Heat dissipation circuit board and method for producing same
US-2015369467-A1 · Dec 24, 2015 · US
US9638400B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9638400-B2 |
| Application number | US-201314428226-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 13, 2013 |
| Priority date | Sep 14, 2012 |
| Publication date | May 2, 2017 |
| Grant date | May 2, 2017 |
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The present invention discloses a lighting module using an organic light emitting device (OLED) and particularly, a lighting module using the OLED which stably couples a power supply terminal to an electrode pad which is formed on a glass substrate of an OLED illumination plate.
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The invention claimed is: 1. An OLED lighting module, comprising: an OLED illumination plate which comprises a first surface which is formed to be entirely flat, a second surface which has a center surface and a border surface stepwisely formed around the center surface, and a transparent electrode which is formed on the stepped surface; an FPCB substrate which comprises a main substrate portion which comprises a power terminal corresponding to the center surface and coupled to a power supply and a wing substrate portion which is formed to extend from the center surface in four directions and comprises a connection terminal corresponding to the transparent electrode; a reinforcement member which has a height substantially the same as a step formed above the wing substrate portion which is attached onto the border surface; and a conductive adhesive film which is attached between the stepped surface and the wing substrate portion to electrically conduct the transparent electrode and the connection terminal. 2. The OLED lighting module of claim 1 , wherein the conductive adhesive film is an anisotropic conductive film which is attached by thermal compression to provide electrical conduction only in a direction to which a pressure is applied. 3. An OLED lighting module, comprising: an OLED illumination plate which comprises a first surface which is formed to be entirely flat, a second surface which has a center surface and a border surface stepwisely formed around the center surface, and a transparent electrode which is formed on the stepped surface; a flat panel PCB substrate which has a size corresponding to the first surface and comprises a power terminal coupled to a power supply and a connection terminal in a position corresponding to the transparent electrode; and a conductive rod which has a height of the center surface corresponding to a height of a step of the border surface and is attached to the transparent electrode of the OLED illumination plate by a conductive paste while being mounted on the connection terminal of the flat panel PCB substrate, wherein the conductive rod is formed between the connection terminal and the transparent electrode. 4. The OLED lighting module of claim 3 , wherein the conductive rod is a brass material and the conductive paste is a silver (Ag) paste. 5. The OLED lighting module of claim 3 , wherein the conductive rod is formed to be divided into a plurality of conductive rods. 6. An OLED lighting module, comprising: an OLED illumination plate which comprises a first surface which is formed to be entirely flat, a second surface which has a center surface and a border surface stepwisely formed around the center surface, and a transparent electrode which is formed on the stepped surface; a frame shaped FPCB substrate which has a shape corresponding to the stepped surface and comprises a connection terminal corresponding to the transparent electrode, and a power terminal formed to outwardly protruded; and a conductive adhesive film which is attached between the stepped surface and the frame shaped FPCB substrate to electrically conduct the transparent electrode and the connection terminal, wherein the frame shaped FPCB surrounds all of the corners of the center surface. 7. The OLED lighting module of claim 6 , wherein the conductive adhesive film is an anisotropic conductive film which is attached by thermal compression to provide electrical conduction only in a direction to which a pressure is applied. 8. The OLED lighting module of claim 6 , wherein the frame shaped FPCB substrate comprises a connecting FPCB substrate portion which has a length corresponding to a length of each side and a coupling FPCB substrate portion which couples adjacent connecting FPCB substrate portions to each other. 9. An OLED lighting module of claim 1 , wherein the wing substrate portion is bent as an L-shape to be attached onto the border surface. 10. An OLED lighting module of claim 8 , wherein the coupling FPCB substrate portion is formed in an L-shape.
Light sources comprising attachment means · CPC title
Electrode terminals · CPC title
Display · CPC title
Organic light-emitting diodes [OLED] · CPC title
using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres · CPC title
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