Adhesive bonding composition and method of use

Patent metadata

Field	Value
Publication number	US-9649832-B2
Application number	US-201514593049-A
Country	US
Kind code	B2
Filing date	Jan 9, 2015
Priority date	May 6, 2010
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

First claim

The invention claimed is:

1. A method of adhesive bonding comprising:
a) placing a curable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with at least two components to be bonded to form an assembly, wherein the at least two components can be formed of the same material or different materials; and,
b) irradiating said assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material to a second wavelength capable of activating said at least one photoinitiator, thereby activating the at least one photoinitiator and curing the curable adhesive composition to bond the at least two components together.

2. A method of bonding unlike substrates to one another, comprising:
providing a first substrate and a second substrate, wherein the first substrate comprises a different material than the second substrate;
applying a curable adhesive composition to a surface of at least the first substrate, wherein the curable adhesive composition comprises an organic vehicle comprising at least one polymerizable monomer; at least one photo-initiator responsive to a selected wavelength of light; and at least one energy converting material selected to emit said wavelength of light when exposed to a selected imparted radiation;
contacting the surface of the first substrate bearing the curable adhesive composition with a surface of the second substrate; and
curing the curable adhesive composition by application of the imparted radiation.

3. A method of adhesive bonding of living tissue comprising:
a) placing a curable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with at least two portions of living tissue to be bonded; and,
b) irradiating said assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material to a second wavelength capable of activating said at least one photoinitiator, thereby activating the at least one photoinitiator and curing the curable adhesive composition to bond the at least two portions of living tissue together.

4. The method of claim 1 , wherein said at least one energy converting material is an upconverting material.

5. The method of claim 4 , wherein said first wavelength of radiation is near infrared.

6. The method of claim 1 , wherein said at least one energy converting material is a downconverting material.

7. The method of claim 6 , wherein said first wavelength of radiation is X-rays.

8. The method of claim 1 , wherein said organic vehicle comprises a monomer forming a thermoset resin.

9. The method of claim 8 , wherein said thermoset resin is selected from the group consisting of: acrylics, phenolics, urethanes, epoxies, styrenes, and silicones.

10. The method of claim 1 , wherein said at least one photo initiator is selected from the group consisting of: benzoin ethers, benzil ketals, α-dialkoxyacetophenones, α-aminoalkylphenones, acylphosphine oxides, benzophenones/amines, thioxanthones/amines, and titanocenes.

11. The method of claim 6 , wherein said first wavelength of radiation comprises X-rays and said second wavelength comprises light in the range from deep UV to IR.

12. The method of claim 6 , wherein said downconverting material comprises dispersed inorganic particulates selected from the group consisting of: metal oxides; metal sulfides; doped metal oxides; and mixed metal chalcogenides.

13. The method of claim 1 , said curable adhesive composition is dispensed through an automated dispenser onto a selected substrate.

14. The method of claim 1 , wherein said curable adhesive composition is printed onto a selected substrate through a mask.

15. The method of claim 1 , further comprising:
a2) photo-patterning said curable adhesive composition after application to one of said at least two components to be bonded but before irradiating with radiation at said first wavelength.

16. The method of claim 1 , wherein said curable adhesive composition further comprises inorganic particulates selected from the group consisting of: metals and metal alloys, ceramics and dielectrics, and metal-coated polymers.

17. The method of claim 1 , wherein said curable adhesive composition further comprises an organic component selected from the group consisting of: solvents, viscosity modifiers, surfactants, dispersants, and plasticizers.

18. The method of claim 1 , wherein said curable adhesive composition further comprises a sheet containing a monolayer of conductive particles of a suitable size to render the resulting adhesive bond anisotropically conductive.

19. The method of claim 2 , wherein said at least one energy converting material is an up converting material.

20. The method of claim 19 , wherein said imparted radiation is near infrared.

21. The method of claim 2 , wherein said at least one energy converting material is a downconverting material.

22. The method of claim 21 , wherein said imparted radiation is ionizing radiation.

23. The method of claim 22 , wherein said ionizing radiation is X-rays.

24. The method of claim 2 , wherein the first substrate has a coefficient of thermal expansion, CTE 1 , and the second substrate has a coefficient of thermal expansion, CTE 2 , wherein CTE 1 ≠CCTE 2 .

25. The method of claim 24 , wherein one of the first and second substrates comprises a metal and the other comprises a thermoplastic.

26. The method of claim 24 , wherein one of the first and second substrates comprises a silicon wafer and the other comprises a metal.

27. The method of claim 24 , wherein one of the first and second substrates comprises a metal and the other comprises a polymer composite.

28. The method of claim 3 , wherein said at least one energy converting material is an upconverting material.

29. The method of claim 28 , wherein said first wavelength of radiation is near infrared.

30. The method of claim 3 , wherein said at least one energy converting material is a downconverting material.

31. The method of claim 30 , wherein said first wavelength of radiation is an ionizing radiation.

32. The method of claim 31 , wherein said ionizing radiation is X-rays.

33. The method of claim 3 , wherein the at least two portions of living tissue are two edges of a wound.

Assignees

• Immunolight Llc
• Univ Duke

Inventors

• Fathi Zakaryae
• Clayton James
• Walder Harold
• Bourke Jr Frederic A
• Stanton Ian
• Ayres Jennifer
• Stecher Joshua T
• Therien Michael
• Toone Eric
• Gooden Dave
• Dewhirst Mark
• Herbert Joseph A
• Fels Diane
• Hansen Katherine S

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/20

  Configurations of stacked chips · CPC title