Socket for semiconductor component, printed circuit board unit, and information processing apparatus
US-2015359122-A1 · Dec 10, 2015 · US
US9265170B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9265170-B2 |
| Application number | US-201314065281-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 28, 2013 |
| Priority date | Oct 28, 2013 |
| Publication date | Feb 16, 2016 |
| Grant date | Feb 16, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Embodiments related to integrated circuit (IC) connectors are described. In some embodiments, an IC assembly may include an IC package substrate, an intermediate member, and a male connector. The IC package substrate may have first signal contacts on a top or bottom surface, and the bottom surface may have second signal contacts for coupling with a socket on a circuit board. The intermediate member may have a first end coupled to the first signal contacts and a second end extending beyond the side surface. The male connector may be disposed at the second end of the intermediate member, and may have signal contacts coupled to the signal contacts of the intermediate member. The male connector may be mateable with a female connector when the female connector is brought into engagement in a direction parallel to the axis of the intermediate member. Other embodiments may be disclosed and/or claimed.
Opening claim text (preview).
What is claimed is: 1. An integrated circuit (IC) assembly, comprising: an IC package substrate having a top surface, a bottom surface, and a side surface, the IC package substrate having first signal contacts on the top surface or the bottom surface, and the bottom surface having second signal contacts for coupling with a socket on a circuit board, wherein a first portion of the top surface and the bottom surface are aligned with the socket along a first axis that is parallel with the side surface, and a second portion of the top surface and the bottom surface are not aligned with the socket along the first axis, and the first signal contacts are positioned on the second portion of the top surface or the bottom surface; an intermediate member having a first end and a second end, and a second axis defined between the first and second ends, the first end having signal contacts coupled to the first signal contacts of the IC package substrate, and the second end extending beyond an edge of the IC package substrate defined by the side surface; and a male connector, disposed at the second end of the intermediate member, having signal contacts coupled to the signal contacts of the intermediate member, and mateable with a female connector when the female connector is brought into engagement with the male connector in a direction parallel to the second axis. 2. The IC assembly of claim 1 , further comprising: the female connector, having signal contacts to couple to the signal contacts of the male connector when the female and male connectors are engaged; and a cable having signal carriers coupled to the signal contacts of the female connector, the cable extending in a direction parallel to the second axis when the female and male connectors are engaged. 3. The IC assembly of claim 2 , wherein the female connector is a low insertion force connector. 4. The IC assembly of claim 2 , wherein the cable is a coaxial cable. 5. The IC assembly of claim 2 , wherein the cable is a fiber optic cable. 6. The IC assembly of claim 2 , wherein the cable is coupled to a switch coupled to multiple processing units. 7. The IC assembly of claim 1 , wherein the intermediate member comprises a flexible flat cable. 8. The IC assembly of claim 1 , wherein the intermediate member comprises a rigid circuit board. 9. The IC assembly of claim 8 , wherein the male connector comprises an extension portion of the rigid circuit board, the extension portion extending away from a body of the rigid circuit board in a direction of the second axis. 10. The IC assembly of claim 1 , wherein the circuit board is a motherboard.
Printed circuits · CPC title
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures (printed connections to, or between, printed circuits H05K1/11) · CPC title
Plug-in assemblages of components {, e.g. IC sockets} · CPC title
Coupling device provided on the PCB · CPC title
with a single cantilevered beam · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.