Electronic component

Patent metadata

Field	Value
Publication number	US-9659713-B2
Application number	US-201614990192-A
Country	US
Kind code	B2
Filing date	Jan 7, 2016
Priority date	Sep 7, 2011
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.

First claim

What is claimed is:

1. An electronic component comprising:
an element body including first and second principal faces opposed to each other, and four faces extending to connect the first principal face and the second principal face;
an external electrode including an electrode portion disposed on at least a partial region of the first principal face and an electrode portion disposed on at least a partial region of a one of the four faces; and
a solder resist layer disposed to surround the four faces, the solder resist layer being an insulating layer that is solder resistive,
wherein a portion of the first principal face is exposed from both the external electrode and the insulating is layer.

2. An electronic component according to claim 1 , wherein the insulating layer is a resin coating layer.

3. An electronic component according to claim 2 , wherein a thickness of the resin coating layer is in the range of at least 2 μm but not more than 30 μm.

4. An electronic component according to claim 1 , wherein the external electrode includes a sintered electrode layer.

5. An electronic component according to claim 1 , wherein the external electrode includes a plating layer.

6. An electronic component according to claim 5 , wherein the plating layer is made of Sn or an Sn alloy.

7. An electronic component comprising:
an element body including first and second end faces opposed to each other, first and second principal faces opposed to each other, and first and second side faces opposed to each other;
a first external electrode including a first electrode portion disposed on the first end face, second electrode portions disposed on the first and second principal faces, and third electrode portions disposed on the first and second side faces;
a second external electrode including a fourth electrode portion disposed on the second end face, fifth electrode portions disposed on the first and second principal faces, and sixth electrode portions disposed on the first and second side faces; and
a solder resist layer covering all of the first electrode portion, the third electrode portions, the fourth electrode portion, and the sixth electrode portions, the solder resist layer being an insulating layer that is solder resistive,
wherein a portion of the first principal face is exposed from both the first and second external electrode and the insulating layer.

8. An electronic component according to claim 7 , wherein the insulating layer further covers portions of the first and second side faces exposed from the third electrode portions and the sixth electrode portions.

9. An electronic component according to claim 7 , the insulating layer disposed to surround the first and second end faces and the first and second side faces.

10. An electronic component according to claim 7 , wherein the insulating layer is further a resin coating layer.

11. An electronic component according to claim 10 , wherein a thickness of the resin coating layer is in the range of at least 2 μm but not more than 30 μm.

12. An electronic component according to claim 7 , wherein the external electrode includes a sintered electrode layer.

13. An electronic component according to claim 7 , wherein the external electrode includes a plating layer.

14. An electronic component according to claim 13 , wherein the plating layer is made of Sn or an Sn alloy.

15. An electronic component according to claim 1 , wherein the insulating layer is made of a thermosetting insulating resin, a UV-curable insulating resin, or a thermosetting insulating resin introduced in a UV-curable insulating resin.

16. An electronic component according to claim 7 , wherein the insulating layer is made of thermosetting insulating resin, a UV-curable insulating resin, or a thermosetting insulating resin introduced in a UV-curable insulating resin.

Assignees

• Tdk Corp

Inventors

• Shirakawa Yukihiko
• Nakamura Kazuhiro
• Kon Shintaro
• Nogiwa Hiromitsu

Classifications

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title