Systems and methods for mounting the printed wiring assembly to the header assembly of a pressure sensor

Patent metadata

Field	Value
Publication number	US-9648745-B2
Application number	US-201414521287-A
Country	US
Kind code	B2
Filing date	Oct 22, 2014
Priority date	Oct 22, 2014
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Systems and method for mounting the printed wiring assembly to the header assembly of a pressure sensor are provided. In at least one embodiment, the pressure sensor comprises: a header assembly; a printed wiring assembly having a pressure sensor mounted thereon; and, at least one substantially cylindrical member that mechanically couples the printed wiring assembly to the header assembly. The substantially cylindrical member has a substantially hollow core, a substantially circular first end attached to the header assembly, a substantially circular second end opposite the substantially circular first end, and at least one side extending from the substantially circular first end to the substantially circular second end of the cylindrical member. Furthermore, the substantially circular second end or the at least one side or both are attached to the printed wiring assembly.

First claim

What is claimed is:

1. A pressure sensor device comprising:
a header assembly;
a printed wiring assembly having a pressure sensor mounted thereon; and
at least one cylindrical member that extends through and mechanically couples the printed wiring assembly to the header assembly,
wherein the cylindrical member has a hollow core, a circular first end mounted to a surface of the header assembly, a circular second end opposite the circular first end, and at least one side extending from the circular first end to the circular second end of the cylindrical member, and
wherein the circular second end or the at least one side or both are attached to the printed wiring assembly.

2. The pressure sensor device of claim 1 , wherein the at least one cylindrical member includes a flange extending from the circular second end.

3. The pressure sensor device of claim 1 , wherein the circular first end is a closed end.

4. The pressure sensor device of claim 1 , wherein the interior diameter of the circular second end is equal to the interior diameter of the circular first end.

5. The pressure sensor device of claim 1 , wherein the interior diameter of the circular second end is greater than the interior diameter of the circular first end.

6. The pressure sensor device of claim 1 , wherein the at least one side includes at least one elongated slot extending from the circular first end to the circular second end.

7. The pressure sensor device of claim 1 , wherein the at least one cylindrical member is attached to the printed wiring assembly and to the header assembly by one or more of the following: spot welding, laser welding, ultrasonic welding, gold pressure bonding, soldering or brazing.

8. The pressure sensor device of claim 1 , wherein the at least one cylindrical member is made of Kovar.

9. The pressure sensor device of claim 1 , wherein there is a gap between the at least one side and the printed wiring assembly.

10. The pressure sensor device of claim 1 , wherein the height of the at least one cylindrical member is greater than the height of the printed wiring assembly and wherein the circular second end extends past a first surface of the printed wiring assembly and wherein the circular first end extends past a second surface of the printed wiring assembly that is opposite the first surface of the printed wiring assembly.

11. The pressure sensor device of claim 1 , wherein the circular second end extends past a first surface of the printed wiring assembly and wherein the first end does not extend past a second surface of the printed wiring assembly that is opposite the first surface of the printed wiring assembly.

12. The pressure sensor device of claim 1 , wherein the thickness of the at least one side combined with the mass of the printed wiring assembly are configured to provide a resonant frequency above 2 kilohertz for the printed wiring assembly.

13. A method for mechanically coupling a printed wiring assembly to a header assembly of a pressure sensor device, the method comprising:
boring a hole in the printed wiring assembly; and
attaching a cylindrical member to the printed wiring assembly and the header assembly, wherein the cylindrical member has a hollow core, a circular first end mounted to a surface of the header assembly, a circular second end opposite the circular first end, and at least one side extending from the circular first end to the circular second end of the cylindrical member through the hole.

14. The method of claim 13 , further comprising inserting the cylindrical member into the bored hole.

15. The method of claim 13 , wherein attaching the cylindrical member to the printed wiring assembly and the header assembly includes at least one of the following methods: spot welding, laser welding, ultrasonic welding, gold pressure bonding, soldering or brazing.

16. The method of claim 13 , wherein the height of the cylindrical member is greater than the height of the printed wiring assembly and wherein the circular second end extends past a first surface of the printed wiring assembly and wherein the circular first end extends past a second surface of the printed wiring assembly that is opposite the first surface of the printed wiring assembly.

17. The method of claim 13 , wherein the circular second end extends past a first surface of the printed wiring assembly and wherein the circular first end does not extend past a second surface of the printed wiring assembly that is opposite the first surface of the printed wiring assembly.

18. A pressure sensor device comprising:
a header assembly;
a printed circuit board having a pressure sensor mounted thereon; and
at least one cylindrical member having a hollow core that extends through the printed circuit board, a first end and an open second end opposite the first end, wherein the first end is mounted to a surface to the header assembly and the second end is mechanically coupled to the printed circuit board.

19. The pressure sensor device of claim 18 , wherein the header assembly includes at least one header boss and wherein the first end is mechanically coupled to the at least one header boss of the header assembly.

20. The pressure sensor device of claim 18 , further comprising at least one feed though pin, wherein the at least one feed through pin is mechanically coupled to the header assembly and wherein the at least one feed through pin is wire bonded to the printed circuit board to provide additional stabilization to the printed circuit board.

Assignees

• Honeywell Int Inc

Inventors

• Brown Gregory C
• Rolfer Thomas J
• Dukich Peter J

Classifications

• G01L19/147 Primary

  Details about the mounting of the sensor to support or covering means · CPC title

• H05K2203/0285

  Using ultrasound, e.g. for cleaning, soldering or wet treatment · CPC title

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• G01L9/00

  Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements {(G01L11/004 takes precedence)}; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means (measuring differences of two or more pressure values G01L13/00; measuring two or more pressure values simultaneously G01L15/00) · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title