Method and apparatus for forming interface between coaxial cable and connector

Patent metadata

Field	Value
Publication number	US-9647353-B2
Application number	US-201615272671-A
Country	US
Kind code	B2
Filing date	Sep 22, 2016
Priority date	May 13, 2015
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage; lowering the connector body and insulator onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator.

First claim

That which is claimed is:

1. A method of forming a solder joint between a coaxial cable and a coaxial connector, comprising the steps of:
positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage;
lowering the connector body and insulator onto a mounting structure;
melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and
applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator.

2. The method defined in claim 1 , wherein the suction path includes a passage through the mounting structure.

3. The method defined in claim 2 , wherein the mounting structure includes a cap and wherein the suction path passes through the cap.

4. The method defined in claim 1 , wherein the suction passage of the insulator comprises through holes in the insulator.

5. The method defined in claim 1 , wherein the solder element is a solder preform mounted on the outer conductor of the cable.

6. The method defined in claim 1 , wherein the mounting structure is an interface pedestal.

7. The method defined in claim 1 , wherein the coaxial cable further comprises an inner conductor, and wherein an inner contact is mounted onto the inner conductor prior to the lowering step, and wherein the mounting structure includes a cavity for receiving the inner contact.

8. The method defined in claim 1 , wherein the lower surface of the solder joint is formed by the connector body.

9. A method for attaching a connector to a coaxial cable, comprising the steps of:
positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage;
positioning the connector body and insulator on a mounting structure;
melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a surface formed by contact with the insulator and/or the connector body; and
applying suction to the melting solder element to prevent the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator.

10. The method defined in claim 9 , wherein the suction path includes a passage through the mounting structure.

11. The method defined in claim 10 , wherein the mounting structure includes a cap, and wherein the suction path passes through the cap.

12. The method defined in claim 9 , wherein the suction passage of the insulator comprises through holes in the insulator.

13. The method defined in claim 9 , wherein the solder element is a solder preform mounted on the outer conductor of the cable.

14. The method defined in claim 9 , wherein the mounting structure is an interface pedestal.

15. The method defined in claim 9 , wherein the coaxial cable further comprises an inner conductor, and wherein an inner contact is mounted onto the inner conductor prior to the lowering step, and wherein the mounting structure includes a cavity for receiving the inner contact.

16. The method defined in claim 9 , wherein the lower surface of the solder joint is formed by the connector body.

Assignees

• Commscope Technologies Llc

Inventors

• Paynter Jeffery D

Classifications

• B23K2101/38

  Conductors · CPC title

• B23K2101/32

  Wires · CPC title

• B23K3/0623

  for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• H01R9/05 Primary

  for coaxial cables · CPC title