System, method and apparatus for matrix-less inlay design

Patent metadata

Field	Value
Publication number	US-9639799-B2
Application number	US-201214236832-A
Country	US
Kind code	B2
Filing date	Jul 31, 2012
Priority date	Aug 1, 2011
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

According to at least one exemplary embodiment, a system, method and apparatus for a matrix-less inlay design may be described. The system, method and apparatus can include the formation of an inlay with a pattern, such as a starburst pattern, surrounding an antenna that can be formed during laser ablation process. The starburst pattern may be utilized to provide for the efficient generation of inlays of varying sizes.

First claim

What is claimed is:

1. An RFID inlay comprising:
a matrix-less inlay substrate having a pattern;
an antenna disposed on the substrate attached to a chip, the antenna distinct from the pattern;
wherein the pattern surrounds the antenna and the pattern prevents warping of the substrate; and
the pattern and the antenna are made by a laser cutting such that the pattern are cut lines made during a laser ablation process and the cut lines are formed about every 45 degrees extending outward from the inlay.

2. The inlay of claim 1 , wherein the pattern is a starburst pattern.

3. The inlay of claim 1 , wherein the pattern is formed concurrently with the antenna.

4. The inlay of claim 1 , wherein the pattern is part of a same process as forming the antenna.

5. The inlay of claim 1 , wherein the inlay is 7 mm by 9 mm.

6. The inlay of claim 1 , wherein the substrate is a PET material with an aluminum laminate.

7. The inlay of claim 1 , wherein the pattern is electrically inert.

8. The inlay of claim 4 , wherein the pattern is larger than a label footprint.

9. A method of forming a matrix-less RFID inlay comprising the steps of:
providing a substrate for an inlay, a chip, and an antenna;
providing a facestock and release liner;
providing the substrate;
cutting a pattern, the pattern preventing warping of the substrate during at least one of cutting, conversion or chip attaching;
forming the antenna wherein the pattern surrounds the antenna;
attaching a chip to the antenna; and
adding a facestock and release liner over the antenna and the pattern.

10. The method of claim 9 , wherein the forming of the antenna and the pattern is done by laser ablation.

11. The method of claim 9 , wherein the pattern is a starburst pattern.

12. The method of claim 9 , wherein the facestock and liner cover the antenna and the pattern.

13. The method of claim 9 , wherein the pattern surrounds the antenna.

14. The method of claim 9 , further comprising die cutting to remove portions of facestock and substrate, and the pattern.

15. The method of claim 9 , wherein the pattern is altered as a result of a size of a label to which the inlay is coupled.

16. The method of claim 9 , wherein the pattern is formed as a loop around the antenna.

17. A RFID inlay comprising:
a matrix-less inlay substrate having a pattern;
an antenna disposed on the substrate attached to a chip, the antenna distinct from the pattern;
wherein the pattern surrounds the antenna and extends outwardly from the antenna at about 45 degrees and the pattern prevents warping of the substrate; and
the pattern and the antenna are made by a laser cutting.

Assignees

• Gladstone Sam M
• Avery Dennison Retail Information Services Llc

Inventors

• Gladstone Sam M

Classifications

• Y10T29/49016

  Antenna or wave energy "plumbing" making · CPC title

• G06K19/07718 Primary

  the record carrier being manufactured in a continuous process, e.g. using endless rolls · CPC title

• H01Q1/2225

  used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal · CPC title

• G06K19/07752

  using an interposer · CPC title

• G06K19/07749 Primary

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title