Method and system for graphene formation
US-2015368111-A1 · Dec 24, 2015 · US
US9653291B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9653291-B2 |
| Application number | US-201414540104-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 13, 2014 |
| Priority date | Nov 13, 2014 |
| Publication date | May 16, 2017 |
| Grant date | May 16, 2017 |
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Native oxides and residue are removed from surfaces of a substrate by performing a multiple-stage native oxide cleaning process. In one example, the method for removing native oxides from a substrate includes supplying a first gas mixture including an inert gas onto a surface of a material layer disposed on a substrate into a first processing chamber, wherein the material layer is a III-V group containing layer for a first period of time, supplying a second gas mixture including an inert gas and a hydrogen containing gas onto the surface of the material layer for a second period of time, and supplying a third gas mixture including a hydrogen containing gas to the surface of the material layer while maintaining the substrate at a temperature less than 550 degrees Celsius.
Opening claim text (preview).
We claim: 1. A method for removing native oxides from a material layer disposed on a substrate, comprising: supplying an inert gas to a surface of a material layer disposed on a substrate to alter bonding structures of native oxide on the surface of the material layer for a first period of time at a first temperature, wherein the material layer is a III-V group containing layer; supplying a H 2 gas and an inert gas to remove the native oxide from the material layer for a second period of time at a second temperature; and supplying a H 2 gas to remove residual oxide from the material layer for a third period of time while maintaining the substrate at a third temperature, wherein the third temperature is higher than the first and the second temperature. 2. The method for claim 1 , further comprising: forming a III-V group material on the material layer while maintaining the substrate at the third temperature.
mainly by radiation · CPC title
during, before or after processing of insulating materials · CPC title
by dry cleaning only (H10P70/52 takes precedence) · CPC title
being group IIIA-VIA materials · CPC title
being Group IIIA-VA semiconductors · CPC title
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