Wiring board and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9648794-B2
Application number	US-201313855073-A
Country	US
Kind code	B2
Filing date	Apr 2, 2013
Priority date	Apr 5, 2012
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

The present disclosure provides a wiring board including a thin film member configured to include an inorganic dielectric film formed over an overall area of a mounting face thereof for an electronic part, a first conductive film formed over an overall area of one of faces of the inorganic dielectric film and including a plurality of patch electrode portions disposed in a predetermined pattern corresponding to a predetermined electromagnetic band gap structure in at least part of the area, and a second conductive film formed over an overall area of the other face of the inorganic dielectric film.

First claim

What is claimed is:

1. A wiring board, comprising:
first and second wiring layers;
first and second interlayer insulating layers between the first and second wiring layers; and
a thin film member between the first and second wiring layers, the thin film member including (a) an inorganic dielectric film extending all over an area of a mounting face thereof for an electronic part, (b) a first conductive film directly on and extending all over a first face of the inorganic dielectric film and configured of a plurality of patch electrode portions disposed in a predetermined pattern corresponding to a predetermined electromagnetic band gap structure on at least part of the first face, and (c) a second conductive film directly on extending all over a second face of the inorganic dielectric film,
wherein the first conductive film includes the plurality of patch electrode portions formed in part of the area of the mounting face for the electronic part, and a plane electrode portion formed in the remaining area of the mounting face for the electronic part,
wherein the plane electrode portion is not electrically connected to the plurality of patch electrode portions.

2. The wiring board according to claim 1 , wherein the first conductive film has the plurality of patch electrode portions and a branch electrode portion configured to electrically connect each two adjacent ones of the plurality of patch electrode portions to each other.

3. The wiring board according to claim 2 , wherein the electromagnetic band gap structure is formed over the overall area of the mounting face for the electronic part.

4. The wiring board according to claim 1 , wherein the plurality of patch electrode portions are disposed along a peripheral side end portion of the thin film member.

5. The wiring board according to claim 2 , wherein the first conductive film has an electrode pattern portion formed in a predetermined region of the first conductive film and configuring a decoupling capacitor, and the electrode pattern portion is electrically connected to a patch electrode portion of the plurality of patch electrode portions.

6. The wiring board according to claim 1 , wherein the inorganic dielectric film is formed from a material selected from a group of barium titanate, barium strontium titanate, strontium titanate and lead zirconate titanate.

7. The wiring board according to claim 1 , wherein one of the first conductive film and the second conductive film is connected to a power supply, and the other of the first and second conductive films is connected to the ground.

8. The wiring board according to claim 1 , further comprising:
a via electrode portion configured to be provided for each of the plurality of patch electrode portions; and
a plane electrode film provided on the via electrode portion and formed over the overall area of the mounting face for the electronic part,
wherein,
the via electrode portion is connected at one end thereof to a corresponding one of the plurality of patch electrode portions and at the other end thereof to the plane electrode film.

9. The wiring board according to claim 1 , wherein the wiring board is an interposer board.

10. An electronic apparatus, comprising:
a wiring board including (a) first and second wiring layers, (b) first and second interlayer insulating layers between the first and second wiring layers, and (c) a thin film member between the first and second interlayer insulating layers, the thin film member including (1) an inorganic dielectric film directly on and extending all over an area of a mounting face thereof for an electronic part, (2) a first conductive film directly on and extending all over a first face of the inorganic dielectric film and configured of a plurality of patch electrode portions disposed in a predetermined pattern corresponding to a predetermined electromagnetic band gap structure on at least part of the first face, and (3) a second conductive film extending all over a second face of the inorganic dielectric film; and
the electronic part mounted on the wiring board,
wherein the first conductive film includes the plurality of patch electrode portions formed in part of the area of the mounting face for the electronic part, and a plane electrode portion formed in the remaining area of the mounting face for the electronic part,
wherein the plane electrode portion is not electrically connected to the plurality of patch electrode portions.

11. The electronic apparatus according to claim 10 , wherein the electronic part includes a first semiconductor circuit section which acts as a generating source of noise, and a second semiconductor circuit section which is influenced by the noise, and the first semiconductor circuit section and the second semiconductor circuit section are connected to a power supply through one of the first conductive film and the second conductive film and are connected to the ground through the other one of the first conductive film and the second conductive film.

12. The electronic apparatus according to claim 11 , wherein the first conductive film has an electrode pattern portion formed at part of a predetermined region corresponding to a mounting region for at least one of the first semiconductor circuit section and the second semiconductor circuit section so as to configure a decoupling capacitor, and the electrode pattern portion is electrically connected to the plurality of patch electrode portions.

13. The electronic apparatus according to claim 11 , wherein the first semiconductor circuit section is a digital circuit section while the second semiconductor circuit section is an analog circuit section.

14. The electronic apparatus according to claim 10 , wherein the electronic part includes a single-ended high speed wiring line, part of which is provided in a formation area of the plurality of patch electrode portions.

Assignees

• Sony Corp

Inventors

• Rokuhara Shinji

Classifications

• H05K1/0236 Primary

  Electromagnetic band-gap structures · CPC title

• H05K9/0064 Primary

  Earth or grounding circuit · CPC title

• H05K3/4605

  made from inorganic insulating material · CPC title