Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
US-9516741-B2 · Dec 6, 2016 · US
US9656868B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9656868-B2 |
| Application number | US-201414773264-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 7, 2014 |
| Priority date | Mar 7, 2013 |
| Publication date | May 23, 2017 |
| Grant date | May 23, 2017 |
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Provided is a boron-nitride powder that is suitable for use in a resin composition for transmitting heat from a heat-producing electronic component such as a power device to a heat-dissipating member. The boron-nitride powder reduces thermal-conductivity anisotropy and thermal contact resistance, resulting in high thermal conductivity, and contains boron-nitride particles each consisting of hexagonal boron-nitride primary particles joined together. The boron-nitride powder, which is an aggregate of said boron-nitride particles, exhibits a mean sphericity of at least 0.70, a mean particle diameter of 20-100 μm, a porosity of 50-80%, a mean pore diameter of 0.10-2.0 μm, a maximum pore diameter of at most 10 μm, and a calcium content of 500-5,000 ppm. Under X-ray powder diffraction, the graphitization index of the boron-nitride powder is preferably between 1.6 and 4.0, inclusive, and the peak intensity ratio (I(002)/I(100)) between the (002) plane and the (100) plane is preferably at most 9.0.
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The invention claimed is: 1. A boron-nitride powder, containing boron-nitride particles each composed of hexagonal boron-nitride primary particles joined together, which is an aggregate of the boron-nitride particles, wherein the boron-nitride powder has a mean sphericity of 0.70 or more, a mean particle diameter of 20 to 100 μm, a porosity of 50 to 80%, a mean pore diameter of 0.10 to 2.0 μm, a maximum pore diameter of 10 μm or less, and a calcium content of 500 to 5,000 ppm. 2. The boron-nitride powder according to claim 1 , wherein a graphitization index measured by powder X-ray diffraction method is 1.6 to 4.0, and a peak intensity ratio I(002)/I(100) of (002) plane to (100) plane is 9.0 or less. 3. The boron-nitride powder according to claim 1 , wherein amorphous boron-nitride having a mean particle diameter of 2 to 6 μm and the hexagonal boron-nitride having a mean particle diameter of 8 to 16 μm are used as raw materials, and a mixing ratio thereof, that is, the ratio of the amorphous boron-nitride to the hexagonal boron-nitride is 60:40 to 90:10 on a mass basis. 4. A resin composition characterized by containing a resin and the boron-nitride powder according to claim 1 . 5. The resin composition according to claim 4 , wherein an elastic modulus of the boron-nitride particles is 5 to 35 MPa, and the boron-nitride particles are in surface contact with each other. 6. A resin composition containing a resin and the boron-nitride powder according to claim 2 . 7. A resin composition containing a resin and the boron-nitride powder according to claim 3 . 8. The resin composition according to claim 6 , wherein an elastic modulus of the boron-nitride particles is 5 to 35 MPa, and the boron-nitride particles are in surface contact with each other. 9. The resin composition according to claim 7 , wherein an elastic modulus of the boron-nitride particles is 5 to 35 MPa, and the boron-nitride particles are in surface contact with each other.
obtained by SEM · CPC title
Micrometer sized, i.e. from 1-100 micrometer · CPC title
Compositions of unspecified macromolecular compounds · CPC title
Binary compounds of nitrogen with boron · CPC title
Thermal properties · CPC title
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