MEMS device and method for manufacturing the MEMS device

Patent metadata

Field	Value
Publication number	US-9641949-B2
Application number	US-201414320466-A
Country	US
Kind code	B2
Filing date	Jun 30, 2014
Priority date	Jun 30, 2014
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A MEMS device and a method for manufacturing a MEMS device are disclosed. In an embodiment the MEMS device comprises a support having a cavity therethrough and a membrane extended over the cavity of the support, wherein the membrane is at least partially reinforced by graphene.

First claim

What is claimed is:

1. A MEMS device comprising:
a support having a cavity therethrough; and
a membrane arranged on the support such that the membrane extends over the cavity of the support,
wherein the membrane is at least partially reinforced by graphene,
wherein the membrane is arranged between the support and the graphene, and
wherein the membrane is displaceable over the cavity.

2. The MEMS device according to claim 1 , wherein the membrane comprises a material different from graphene.

3. The MEMS device according to claim 1 , wherein the membrane comprises poly silicon or consists of poly silicon.

4. The MEMS device according to claim 1 , wherein a suspension area of the membrane is reinforced by graphene.

5. The MEMS device according to claim 1 , wherein the membrane is reinforced by a graphene layer, and wherein the graphene layer covers the membrane at least partially.

6. The MEMS device according to claim 5 , wherein the graphene layer is a single layer graphene or a multilayer graphene.

7. The MEMS device according to claim 1 , wherein the support is a dielectric spacer.

8. The MEMS device according to claim 1 , further comprising a conductive back plate unit, wherein the support is arranged on the back plate unit.

9. The MEMS device according to claim 8 , further comprising a first electrode arranged in contact with the conductive back plate unit and a second electrode arranged in contact with the membrane.

10. The MEMS device according to claim 8 , further comprising a substrate, wherein the conductive back plate unit is arranged to extend over the substrate.

11. The MEMS device according to claim 8 , wherein the conductive back plate unit comprises a plurality of conductive perforated back plate portions, wherein the support is arranged on the back plate unit between adjacent conductive perforated back plate portions.

12. The MEMS device according to claim 11 , further comprising a substrate having a cavity therethrough, wherein the conductive back plate unit is arranged such that the plurality of conductive perforated back plate portions extend over the cavity of the substrate.

13. The MEMS device according to claim 12 , wherein the membrane is arranged between the substrate and the conductive back plate unit.

14. The MEMS device according to claim 13 , wherein the conductive back plate unit is arranged between the substrate and the membrane.

15. The MEMS device according to claim 11 , further comprising a further conductive back plate unit including a plurality of perforated back plate portions and arranged such that the membrane is sandwiched between the conductive back plate unit and the further conductive back plate unit.

16. A method for manufacturing a MEMS device, the method comprising:
providing a support having a cavity therethrough;
providing a membrane on the support such that the membrane extends over the cavity of the support, wherein the membrane is displaceable over the cavity; and
reinforcing the membrane at least partially by graphene.

17. The method according to claim 16 , wherein reinforcing the membrane at least partially by graphene comprises depositing a graphene layer on the membrane such that the membrane is at least partially covered with the graphene layer.

18. The method according to claim 16 , wherein reinforcing the membrane at least partially by graphene comprises reinforcing at least a suspension area of the membrane.

Assignees

• Infineon Technologies Ag

Inventors

• Massoner Johann

Classifications

• B81B2201/0264

  Pressure sensors · CPC title

• H04R31/003 Primary

  for diaphragms or their outer suspension · CPC title

• B81B2203/0127

  Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R2307/023

  Diaphragms comprising ceramic-like materials, e.g. pure ceramic, glass, boride, nitride, carbide, mica and carbon materials · CPC title