Modular cooling system

Patent metadata

Field	Value
Publication number	US-9655281-B2
Application number	US-201514751488-A
Country	US
Kind code	B2
Filing date	Jun 26, 2015
Priority date	Jun 26, 2015
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate.

First claim

That which is claimed is:

1. A cooling system comprising:
a first cold plate, the first cold plate comprising:
a first connector rib,
a first connector groove,
a first vertical stop surface, and
a first horizontal stop surface;

a second cold plate, the second cold plate comprising:
a second connector rib engaging the first connector groove,
a second connector groove engaging the first connector rib,
a second vertical stop surface, and
a second horizontal stop surface;

a support manifold connected to the first cold plate, the support manifold and the first cold plate together defining a fluid path for cooling fluid from the support manifold to the first cold plate; and
an equipment carrier including electrical equipment cooled by at least one of the first cold plate or the second cold plate; the first horizontal stop surface engaging the second horizontal stop surface and the first vertical stop surface disengaging from the second vertical stop surface in a neutral position, and the first vertical stop surface engaging the second vertical stop surface and the first horizontal stop surface disengaging from the second horizontal stop surface in a disengaged position.

2. The cooling system of claim 1 , further comprising a modular carrier, wherein the first cold plate, second cold plate, equipment carrier, and support manifold are mounted within the modular carrier.

3. The cooling system of claim 1 , wherein
at least one of the first cold plate and the second cold plate defines a retainer pocket; and
the support manifold comprises a plate retainer, wherein the plate retainer is removably connected to the retainer pocket.

4. The cooling system of claim 3 , wherein the support manifold further comprises a first channel and a second channel, wherein the first channel is a coolant supply channel and the second channel is a coolant return channel, and wherein the support manifold provides mechanical support for the electrical equipment.

5. The cooling system of claim 1 , further comprising a first bus bar in a first channel of the support manifold, a second bus bar in a second channel of the support manifold, and a power module housed in one of the first cold plate and the second cold plate, wherein the power module is in electrical communication with the first bus bar and the second bus bar.

6. The cooling system of claim 1 , wherein at least a one of the first cold plate and the second cold plate includes a plate connector and the support manifold includes a manifold connector engageable with the plate connector, and wherein the electrical equipment is selected from the group consisting of storage devices, central processing units, networking devices, communication devices, and video processors.

7. A fluid connection system comprising:
a connector;
a sliding arm attached to the connector; and
a cam adapted to move the sliding arm; the sliding arm, connector, and cam configured for use in an electronic equipment rack.

8. The fluid connection system of claim 7 , wherein the cam defines a claw portion and a hump portion, wherein the hump portion is engageable with a sliding pin connected to the sliding arm.

9. The fluid connection system of claim 8 , wherein the sliding pin is movable by the hump portion, wherein the fluid connection system defines:
a disengaged and unmated position when the hump portion and sliding pin are disengaged,
a disengaged and mated position when the hump portion and sliding pin are in contact and the sliding pin is unmoved, and
an engaged and mated position when the hump portion and sliding pin are in contact and the sliding pin is moved by the hump portion.

10. The fluid connection system of claim 7 , further comprising a pivot pin.

11. The fluid connection system of claim 7 , wherein the connector comprises an inner sleeve and an outer sleeve, the connector further comprising a sliding slot defined in the outer sleeve, wherein the sliding arm is movable in the sliding slot.

Assignees

• Seagate Technology Llc

Inventors

• Harvilchuck Laurence A
• Worrall Alex Carl

Classifications

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• F28F9/0275

  with multiple branch pipes · CPC title

• F28F9/0075

  Supports for plates or plate assemblies · CPC title

• H05K7/20627 Primary

  Liquid coolant without phase change · CPC title

• F16L37/18 Primary

  Joints tightened by eccentrics or rotatable cams · CPC title