Semiconductor package with printed sensor

Patent metadata

Field	Value
Publication number	US-9646906-B2
Application number	US-201514849026-A
Country	US
Kind code	B2
Filing date	Sep 9, 2015
Priority date	Sep 26, 2014
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.

First claim

The invention claimed is:

1. A packaged semiconductor device with at least one printed sensor, comprising:
a semiconductor package having at least one semiconductor die (die) therein including bond pads on a surface of said die coupled to pins of said semiconductor package; and
said a printed sensor (sensor) comprising sensor electrodes and a sensing material comprising an ink residue between said sensor electrodes directly on said semiconductor package, said sensing material being sensitive to at least one environmental stimulus or a user′ interactive stimulus;
wherein said die includes a wireless coupling structure coupled to said bond pads and there is a complementary wireless coupling structure on said packaged semiconductor device coupled to said sensor electrodes so that sensing signals sensed by said sensor are wirelessly transmitted to said bond pads after being received by said wireless coupling structure.

2. The packaged semiconductor device of claim 1 , wherein said sensor comprises a first sensor and at least a second sensor, and wherein said first and said second sensor have different ones of said sensing material.

3. The packaged semiconductor device of claim 2 , wherein said first sensor and said second sensor are both coupled wirelessly to said complementary wireless coupling structure.

4. A packaged semiconductor device comprising:
a semiconductor die attached and electrically connected to a substrate;
a plurality of bond pads on the semiconductor die;
a sensor including ink residue between sensor electrodes, the sensor electrodes connected to the plurality of bond pads; and
a mold compound encapsulating portions of the substrate and the semiconductor die, the mold compound defining an opening in the packaged semiconductor device exposing the sensor.

5. The packaged semiconductor device of claim 4 , wherein the semiconductor die is electrically connected to the substrate via wire bonds.

6. The packaged semiconductor device of claim 4 , wherein the sensor is sensitive to one of an environmental stimulus and a user interactive stimulus.

7. The packaged semiconductor device of claim 4 , wherein the ink residue has a portion with porosity between 10% and 80%.

8. The packaged semiconductor device of claim 4 , wherein the sensor electrodes are electrically connected to the substrate.

9. A packaged semiconductor device comprising:
a semiconductor die attached and electrically connected to a substrate;
a mold compound encapsulating portions of the substrate and the semiconductor die; and
a sensor on the mold compound, the sensor including ink residue between sensor electrodes, the sensor electrodes capable of wirelessly communicating to the semiconductor die.

10. The packaged semiconductor device of claim 9 , wherein the semiconductor die includes a first wireless coupling structure coupled to a plurality of bond pads.

11. The packaged semiconductor device of claim 10 further comprising a second wireless coupling structure on the mold compound coupled to the sensor electrodes.

12. The packaged semiconductor device of claim 11 , wherein the first and second wireless coupling structures include a radio frequency wireless coupling structure.

13. The packaged semiconductor device of claim 9 , wherein the ink residue includes a metallic nanoink having one of a copper, palladium, platinum and gold.

14. The packaged semiconductor device of claim 9 , wherein the sensor electrodes are porous sensor electrodes.

Assignees

• Texas Instruments Inc

Inventors

• Cook Benjamin Stassen
• Herbsommer Juan Alejandro
• Trombley Django
• Kummerl Steven Alfred
• Emerson Paul

Classifications

• H10P14/46

  using a liquid · CPC title

• H10W90/798

  between a chip and a stacked discrete passive device · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title