead of the electronic component package and the second terminal being coupled to the second lead of the electronic component package; and
the gate driver is configured to apply a low side control signal to the second terminal relative to the first terminal, and to apply a high side control signal to the third terminal relative to a fourth terminal of the gate driver, the fourth terminal being coupled to a high side source of the high side switch.

8. The circuit of claim 7 , wherein the voltage at the high voltage node relative to the ground node is about 400V or higher.

9. The circuit of claim 8 , wherein the gate driver is configured to apply a control signal to the second terminal relative to the first terminal, the control signal having a frequency between 30 kHz and 10 MHz.

10. The circuit of claim 5 , further comprising a second ferrite bead coupled between the high side gate and the third terminal of the gate driver.

11. The circuit of claim 1 , wherein the ferrite bead forms a passive low pass filter configured to block electromagnetic interference having frequencies above 100 MHz.

12. An electronic component comprising:
an electronic package including a first lead, a second lead, and a third lead;
a III-N switching device comprising a gate, the III-N switching device encased in the electronic package; and
a ferrite bead encased in the electronic package, wherein the ferrite bead is coupled between the gate and the first lead, wherein
the III-N switching device comprises a depletion mode III-N transistor and an enhancement mode transistor, and the gate is a first gate of the enhancement mode transistor.

13. The electronic component of claim 12 , the electronic package further comprising a conductive base, wherein the depletion mode III-N transistor is a lateral III-N transistor comprising a second gate, and wherein the second gate of the III-N transistor is electrically connected to the conductive base of the electronic package.

14. The electronic component of claim 13 , wherein the depletion mode III-N transistor and the ferrite bead are both directly mounted on the conductive base.

15. The electronic component of claim 12 , comprising a first wire bond between the ferrite bead and the gate and a second wire bond between the ferrite bead and the first lead.

16. The electronic component of claim 12 , wherein the depletion mode III-N transistor comprises a gate coupled to the second lead and a drain coupled to the third lead of the electronic package, and wherein the electronic package includes a fourth lead coupled to a source of the enhancement mode transistor for directly coupling of the source to a gate driver.

17. An electronic component comprising:
an electronic package including a first lead;
a depletion mode III-N transistor and an enhancement mode transistor both encased in the electronic package; and
a ferrite bead encased in the electronic package, wherein the ferrite bead is coupled between a gate electrode of the enhancement mode transistor and the first lead; wherein
a source electrode of the enhancement mode transistor is electrically connected to a gate electrode of the depletion mode III-N transistor, and a drain electrode of the enhancement mode transistor is electrically connected to a source electrode of the depletion mode III-N transistor.

18. The electronic component of claim 17 , wherein the source electrode of the enhancement mode transistor is coupled to a second lead of the electronic package, and a drain electrode of the depletion mode III-N transistor is coupled to a third lead of the electronic package.

19. The electronic component of claim 17 , wherein the electronic package includes a conductive base, and the source electrode of the enhancement mode transistor is electrically connected to the conductive base.

20. The electronic component of claim 19 , wherein the depletion mode III-N transistor and the ferrite bead are both directly mounted on the conductive base.

Assignees

• Transphorm Inc

Inventors

• Wang Zhan
• Wu Yifeng
• Honea James

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W70/481

  for devices being provided for in groups H10D8/00 - H10D48/00 · CPC title

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title