Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US9645490B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9645490-B2 |
| Application number | US-201514964842-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 10, 2015 |
| Priority date | Dec 15, 2014 |
| Publication date | May 9, 2017 |
| Grant date | May 9, 2017 |
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A salt represented by the formula (I): wherein Q 1 and Q 2 each independently represent a fluorine atom or a C 1 to C 6 perfluoroalkyl group; R 1 represents a C 1 to C 12 alkyl group in which a methylene group may be replaced by an oxygen atom or a carbonyl group; A 1 represents a C 2 to C 8 alkanediyl group; and R 2 represents a C 5 to C 18 alicyclic hydrocarbon group in which a hydrogen atom may be replaced by a hydroxy group, and in which a methylene group may be replaced by an oxygen atom or a carbonyl group, and which alicyclic hydrocarbon group may have a cyclic ketal structure optionally having a fluorine atom; and “m” represents an integer of 0, 1, 2 or 3.
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What is claimed is: 1. A salt represented by the formula (I): wherein Q 1 and Q 2 each independently represent a fluorine atom or a C 1 to C 6 perfluoroalkyl group; R 1 represents a C 1 to C 12 alkyl group in which a methylene group may be replaced by an oxygen atom or a carbonyl group; A 1 represents a C 2 to C 8 unsubstituted alkanediyl group; and R 2 represents a C 5 to C 18 alicyclic hydrocarbon group in which a hydrogen atom may be replaced by a hydroxy group, and in which a methylene group may be replaced by an oxygen atom or a carbonyl group, and which alicyclic hydrocarbon group may have a cyclic ketal structure optionally having a fluorine atom; and “m” represents an integer of 0, 1, 2 or 3. 2. The salt according to claim 1 wherein the alicyclic hydrocarbon group for R 2 is an adamantyl group. 3. The salt according to claim 1 wherein R 1 represents a C 1 to C 6 alkyl group. 4. An acid generator which comprises the salt according to claim 1 . 5. A photoresist composition which comprises the salt according to claim 1 and a resin having an acid-labile group. 6. The photoresist composition according to claim 5 , which further comprises a salt which generates an acid weaker in acidity than an acid generated from the salt according to claim 1 . 7. A process for producing a photoresist pattern comprising the following steps (1) to (5): (1) a step of applying the photoresist composition according claim 5 on a substrate, (2) a step of forming a composition film by conducting drying, (3) a step of exposing the composition film to radiation, (4) a step of baking the exposed composition film, and (5) a step of developing the baked composition film.
containing carboxyl groups bound to the carbon skeleton · CPC title
Non-aqueous compositions · CPC title
in the presence of a fluid, e.g. immersion; using fluid cooling means · CPC title
Eight-membered rings · CPC title
with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title
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