Flexible substrate with integrated circuit

Patent metadata

Field	Value
Publication number	US-9162469-B2
Application number	US-201214375856-A
Country	US
Kind code	B2
Filing date	Apr 30, 2012
Priority date	Apr 30, 2012
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.

First claim

What is claimed is:

1. A flexible circuit for a fluid cartridge, comprising
a flexible substrate including first conductor lines and second conductor lines,
a first integrated circuit connected to the flexible substrate, and
an electrical connector pad array arranged on the flexible substrate, the electrical connector pad array to provide for connection to a host controller, and comprising first electrical connector pads and second electrical connector pads,
the first conductor lines each having a first end connected to one of the first electrical connector pads and a second end connected to the first integrated circuit, and
the second conductor lines each having a first end connected to one of the second electrical connector pads and a second end for connection to a fluid dispensing die.

2. The flexible circuit of claim 1 wherein the first integrated circuit is a secure microcontroller.

3. The flexible circuit of claim 1 wherein at least a portion of the first and the second electrical connector pads are arranged on one straight line.

4. The flexible circuit of claim 1 wherein
the first integrated circuit is arranged laterally of the electrical connector pad array between the electrical connector pad array and a side edge of the flexible substrate.

5. The flexible circuit of claim 1 wherein the electrical connector pad array comprises at least one electrical connector pad to be connected only to the first integrated circuit, at least one electrical connector pad to be connected only to the fluid dispensing die, and at least one electrical connector pad to be connected to both the first integrated circuit and the fluid dispensing die.

6. The flexible circuit of claim 1 wherein an axis of symmetry of the electrical connector pad array is arranged parallel to and at a distance from a longitudinal centerline of the flexible substrate.

7. The flexible circuit of claim 6 wherein
the electrical connector pad array is offset from the longitudinal centerline of the flexible substrate in a first direction, and
the first integrated circuit is offset from the longitudinal centerline of the flexible substrate in a second direction opposite the first direction.

8. The flexible circuit of claim 1 wherein
the flexible substrate comprises at least one first window and at least one second window,
the first integrated circuit is aligned with the first window and connected to the flexible substrate near edges of the first window, and
the fluid dispensing die is to be aligned with the second window and connected to the flexible substrate near edges of the second window.

9. A fluid cartridge, comprising
a fluid reservoir,
a fluid dispensing die communicated with the fluid reservoir,
a flexible circuit including a first integrated circuit, an electrical connector pad array, first conductor lines connected to the first integrated circuit and first electrical connector pads of the electrical connector pad array, and second conductor lines connected to the fluid dispensing die and second electrical connector pads of the electrical connector pad array, and
a second integrated circuit distanced from the first integrated circuit, connected to the fluid dispensing die, and connected to at least one of the second electrical connector pads of the electrical connector pad array, the second integrated circuit to signal actuators of the fluid dispensing die.

10. A method of manufacturing a flexible circuit for a fluid dispensing cartridge, comprising
providing an array of first and second electrical connector pads on a flexible substrate,
connecting a first integrated circuit to the flexible substrate,
connecting a fluid dispensing die to the flexible substrate, and
connecting first ends of first conductor lines of the flexible substrate to the first integrated circuit and connecting second ends of the first conductor lines to the first electrical connector pads and connecting first ends of second conductor lines of the flexible substrate to the fluid dispensing die and connecting second ends of the second conductor lines to the second electrical connector pads.

11. The method of claim 10 , the flexible substrate comprising
at least one window for the fluid dispensing die,
at least one window for the first integrated circuit, and
the method comprising
positioning the fluid dispensing die and the first integrated circuit with respect to the corresponding windows, and
bonding the first integrated circuit and the fluid dispensing die to the corresponding conductor lines.

12. The method of claim 10 comprising encapsulating the electrical connector pads and the first integrated circuit with the same material using the same encapsulation tool.

13. The method of claim 10 wherein the first electrical connector pads and the second electrical connector pads are intermixed within the array.

14. The method of claim 10 comprising
writing a cartridge ID on a second integrated circuit connected to the fluid dispensing die, and
writing an authentication code corresponding to the cartridge ID on the first integrated circuit.

15. A fluid dispensing cartridge comprising
a flexible substrate,
a first integrated circuit connected to the flexible substrate,
a fluid dispensing die connected to the flexible substrate, and
an electrical connector pad array arranged on the flexible substrate, the electrical connector pad array to provide for connection to a host controller, and comprising first electrical connector pads connected to the first integrated circuit by first conductor lines each having one end connected to one of the first electrical connector pads and another end connected to the first integrated circuit and second electrical connector pads connected to the fluid dispensing die by second conductor lines each having one end connected to one of the second electrical connector pads and another end connected to the fluid dispensing die.

16. The fluid dispensing cartridge of claim 15 , wherein
the flexible substrate has a longitudinal centerline,
the electrical connector pad array has an axis of symmetry offset from the longitudinal centerline in a first direction, and
the first integrated circuit is positioned laterally of the electrical connector pad array and offset from the longitudinal centerline in a second direction opposite the first direction.

17. The fluid cartridge of claim 9 , the flexible circuit comprising
a flexible substrate having at least one window for the fluid dispensing die, and at least one window for the first integrated circuit.

18. The fluid cartridge of claim 17 , wherein the fluid dispensing die and the first integrated circuit are provided on a same side of the flexible substrate.

19. The fluid cartridge of claim 9 , wherein the electrical connector pad array is to provide connection to a host device.

20. The fluid cartridge of claim 19 , comprising
a cartridge ID stored on the second integrated circuit, and
an authentication code, that corresponds to the cartridge ID, stored on the first integrated circuit, the cartridge ID and the authentication code to be matched by the host device.

Assignees

• Campbell-Brown Iain
• Walsh Mark
• Oliver John
• Ward Jefferson P
• Shipman Amy
• Hewlett Packard Development Co

Inventors

• Campbell-Brown Iain
• Walsh Mark
• Oliver John
• Ward Jefferson P
• Shipman Amy

Classifications

• B41J2/17559

  Cartridge manufacturing · CPC title

• B41J2/1753

  Details of contacts on the cartridge, e.g. protection of contacts · CPC title

• B41J2/17546 Primary

  electronically · CPC title