Power conversion device

Patent metadata

Field	Value
Publication number	US-10440864-B2
Application number	US-201715624793-A
Country	US
Kind code	B2
Filing date	Jun 16, 2017
Priority date	Nov 4, 2016
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.

First claim

What is claimed is:

1. A power conversion device, comprising:
a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element;
a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, the first passage having a first aperture; and
a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which the cooling medium is caused to pass, the second passage forming a second aperture facing the first aperture,
wherein the first passage and the second passage are connected at an interface between the heatsink and the frame body, thereby configuring a cooling passage formed of the first passage and the second passage that are provided to form a series,
the second passage is formed in a U-form,
the second aperture comprises a first aperture portion and a second aperture portion that are opened in the interface,
the cooling medium is introduced into the second passage from the first aperture portion and is ejected from the second aperture portion,
the first passage comprises two passages provided in the heatsink and connected to the first aperture portion and the second aperture portion, respectively, and
both end portions of the cooling passage are provided in the heatsink.

2. The power conversion device according to claim 1 , wherein the cooling passage formed of the first passage and the second passage and has a structure divided partway along.

3. The power conversion device according to claim 2 , wherein the cooling passage is of a structure converged in the heatsink or the frame body.

4. The power conversion device according to claim 1 , wherein the heatsink includes a fin that protrudes into the first passage from a wall surface portion of the first passage on a side on which the power conversion circuit unit is mounted.

5. The power conversion device according to claim 1 , wherein the cooling medium is a liquid.

6. A power conversion device comprising:
a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element;
a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, the first passage having a first aperture; and
a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which the cooling medium is caused to pass, the second passage forming a second aperture facing the first aperture,
wherein the first passage and the second passage are connected at an interface between the heatsink and the frame body, thereby configuring a cooling passage formed of the first passage and the second passage that are provided to form a series,
the first passage is formed in a U-form,
the first aperture comprises a first aperture portion and a second aperture portion that are opened in the interface,
the cooling medium is introduced from the first aperture portion and ejected from the second aperture portion,
the second passage comprises two passages provided in the frame body and connected to the first aperture portion and the second aperture portion, respectively, and
both end portions of the cooling passage are provided in the frame body.

7. The power conversion device according to claim 6 , wherein the cooling passage formed of the first passage and the second passage and has a structure divided partway along.

8. The power conversion device according to claim 7 , wherein the cooling passage is of a structure converged in the heatsink or the frame body.

9. The power conversion device according to claim 6 , wherein the heatsink includes a fin that protrudes into the first passage from a wall surface portion of the first passage on a side on which the power conversion circuit unit is mounted.

10. The power conversion device according to claim 6 , wherein the cooling medium is a liquid.

11. A power conversion device comprising:
a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element;
a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass; and
a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which the cooling medium is caused to pass,
wherein the first passage and the second passage are connected at an interface between the heatsink and the frame body, thereby configuring a cooling passage,
the power conversion circuit unit is sealed between the heatsink and the frame body across a first packing,
the first passage and the second passage are connected at the interface between the heatsink and the frame body across a second packing, and
the first packing and the second packing are integral with each other.

12. The power conversion device according to claim 11 , wherein the cooling passage formed of the first passage and the second passage and has a structure divided partway along.

13. The power conversion device according to claim 12 , wherein the cooling passage is of a structure converged in the heatsink or the frame body.

14. The power conversion device according to claim 11 , wherein the heatsink includes a fin that protrudes into the first passage from a wall surface portion of the first passage on a side on which the power conversion circuit unit is mounted.

15. The power conversion device according to claim 11 , wherein the cooling medium is a liquid.

Assignees

• Mitsubishi Electric Corp

Inventors

• Hayashi Ryohei
• Furuya Goki
• Ando Kohei

Classifications

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20863

  Forced ventilation, e.g. on heat dissipaters coupled to components · CPC title

• H05K7/20763

  Liquid cooling without phase change · CPC title

• H05K7/20218

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title