Polyamide moulding composition, moulded articles produced therefrom and also use of the polyamide moulding compositions

US9644081B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9644081-B2
Application numberUS-201514663105-A
CountryUS
Kind codeB2
Filing dateMar 19, 2015
Priority dateApr 2, 2014
Publication dateMay 9, 2017
Grant dateMay 9, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to a polyamide molding composition which comprises a partially aromatic polyamide and also a mixture of at least two UV absorbers. The invention likewise relates to molded articles which comprise corresponding polyamide molding compositions. The polyamide molding compositions according to the invention are used as parts of electrical or electronic components or housings or housing components, in particular housings or housing parts for portable electronic devices, household appliances, household machines, devices and apparatus for telecommunication and consumer electronics, interior and exterior parts in the automobile sector and in the field of other transport means, interior and exterior parts, preferably with a portable or mechanical function in the field of electrics, furniture, sport, mechanical engineering, the sanitary field and hygiene, medicine, energy- and drive technology, particularly preferably mobile telephones, smart phones, organizers, laptop computers, notebook computers, tablet computers, radios, cameras, clocks, calculators, devices for playing music or video, navigation devices, GPS devices, electronic picture frames, external hard disks and other electronic storage media, or for the production of mono- or multilayer films, containers or pipes.

First claim

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The invention claimed is: 1. A polyamide moulding composition comprising: a) 91.6 to 99.97% by weight of at least one partially aromatic amorphous polyamide producible by polycondensation of a1) at least one aromatic dicarboxylic acid and optionally at least one aliphatic dicarboxylic acid with 6 to 44 C atoms, a2) at least one aliphatic and/or cycloaliphatic diamine and a3) optionally at least one lactam with 4 to 15 C atoms and/or at least one α,ω-amino acid with 4 to 15 C atoms, b) at least one UV absorber from the group of N,N′-oxamides, c) at least one UV absorber from the group of hydroxyphenyltriazines, and d) one or more additives selected from the group consisting of condensation catalysts, chain regulators, de-foamers, inorganic stabilizers, organic stabilizers, lubricants, colourants, marking means, pigments, nucleation agents, antistatic agents, mould-release agents, optical brighteners, natural layer silicates, synthetic layer silicates, glass fibres, and mixtures thereof, wherein the difference between the yellow index (YI 2) after 12 cycles of a radiation- and temperature treatment and the original yellow index (YI 1) is at most 4. 2. The polyamide moulding composition according to claim 1 , wherein the at least one UV absorber under b) is selected from the group consisting of N,N′-oxamides of the general formula (I) R 1 —NH—CO—CO—NH—R 2   (I) R 1 and R 2 being cyclic radicals, each individual ring comprising 4 to 6 C atoms and the cyclic radicals, independently of each other, being selected from the group consisting of homocyclic radicals, heterocyclic radicals, aromatic radicals and polycyclic radicals and the cyclic radicals optionally being substituted. 3. The polyamide moulding composition according to claim 1 , wherein the at least one UV absorber under b) is selected from the group consisting of oxalanilides of the general formula (II) with R 3 , R 4 , R 5 and R 6 , independently, selected from the group consisting of H, hydroxy, phenyl, linear or branched alkoxy radicals with 1 to 12 C atoms, and linear or branched alkyl radicals with 1 to 12 C atoms, and a compound of formula (III) with R 7 and R 8 , independently of each other, selected from the group consisting of linear and branched alkyl radicals with 1 to 12 C atoms. 4. The polyamide moulding composition according to claim 1 , wherein the UV absorber under c) is a compound of the general formula (IV) with R 9 , R 10 , R 11 , R 12 and R 13 , independently, selected from the group consisting of H, hydroxy, phenyl, linear and branched alkoxy radicals with 1 to 12 C atoms, linear and branched alkyl radicals with 1 to 12 C atoms, and a compound of formula (V): with R 14 =linear or branched alkoxy radicals with 1 to 12 C atoms. 5. The polyamide moulding composition according to claim 1 , wherein the at least one aliphatic dicarboxylic acid is selected from the group consisting of succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, octadecanedioic acid, and mixtures thereof, and/or the at least one aromatic dicarboxylic acid is selected from the group consisting of isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid and mixtures thereof. 6. The polyamide moulding composition according to claim 1 , wherein the at least one aliphatic or cycloaliphatic diamine is selected from the group consisting of ethylenediamine, butanediamine, pentanediamine, hexamethylenediamine, octanediamine, methyloctanediamine, nonanediamine, decanediamine, undecanediamine, dodecanediamine, trimethylhexamethylenediamine, methylpentanediamine, bis(aminocyclohexyl)methane and its alkyl derivatives, bis(aminocyclohexyl)propane and its alkyl derivatives, isophoronediamine, norbornanediamine, bis(aminomethyl)norbornane, xylylenediamine, bis(aminomethyl)cyclohexane and its alkyl derivatives and mixtures thereof. 7. The polyamide moulding composition according to claim 1 , wherein the at least one partially aromatic amorphous polyamide is selected from the group consisting of PA 6I, PA 6I/6T, PA 10T/6T PA 10T/612, PA MXD6, PA 6T/6I, PA 6T/66, PA 6I/6T/6NDC, PA MXDI/6I, PA 6T/6I/66, PA MXDI/MDT/6I/6T, PA MXDI/12I, PA MXDI, PA NDT/INDT, PA MACMI/12, PA MACMT/12, PA MACMI/MACM12, PA MACMT/MACM12, PA MACMI/MACMNDA, PA MACMT/MACMNDA, PA MACMI/MACMT/12, PA 6I/MACMI/12, PA 61/6T/MACMI/MACMT, PA 6I/6T/MACMI/MACMT/12, PA 6I/6T/MACMI/MACMT/MACM12/612, PA MACMI/MACMT/MACM12/12, PA MACMI/MACMT/MACM12, and PA 6I/6T/6NDC/MACMI/MACMT/MACMNDC, the MACM being able to be replaced entirely or partially by PACM and/or the laurinlactam entirely or partially by caprolactam. 8. The polyamide moulding composition according to claim 1 , wherein the polyamide moulding composition includes a further polyamide, the further polyamide being present in a proportion of at most 30% by weight, and being selected from the group consisting of PA 6, PA 66, PA 69, PA 610, PA 612, PA 614, PA 618, PA 1010, PA 1212, PA 6/66/12, PA 6/66, PA 6/12, PA 11, PA 12, PA MACMI2, PA MACMI4, PA MACM18, PA PACM 12, PA PACMI4, PA PACM 18, polyether amides, polyether ester amides, and blends and alloys thereof. 9. The polyamide moulding composition according to claim 1 , wherein the polyamide moulding composition has the following composition: a) 91.6 to 99.97% by weight of the at least one partially aromatic amorphous polyamide, b) 0.01 to 1.2% by weight of the at least one UV stabiliser from the group of N,N-oxamides, c) 0.01% to 1.2% by weight of the at least one UV stabiliser from the group of hydroxyphenyltriazines, and d) 0.01 to 6% by weight of said one or more additives, components a) to d) adding up to 100% by weight. 10. The polyamide moulding composition according to claim 1 , wherein the polyamide moulding composition comprises 0 to 40% by mol of the at least one aliphatic dicarboxylic acid, relative to 50% by mol of dicarboxylic acid, and 10 to 50% by mol of the at least one aromatic dicarboxylic acid, relative to 50% by mol of dicarboxylic acid. 11. The polyamide moulding composition according to claim 1 , wherein the polyamide moulding composition comprises 0 to 50% by mol of the at least one aliphatic diamine, relative to 50% by mol of diamine, and 50 to 0% by mol of the at least one cycloaliphatic diamine, relative to 50% by mol of diamine. 12. The polyamide moulding composition according to claim 1 , wherein the polyamide moulding composition comprises 0 to 40% by mol, relative to 100% by mol of polyamide a) of a lactam with 4 to 15 C atoms and/or at least one α,ω-amino acid with 4 to 15 C atoms. 13. A moulded article or coating comprising or consisting of a polyamide moulding composition according to claim 1 . 14. The moulded article according to claim 13 , which is part of an electrical or electronic component, a housing or of a housing component, devices and apparatus for telecommunication and consumer electronics, interior and exterior parts of an automobile, interior and exterior parts, of electrics, furniture, sport, mechanical engineering, the sanitary

Assignees

Inventors

Classifications

  • containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

  • Additives containing two or more different additives of the same subgroup in C08K · CPC title

  • C08K5/00Primary

    Use of organic ingredients · CPC title

  • Carboxylic acid amides · CPC title

  • use in electrical or conductive gadgets · CPC title

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What does patent US9644081B2 cover?
The invention relates to a polyamide molding composition which comprises a partially aromatic polyamide and also a mixture of at least two UV absorbers. The invention likewise relates to molded articles which comprise corresponding polyamide molding compositions. The polyamide molding compositions according to the invention are used as parts of electrical or electronic components or housings or…
Who is the assignee on this patent?
Ems Patent Ag
What technology area does this patent fall under?
Primary CPC classification C08K5/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).