Monolithic ceramic electronic component

Patent metadata

Field	Value
Publication number	US-9659689-B2
Application number	US-201414311381-A
Country	US
Kind code	B2
Filing date	Jun 23, 2014
Priority date	Jun 27, 2013
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

A monolithic ceramic electronic component includes a ceramic body including a stack of ceramic layers. Inner electrodes are disposed within the ceramic body and include exposed portions at the end surfaces of the ceramic body. A pair of outer electrodes is arranged on the end surfaces of the ceramic body so as to extend from the end surfaces to the main surfaces and side surfaces of the ceramic body. Each of the outer electrodes includes a lower electrode layer provided on the ceramic body, an intermediate electrode layer located on the lower electrode layer and defined by a plated Ni layer, and an upper electrode layer located on the intermediate electrode layer and defined by a plated Pd layer. A thickness of the intermediate electrode layer on the main surfaces and the side surfaces of the ceramic body is larger than a thickness of the intermediate electrode layer on the end surfaces of the ceramic body.

First claim

What is claimed is:

1. A monolithic ceramic electronic component comprising:
a ceramic body including a stack of a plurality of ceramic layers, opposing main surfaces, opposing side surfaces, and opposing end surfaces;
inner electrodes disposed within the ceramic body and including exposed portions at the end surfaces of the ceramic body; and
a pair of outer electrodes arranged on the end surfaces of the ceramic body so as to be connected to the exposed portions of the inner electrodes and so as to extend from the end surfaces of the ceramic body to the main surfaces and the side surfaces of the ceramic body; wherein
each of the outer electrodes includes a lower electrode layer located on the ceramic body, an intermediate electrode layer located on the lower electrode layer and defined by a plated Ni layer, and an upper electrode layer located on the intermediate electrode layer and defined by a plated Pd or Pd—Ni alloy layer; and
a thickness of the intermediate electrode layer on the main surfaces and the side surfaces of the ceramic body is larger than a thickness of the intermediate electrode layer on the end surfaces of the ceramic body.

2. The monolithic ceramic electronic component according to claim 1 , wherein a ratio of the thickness of the intermediate electrode layer on the main surfaces and the side surfaces of the ceramic body to the thickness of the intermediate electrode layer on the end surfaces of the ceramic body is about 120% or greater and about 300% or less.

3. The monolithic ceramic electronic component according to claim 1 , wherein the plurality of ceramic layers are made of one of a dielectric ceramic, a piezoelectric ceramic, a semiconductor ceramic, and a magnetic ceramic.

4. The monolithic ceramic electronic component according to claim 1 , wherein the monolithic ceramic electronic component is one of a piezoelectric component, a thermistor, and an inductor.

5. A mounting structure of a monolithic ceramic electronic component, the mounting structure comprising:
a monolithic ceramic electronic component including:
a ceramic body including a stack of a plurality of ceramic layers, opposing main surfaces, opposing side surfaces, and opposing end surfaces;
inner electrodes that are disposed within the ceramic body and include exposed portions at the end surfaces of the ceramic body; and
a pair of outer electrodes arranged on the end surfaces of the ceramic body so as to be connected to the exposed portions of the inner electrodes and so as to extend from the end surfaces of the ceramic body to the main surfaces and the side surfaces of the ceramic body; wherein
each of the outer electrodes includes a lower electrode layer located on the ceramic body, an intermediate electrode layer located on the lower electrode layer and defined by a plated Ni layer, and an upper electrode layer located on the intermediate electrode layer and defined by a plated Pd or Pd—Ni alloy layer; and
a thickness of the intermediate electrode layer on the main surfaces and the side surfaces of the ceramic body is larger than a thickness of the intermediate electrode layer on the end surfaces of the ceramic body;

a mounting substrate including a pair of lands electrically connected to the pair of outer electrodes; and
a pair of conductive adhesives bonding the pair of outer electrodes and the pair of lands of the mounting substrate; wherein
the pair of outer electrodes is mounted and fixed on the mounting substrate by the pair of conductive adhesives; and
a distance from a lowermost point of the outer electrodes on a mounting surface of the monolithic ceramic electronic component to a surface of the ceramic body is about 10.1 μm or greater and about 20.1 μm or less.

6. The mounting structure of a monolithic ceramic electronic component according to claim 5 , wherein a ratio of the thickness of the intermediate electrode layer on the main surfaces and the side surfaces of the ceramic body to the thickness of the intermediate electrode layer on the end surfaces of the ceramic body is about 120% or greater and about 300% or less.

7. The mounting structure of a monolithic ceramic electronic component according to claim 5 , wherein the pair of conductive adhesives include resin mixed with a metal filler.

8. The mounting structure of a monolithic ceramic electronic component according to claim 5 , wherein the plurality of ceramic layers are made of one of a dielectric ceramic, a piezoelectric ceramic, a semiconductor ceramic, and a magnetic ceramic.

9. The mounting structure of a monolithic ceramic electronic component according to claim 5 , wherein the monolithic ceramic electronic component is one of a piezoelectric component, a thermistor, and an inductor.

Assignees

• Murata Manufacturing Co

Inventors

• Katsuta Seiji
• Kainuma Yasuaki
• Nagaoka Tatsuya
• Motoki Akihiro
• Kodama Satoshi

Classifications

• H01G4/12 Primary

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01C7/008 Primary

  Thermistors (H01C7/02 - H01C7/06 take precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01F2027/2809

  on stacked layers · CPC title