Processing apparatus including laser beam applying mechanism and separating means

Patent metadata

Field	Value
Publication number	US-9649723-B2
Application number	US-201414444465-A
Country	US
Kind code	B2
Filing date	Jul 28, 2014
Priority date	Aug 1, 2013
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A processing apparatus including a chuck table having a holding surface for rotatably holding a workpiece, a laser beam applying mechanism having a laser beam generating unit for generating a laser beam and focusing the laser beam to the inside of the workpiece held on the chuck table, a relatively moving unit for relatively moving the chuck table and the laser beam applying mechanism in a direction parallel to the holding surface of the chuck table while applying the laser beam to the workpiece to thereby form a modified layer inside of the workpiece, a separating unit for separating a part of the workpiece along the modified layer as a boundary formed inside the workpiece, and a grinding/polishing unit having a grinding/polishing wheel for grinding or polishing the modified layer left on the workpiece after separating the part and a spindle for rotatably mounting the grinding/polishing wheel.

First claim

What is claimed is:

1. A processing apparatus comprising:
holding means having a holding surface for rotatably holding an ingot;
a holding table for selectively positioning said holding means to a laser processing position corresponding to said laser beam applying mechanism and an abrading position corresponding to said abrading means;
a laser beam applying mechanism having laser beam generating means for generating a laser beam and focusing means for focusing said laser beam generated by said laser beam generating means to the inside of said ingot held by said holding means;
relatively moving means for relatively moving said holding means and said laser beam applying mechanism in a direction parallel to said holding surface of said holding means while applying the laser beam to said ingot to thereby form a modified layer inside of said ingot;
separating means for separating a part of said ingot along said modified layer as a boundary formed inside said ingot; and
abrading means having an abrasive wheel for abrading said modified layer left on said ingot after separating said part and a spindle for rotatably mounting said abrading wheel.

Assignees

• Disco Corp

Inventors

• Umeda Yoshio
• Kobayashi Satoshi
• Yubira Yasuyoshi

Classifications

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B23K2203/50

  Operations & Transport · mapped topic

• H01L21/67115

  Electricity · mapped topic