Integrated circuit connectors

US9265170B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9265170-B2
Application numberUS-201314065281-A
CountryUS
Kind codeB2
Filing dateOct 28, 2013
Priority dateOct 28, 2013
Publication dateFeb 16, 2016
Grant dateFeb 16, 2016

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.

First claim

Opening claim text (preview).

What is claimed is: 1. An integrated circuit (IC) assembly, comprising: an IC package substrate having a top surface, a bottom surface, and a side surface, the IC package substrate having first signal contacts on the top surface or the bottom surface, and the bottom surface having second signal contacts for coupling with a socket on a circuit board, wherein a first portion of the top surface and the bottom surface are aligned with the socket along a first axis that is parallel with the side surface, and a second portion of the top surface and the bottom surface are not aligned with the socket along the first axis, and the first signal contacts are positioned on the second portion of the top surface or the bottom surface; an intermediate member having a first end and a second end, and a second axis defined between the first and second ends, the first end having signal contacts coupled to the first signal contacts of the IC package substrate, and the second end extending beyond an edge of the IC package substrate defined by the side surface; and a male connector, disposed at the second end of the intermediate member, having signal contacts coupled to the signal contacts of the intermediate member, and mateable with a female connector when the female connector is brought into engagement with the male connector in a direction parallel to the second axis. 2. The IC assembly of claim 1 , further comprising: the female connector, having signal contacts to couple to the signal contacts of the male connector when the female and male connectors are engaged; and a cable having signal carriers coupled to the signal contacts of the female connector, the cable extending in a direction parallel to the second axis when the female and male connectors are engaged. 3. The IC assembly of claim 2 , wherein the female connector is a low insertion force connector. 4. The IC assembly of claim 2 , wherein the cable is a coaxial cable. 5. The IC assembly of claim 2 , wherein the cable is a fiber optic cable. 6. The IC assembly of claim 2 , wherein the cable is coupled to a switch coupled to multiple processing units. 7. The IC assembly of claim 1 , wherein the intermediate member comprises a flexible flat cable. 8. The IC assembly of claim 1 , wherein the intermediate member comprises a rigid circuit board. 9. The IC assembly of claim 8 , wherein the male connector comprises an extension portion of the rigid circuit board, the extension portion extending away from a body of the rigid circuit board in a direction of the second axis. 10. The IC assembly of claim 1 , wherein the circuit board is a motherboard.

Assignees

Inventors

Classifications

  • Printed circuits · CPC title

  • Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures (printed connections to, or between, printed circuits H05K1/11) · CPC title

  • H05K7/10Primary

    Plug-in assemblages of components {, e.g. IC sockets} · CPC title

  • H01R12/716Primary

    Coupling device provided on the PCB · CPC title

  • with a single cantilevered beam · CPC title

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Frequently asked questions

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What does patent US9265170B2 cover?
Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate me…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H05K7/10. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).