Semiconductor module

Patent metadata

Field	Value
Publication number	US-9640470-B2
Application number	US-201314904160-A
Country	US
Kind code	B2
Filing date	Nov 5, 2013
Priority date	Nov 5, 2013
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A common connecting section for connection to terminals at the same potential in circuits is placed outside a mold section to allow a reduction in size of a semiconductor module 1 . Since the common connecting section is a portion of a lead frame which would be placed within such a mold section in a conventional semiconductor module, the mold section can be reduced in size as compared with the conventional one, thereby reducing the amount of mold resin and the material cost.

First claim

The invention claimed is:

1. A semiconductor module comprising:
a lead frame having a plurality of seats electrically independent of each other;
a plurality of electronic parts comprising a plurality of semiconductor devices mounted on the seats;
a mold section provided by integrating the lead frame and the plurality of electronic parts with a mold resin, the plurality of electronic parts constituting a plurality of circuits, wherein a portion of the lead frame extends outside of the mold section providing a plurality of terminals each connecting a respective circuit from among the plurality of circuits hosted in the semiconductor module to a component outside of the semiconductor module; and
a common connecting section connecting at least one set of the plurality of terminals at the same potential in the circuits outside the mold section, and serving as a common wiring for at least one of: power source lines and ground lines in the circuits and is a terminal for connecting the common wiring to at least one of a power source terminal and a ground source terminal.

2. The semiconductor module according to claim 1 , wherein the common connecting section is formed of the lead frame extended to the outside of the mold section.

3. The semiconductor module according to claim 2 , wherein the common connecting section forms a portion of an outer frame of the lead frame.

4. The semiconductor module according to claim 2 , wherein the mold section is molded in a rectangular shape in a planner view, and wherein the common connecting section is placed along one side of the mold section.

5. The semiconductor module according to claim 2 , wherein the mold section is molded in a rectangular shape in a planner view, and wherein the common connecting section is placed along a longer side of the mold section.

6. The semiconductor module according to claim 2 , wherein the common connecting section is bent in a direction orthogonal to a surface of the seat on which the semiconductor device is mounted.

7. The semiconductor module according to claim 2 , wherein the common connecting section is bent toward a surface of the seat on which the semiconductor device is mounted.

8. The semiconductor module according to claim 2 , wherein the common connecting section is bent opposite to a surface of the seat on which the semiconductor device is mounted.

9. The semiconductor module according to claim 2 , wherein the mold section is molded in a rectangular shape in a planner view, and
wherein, when the common connecting section and one terminal that is not connected to the common connecting section, are extended from one side of the mold section, at least one of the common connecting section and the terminal is bent in a direction orthogonal to a surface of the seat on which the semiconductor device is mounted.

10. The semiconductor module according to claim 1 , wherein the common connecting section is formed of a plate member different from the lead frame.

11. The semiconductor module according to claim 10 , wherein the mold section is molded in a rectangular shape in a planner view, and wherein the common connecting section connects another set of the terminals extended from two different sides of the mold section.

12. The semiconductor module according to claim 1 , wherein the common connecting section is configured such that the terminals connected to the electronic parts provide the common wiring.

13. The semiconductor module according to claim 1 , wherein the common connecting section is formed of another portion of the outer lead frame and is a holding section, which positions a work in the mold after the semiconductor device is mounted onto the lead frame and wherein the common connecting section is connected to at least one of the ground terminal and the power terminal via a shunt resistance and a beam, which is a bridge over the lead frame.

14. The semiconductor module according to claim 1 , wherein a wire bond, which connects at least another set of the terminals comprising control and monitor signal terminals to the electronic parts.

Assignees

• Mitsubishi Electric Corp

Inventors

• Kawano Yu
• Mori Akihiko
• Asao Yoshihito

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/763

  between laterally-adjacent chips · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title