Electronic component

Patent metadata

Field	Value
Publication number	US-9263191-B2
Application number	US-201514716082-A
Country	US
Kind code	B2
Filing date	May 19, 2015
Priority date	Sep 7, 2011
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.

First claim

What is claimed is:

1. An electronic component comprising:
an element body having a pair of principal faces opposed to each other and four faces extending so as to connect the pair of principal faces;
an external electrode formed so as to cover at least a partial region of a first principal face of the pair of principal faces and at least a partial region of a first face of the four faces; and
an insulating layer covering at least a portion of the external electrode formed so as to cover the first face, a portion of the external electrode formed so as to cover the first principal face being exposed from the insulating layer,
wherein a portion of the first principal face is exposed from both the external electrode and the insulating layer.

2. An electronic component according to claim 1 , wherein the insulating layer covers an entire area of the portion of the external electrode formed so as to cover the first face.

3. An electronic component according to claim 1 , wherein the insulating layer further covers a portion of the first face exposed from the external electrode.

4. An electronic component according to claim 1 , wherein the insulating layer is formed so as to surround the four faces.

5. An electronic component according to claim 1 , wherein the insulating layer is further a resin coating layer.

6. An electronic component according to claim 5 , wherein a thickness of the resin coating layer is in the range of at least 2 μm but not more than 30 μm.

7. An electronic component according to claim 1 , wherein the external electrode has a sintered electrode layer.

8. An electronic component according to claim 1 , wherein the external electrode has a plating layer.

9. An electronic component according to claim 8 , wherein the plating layer is comprised of Sn or an Sn alloy.

Assignees

• Tdk Corp

Inventors

• Shirakawa Yukihiko
• Nakamura Kazuhiro
• Kon Shintaro
• Nogiwa Hiromitsu

Classifications

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title