Primer for electroless plating comprising hyperbranched polymer and metal fine particles

Patent metadata

Field	Value
Publication number	US-9650534-B2
Application number	US-201214111396-A
Country	US
Kind code	B2
Filing date	Apr 11, 2012
Priority date	Apr 12, 2011
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

There is provided a novel, environmentally friendly primer for use in the pretreatment steps in electroless plating, which can be easily used in fewer steps with a lower cost. A primer for forming a metallic plating film on a substrate by electroless plating, the primer including: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; and a metal fine particle.

First claim

The invention claimed is:

1. A primer for forming a metallic plating film on a substrate by electroless plating, the primer comprising: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; and a metal fine particle, wherein the hyperbranched polymer is contained in an amount of 50 to 2,000 parts by mass relative to 100 parts by mass of the metal fine particles, wherein the hyperbranched polymer is a hyperbranched polymer of Formula [1]:

where R 1 are each independently a hydrogen atom or a methyl group; R 2 , R 3 , and R 4 are each independently a hydrogen atom, a linear, branched, or cyclic alkyl group having a carbon atom number of 1 to 20, a C 7-20 arylalkyl group, or —(CH 2 CH 2 O) m R 5 , where R 5 is a hydrogen atom or a methyl group; and m is an integer of 2 to 100, where the alkyl group and the arylalkyl group are optionally substituted with an alkoxy group, a hydroxy group, an ammonium group, a carboxy group, or a cyano group, or two groups of R 2 , R 3 , and R 4 together represent a linear, branched or cyclic alkylene group, or R 2 , R 3 , and R 4 together with a nitrogen atom to which R 2 , R 3 , and R 4 are attached optionally from a ring; X − is an anion; n is the number of repeating unit structures and an integer of 2 to 100,000; and A 1 is a structure of Formula [2]:

where A 2 is a linear, branched, or cyclic alkylene group having a carbon atom number of 1 to 30 optionally containing an ether bond or an ester bond; and Y 1 , Y 2 , Y 3 , and Y 4 are each independently a hydrogen atom, a C 1-20 alkyl group, a C 1-20 alkoxy group, a nitro group, a hydroxy group, an amino group, a carboxy group, or a cyano group.

2. The primer according to claim 1 , wherein the ammonium group of the hyperbranched polymer is attached to the metal fine particle to form a complex.

3. The primer according to claim 1 , wherein the hyperbranched polymer is a hyperbranched polymer of Formula [3]:

where R 1 , R 2 , and n have the same meanings according to claim 1 .

4. The primer according to claim 1 , wherein the metal fine particle is a fine particle of at least one selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), tin (Sn), platinum (Pt), and gold (Au).

5. The primer according to claim 4 , wherein the metal fine particle is a palladium fine particle.

6. The primer according to claim 4 , wherein the metal fine particle has an average particle diameter of 1 to 100 nm.

7. A priming layer for electroless plating, obtained by forming a layer of the primer as claimed in claim 1 .

8. A metallic plating film, formed by performing electroless plating on the priming layer for electroless plating as claimed in claim 7 , on the priming layer.

9. A metal-coated substrate comprising:
a substrate;
the priming layer for electroless plating as claimed in claim 7 formed on the substrate; and
a metallic plating film formed on and by performing electroless plating on the priming layer for electroless plating.

10. The metal-coated substrate according to claim 7 , wherein the substrate is a nonconducting substrate.

11. The metal-coated substrate according to claim 7 , wherein the substrate is a conducting substrate.

12. A method for forming a metal-coated substrate, the method comprising:
a step A: coating a substrate with the primer as claimed in claim 1 to form a priming layer; and
a step B: immersing the substrate having the priming layer in an electroless plating bath to form a metallic plating film.

13. The method according to claim 12 , wherein the substrate is a nonconducting substrate.

14. The method according to claim 12 , wherein the substrate is a conducting substrate.

15. The primer according to claim 1 , wherein the hyperbranched polymer is contained in an amount of 100 to 1,000 parts by mass relative to 100 parts by mass of the metal fine particles.

16. The primer according to claim 1 , wherein the hyperbranched polymer has a weight-average molecular weight of 1,000 to 1,000,000.

17. The primer according to claim 1 , wherein the hyperbranched polymer has a weight-average molecular weight of 2,000 to 500,000.

18. The primer according to claim 1 , wherein the hyperbranched polymer has a weight-average molecular weight of 3,000 to 200,000.

Assignees

• Kojima Keisuke
• Nissan Chemical Ind Ltd

Inventors

• Kojima Keisuke

Classifications

• C08J7/0427

  with only one layer of a composition containing a polymer binder (with more layers C08J7/042) · CPC title

• Y10T428/12063

  Nonparticulate metal component · CPC title

• C09D125/06 Primary

  Polystyrene · CPC title

• C08J2367/02

  Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title

• C08L101/005

  Dendritic macromolecules · CPC title