Boron-nitride powder and resin composition containing same

US9656868B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9656868-B2
Application numberUS-201414773264-A
CountryUS
Kind codeB2
Filing dateMar 7, 2014
Priority dateMar 7, 2013
Publication dateMay 23, 2017
Grant dateMay 23, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Provided is a boron-nitride powder that is suitable for use in a resin composition for transmitting heat from a heat-producing electronic component such as a power device to a heat-dissipating member. The boron-nitride powder reduces thermal-conductivity anisotropy and thermal contact resistance, resulting in high thermal conductivity, and contains boron-nitride particles each consisting of hexagonal boron-nitride primary particles joined together. The boron-nitride powder, which is an aggregate of said boron-nitride particles, exhibits a mean sphericity of at least 0.70, a mean particle diameter of 20-100 μm, a porosity of 50-80%, a mean pore diameter of 0.10-2.0 μm, a maximum pore diameter of at most 10 μm, and a calcium content of 500-5,000 ppm. Under X-ray powder diffraction, the graphitization index of the boron-nitride powder is preferably between 1.6 and 4.0, inclusive, and the peak intensity ratio (I(002)/I(100)) between the (002) plane and the (100) plane is preferably at most 9.0.

First claim

Opening claim text (preview).

The invention claimed is: 1. A boron-nitride powder, containing boron-nitride particles each composed of hexagonal boron-nitride primary particles joined together, which is an aggregate of the boron-nitride particles, wherein the boron-nitride powder has a mean sphericity of 0.70 or more, a mean particle diameter of 20 to 100 μm, a porosity of 50 to 80%, a mean pore diameter of 0.10 to 2.0 μm, a maximum pore diameter of 10 μm or less, and a calcium content of 500 to 5,000 ppm. 2. The boron-nitride powder according to claim 1 , wherein a graphitization index measured by powder X-ray diffraction method is 1.6 to 4.0, and a peak intensity ratio I(002)/I(100) of (002) plane to (100) plane is 9.0 or less. 3. The boron-nitride powder according to claim 1 , wherein amorphous boron-nitride having a mean particle diameter of 2 to 6 μm and the hexagonal boron-nitride having a mean particle diameter of 8 to 16 μm are used as raw materials, and a mixing ratio thereof, that is, the ratio of the amorphous boron-nitride to the hexagonal boron-nitride is 60:40 to 90:10 on a mass basis. 4. A resin composition characterized by containing a resin and the boron-nitride powder according to claim 1 . 5. The resin composition according to claim 4 , wherein an elastic modulus of the boron-nitride particles is 5 to 35 MPa, and the boron-nitride particles are in surface contact with each other. 6. A resin composition containing a resin and the boron-nitride powder according to claim 2 . 7. A resin composition containing a resin and the boron-nitride powder according to claim 3 . 8. The resin composition according to claim 6 , wherein an elastic modulus of the boron-nitride particles is 5 to 35 MPa, and the boron-nitride particles are in surface contact with each other. 9. The resin composition according to claim 7 , wherein an elastic modulus of the boron-nitride particles is 5 to 35 MPa, and the boron-nitride particles are in surface contact with each other.

Assignees

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Classifications

  • obtained by SEM · CPC title

  • Micrometer sized, i.e. from 1-100 micrometer · CPC title

  • Compositions of unspecified macromolecular compounds · CPC title

  • Binary compounds of nitrogen with boron · CPC title

  • Thermal properties · CPC title

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What does patent US9656868B2 cover?
Provided is a boron-nitride powder that is suitable for use in a resin composition for transmitting heat from a heat-producing electronic component such as a power device to a heat-dissipating member. The boron-nitride powder reduces thermal-conductivity anisotropy and thermal contact resistance, resulting in high thermal conductivity, and contains boron-nitride particles each consisting of hex…
Who is the assignee on this patent?
Denki Kagaku Kogyo Kk, Denka Company Ltd
What technology area does this patent fall under?
Primary CPC classification C01B21/064. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).