Polyamide resin composition

US9657159B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9657159-B2
Application numberUS-201514797659-A
CountryUS
Kind codeB2
Filing dateJul 13, 2015
Priority dateMay 17, 2010
Publication dateMay 23, 2017
Grant dateMay 23, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (4) are satisfied: 10≦([COOH]—[NH 2 ])≦80  (1) 0.32≦ P <6.46  (2) 0.50≦ M <17.00  (3) 2≦ M/P ≦3  (4) wherein [COOH] represents a concentration (μeq/g) of a terminal carboxyl group in the polyamide (X); [NH 2 ] represents a concentration (μeq/g) of a terminal amino group in the polyamide (X); P represents a mole concentration (μmol/g) of a phosphorus atom contained per g of the polyamide resin composition; and M represents a sum (μmol/g) of values obtained by multiplying a mole concentration of an alkali metal atom and a mole concentration of an alkaline earth metal atom each contained per g of the polyamide resin composition by valencies thereof respectively.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process for producing a polyamide resin composition comprising: (a) polycondensating a diamine comprising 70 mol % or more of metaxylylenediamine and dicarboxylic acid in the presence of a phosphorus atom-comprising compound (B), to obtain a polyamide (X); and (b) adding an alkali compound (A) which is at least one selected to the polyamide (X) to form the polyamide resin composition, wherein the alkali compound (A) is at least one selected from the group consisting of sodium acetate, sodium acetate trihydrate, sodium carbonate decahydrate, lithium acetate dihydrate, and potassium acetate, wherein the polyamide resin composition, comprises: the polyamide (X) comprising a diamine unit comprising 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit; and the alkali compound (A), wherein the polyamide resin composition produced satisfies equations (1) to (4): 10≦([COOH]—[NH 2 ])≦80  (1) 0.32≦ P< 6.46  (2) 0.50≦ M< 17.00  (3) 2.1≦ M/P≦ 3.0  (4) wherein [COOH] is a concentration (μeq/g) of a terminal carboxyl group in the polyamide (X); [NH 2 ] is a concentration (μeq/g) of a terminal amino group in the polyamide (X); P is a mole concentration (μmol/g) of a phosphorus atom contained per gram of the polyamide resin composition; and M is a sum (μmol/g) of values obtained by multiplying a mole concentration of an alkali metal atom and a mole concentration of an alkaline earth metal atom each contained per gram of the polyamide resin composition by valencies thereof, respectively, for each alkali metal atom and each alkaline earth metal atom present in the polyamide resin composition. 2. The process of claim 1 , wherein, in (a), the polycondensation is carried out in the presence of the phosphorus atom-comprising compound (B) and an alkali metal compound (C) which may be the same or different from alkali compound (A). 3. The process of claim 2 , wherein an amount of the alkali metal compound (C) is in a range of 0.5 to 1 in terms of a value obtained by dividing a mole number of the alkali metal compound (C) by a mole number of the phosphorus atom-comprising compound (B). 4. The process according to claim 2 , wherein the alkali metal compound (C) is at least one selected from the group consisting of alkali metal hydroxides and alkali metal acetic acid salts. 5. The process of claim 1 , wherein the adding (b) comprises: (b1) melting and kneading 90 to 99 parts by mass of the polyamide (X) and 10 to 1 part by mass of the alkali compound (A) with an extrusion equipment to obtain a polyamide master batch (Y); and (b2) melting and kneading 0.1 to 20 parts by mass of the polyamide master batch (Y) and 99.9 to 80 parts by mass of the polyamide (X). 6. The process of claim 5 , wherein, in (b1), 94 to 98 parts by mass of the polyamide (X) and 6 to 2 parts by mass of the alkali compound (A) are molten and kneaded. 7. The process of claim 5 , wherein, in (b2), 1 to 5 parts by mass of the polyamide master batch (Y) and 99 to 95 parts by mass of the polyamide (X) are molten and kneaded. 8. The process according to claim 1 , wherein the alkali compound (A) is sodium acetate. 9. The process according to claim 1 , wherein the phosphorus atom-containing compound (B) is at least one selected from the group consisting of hypophosphorous acid compounds and phosphorous acid compounds. 10. The process according to claim 1 , wherein the alkali compound (A) is sodium acetate trihydrate. 11. The process according to claim 1 , wherein the alkali compound (A) is sodium carbonate decahydrate. 12. The process according to claim 1 , wherein the alkali compound (A) is lithium acetate dihydrate. 13. The process according to claim 1 , wherein the alkali compound (A) is potassium acetate.

Assignees

Inventors

Classifications

  • Preparatory processes · CPC title

  • derived from polyamines and polycarboxylic acids · CPC title

  • C08K5/101Primary

    of monocarboxylic acids · CPC title

  • Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers · CPC title

  • Vapor or gas barrier, polymer derived from vinyl chloride or vinylidene chloride, or polymer containing a vinyl alcohol unit is sandwiched between layers [continuous layer] · CPC title

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What does patent US9657159B2 cover?
The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (4) are satisfied: 10≦([COOH]—[NH 2 ])≦80  (1) 0.32≦ P <6.46  (2) 0.50≦ M <17.00  (3) 2≦ M/P ≦3  (4) wherein [COOH] rep…
Who is the assignee on this patent?
Mitsubishi Gas Chemical Co
What technology area does this patent fall under?
Primary CPC classification C08K5/101. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).