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Modifier for resin and resin composition using the same and formed article
US9206310B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9206310-B2 |
| Application number | US-201414219808-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 19, 2014 |
| Priority date | Feb 16, 2004 |
| Publication date | Dec 8, 2015 |
| Grant date | Dec 8, 2015 |
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Abstract
Official abstract text for this publication.
A modifier for resin has an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.
First claim
Opening claim text (preview).
The invention claimed is: 1. A resin composition, comprising: (a) 1 to 40% by mass, based on the total mass of the resin composition, of a modifier comprising powder particles, wherein (1) the powder particles are composed of agglomerates of particles of a graft copolymer, wherein the graft copolymer has a core-shell structure composed of a rubbery polymer as a trunk polymer and having grafted thereon a graft polymerizable vinyl-based monomer and the particles of the gr…
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Electricity · mapped topic
Electricity · mapped topic
- C08L63/00Primary
Chemistry & Metallurgy · mapped topic
- C08F265/04Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US9206310B2 cover?
- A modifier for resin has an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition …
- Who is the assignee on this patent?
- Mitsubishi Rayon Co
- What technology area does this patent fall under?
- Primary CPC classification C08L63/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 08 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).