Radio frequency identification sensor assembly

Patent metadata

Field	Value
Publication number	US-9245221-B2
Application number	US-201213719387-A
Country	US
Kind code	B2
Filing date	Dec 19, 2012
Priority date	Dec 21, 2011
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

In accordance with one embodiment, an RFID sensor assembly comprises an RFID chip, an antenna, a sensor, a substrate, and a laminated layer. The RFID chip is in electrical communication with the antenna and the sensor. The RFID chip, antenna, and sensor are secured to the substrate. The laminated layer is arranged as to create a generally airtight pouch between the substrate and the laminate layer. The laminated layer is further arranged to facilitate a post manufacturing method for exposing the contents of the pouch to the environment surrounding the RFID sensor assembly.

First claim

What is claimed is:

1. A method of using an RFID sensor assembly,
providing a RFID sensor assembly including:
a chip;
an antenna;
a sensor;
at least one electrical lead;
a laminated layer;
a substrate;
wherein the chip is in electrical contact with the antenna and communication with the sensor and can measure a property of a sensor material to determine the properties or conditions of the environment surrounding the sensor;
wherein the chip, antenna, sensor, and at least one electrical lead is secured to the substrate;
wherein the laminated layer is arranged as to create a generally sealed pouch between the substrate and the laminated layer;

storing the RFID sensor assembly for a period of time;
performing a post-manufacturing process that modifies the pouch to expose only the RFID sensor assembly to the environment while the chip, antenna, and at least one electrical lead remain within the pouch between the substrate and the laminated layer;
using the sensor to determine certain properties or conditions of the environment surrounding the sensor; and
transmitting data to an RFID reader.

2. The method of using an RFID sensor assembly of claim 1 , wherein the laminated layer is only over the sensor.

3. The method of using an RFID sensor assembly of claim 1 , wherein the laminated layer is formed over the substrate, RFID chip, antenna, sensor, and at least one electrical lead.

4. The method of using an RFID sensor assembly of claim 1 , wherein the laminated layer is not formed over the sensor.

5. The method of using an RFID sensor assembly of claim 4 , further comprising applying a permeable layer directly to the sensor.

6. The method of using an RFID sensor assembly of claim 3 , wherein the pouch creates an inactive state for the RFID sensor assembly.

7. The method of using an RFID sensor assembly of claim 6 , wherein the post-manufacturing process converts the RFID sensor assembly from an inactive state to an active state for deployment or use.

8. The method of using an RFID sensor assembly of claim 3 , wherein the post-manufacturing process is cutting or trimming.

9. The method of using an RFID sensor assembly of claim 1 , wherein the RFID chip is passive.

10. The method of using an RFID sensor assembly of claim 9 , further comprising the step of powering the RFID sensor assembly by an interrogation signal sent from an RFID reader prior to the step of using the sensor to determine certain properties or conditions.

11. The method of using an RFID sensor assembly of claim 1 , wherein the RFID chip is active.

12. The method of using an RFID sensor assembly of claim 1 , wherein the RFID sensor is used to determine humidity.

13. The method of using an RFID sensor assembly of claim 12 , further comprising a step of attaching the RFID sensor assembly to a shipping container to monitor for levels of relative humidity that could be harmful to the contents of the shipping container after the step of performing.

14. The method of using an RFID sensor assembly of claim 1 , wherein the RFID sensor assembly is used to detect bio-hazardous materials.

15. The method of using an RFID sensor assembly of claim 14 , further comprising a step of providing the RFID sensor assembly as part of a public transportation system to monitor for levels of biohazardous materials that could affect the well being of its passengers after the step of performing.

16. The method of using an RFID sensor assembly of claim 1 , wherein the RFID sensor assembly is used to determine air quality.

17. The method of using an RFID sensor assembly of claim 1 , wherein the RFID sensor assembly further comprises an absorbent material.

18. The method of using an RFID sensor assembly of claim 17 , further comprising the step of treating the absorbent material with a detecting reagent prior to the step of storing the RFID sensor assembly.

19. The method of using an RFID sensor assembly of claim 18 , wherein the sensor is used for detecting a specific fluid and the specific fluid reacts with the detecting reagent to change certain properties of the sensor.

20. The method of using an RFID assembly of claim 1 , wherein modifying the pouch changes the transmission range of the antenna.

21. The method of using an RFID assembly of claim 20 , wherein the RFID antenna operates in a short range mode when the pouch is intact.

22. The method of using an RFID assembly of claim 21 , wherein the RFID antenna operates in long range mode after the pouch is modified.

23. The method of using an RFID assembly of claim 1 , wherein the post-manufacturing process that modifies the pouch is opening it manually.

24. The method of using an RFID assembly of claim 1 , wherein the post-manufacturing process that modifies the pouch is an automated process.

25. The method of using an RFID assembly of claim 24 , wherein the automated process is opening by a printer during the printing of a label on the RFID sensor assembly.

Assignees

• Avery Dennison Corp

Inventors

• Forster Ian J

Classifications

• G06K19/0717

  the sensor being capable of sensing environmental conditions such as temperature history or pressure · CPC title

• G06K19/0723 Primary

  the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title

• G06K19/07718

  the record carrier being manufactured in a continuous process, e.g. using endless rolls · CPC title

• H01L51/5237

  Electricity · mapped topic

• G06K19/0716

  at least one of the integrated circuit chips comprising a sensor or an interface to a sensor · CPC title