Photonic sintering of a polymer thick film copper conductor composition

Patent metadata

Field	Value
Publication number	US-9637647-B2
Application number	US-201514862254-A
Country	US
Kind code	B2
Filing date	Sep 23, 2015
Priority date	Aug 13, 2015
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

This invention provides a polymer thick film copper conductor composition for forming an electrical conductor and a method for using the polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.

First claim

What is claimed is:

1. A polymer thick film copper conductor composition comprising:
(a) 60 to 95 wt % copper powder possessing particles with an average particle size of 0.2 to 10 μm and a surface area/mass ratio in the range of 0.2 to 3.0 m 2 /g; dispersed in
(b) 4 to 35 wt % organic medium comprising
(1) 2-7 wt % resin at least half of which, by weight, is polyimide resin, dissolved in
(2) an organic solvent;

(c) 0.25 to 2 wt % reducing agent comprising an alcohol with no base properties; and
(d) 0.0 to 2 wt % viscosity stabilizing agent comprising a carboxylic acid containing compound;

wherein the wt % are based on the total weight of the polymer thick film copper conductor composition.

2. The polymer thick film copper conductor composition of claim 1 , wherein said reducing agent is selected from the group consisting of consisting of glycerol, ethylene glycol, diethylene glycol and mixtures thereof.

3. The polymer thick film copper conductor composition of claim 2 , wherein said reducing agent is glycerol.

4. The polymer thick film copper conductor composition of claim 1 , wherein said viscosity stabilizing agent is selected from the group consisting of oleic acid, stearic acid and mixtures thereof.

5. The polymer thick film copper conductor composition of claim 4 , wherein said viscosity stabilizing agent is oleic acid.

6. An electrical device comprising an electrical conductor formed from the polymer thick film copper conductor composition of claim 1 .

7. A method for forming an electrical conductor in an electrical circuit, comprising:
a) providing a substrate;
b) providing a polymer thick film copper conductor composition comprising:
(i) 60 to 95 wt % copper powder possessing particles with an average particle size of 0.2 to 10 μm and a surface area/mass ratio in the range of 0.2 to 3.0 m 2 /g; dispersed in
(ii) 4 to 35 wt % organic medium comprising
(1) 2-7 wt % resin at least half of which, by weight, is polyimide resin, dissolved in
(2) an organic solvent;

(iii) 0.25 to 2 wt % reducing agent comprising an alcohol with no base properties; and
(iv) 0.0 to 2 wt % viscosity stabilizing agent comprising a carboxylic acid containing compound;
wherein the wt % are based on the total weight of the polymer thick film copper conductor composition;

c) applying said polymer thick film copper conductor composition onto said substrate; and
d) subjecting said polymer thick film copper conductor composition to photonic sintering to form said electrical conductor.

8. The method of claim 7 , said method further comprising a step of drying said polymer thick film conductor composition, wherein said step of drying is carried out following step (c) but before step (d).

9. The method of claim 7 , wherein said reducing agent is selected from the group consisting of consisting of glycerol, ethylene glycol, diethylene glycol and mixtures thereof.

10. The method of claim 9 , wherein said reducing agent is glycerol.

11. The method of claim 7 , wherein said viscosity stabilizing agent is selected from the group consisting of oleic acid, stearic acid and mixtures thereof.

12. The method of claim 11 , wherein said viscosity stabilizing agent is oleic acid.

13. An electrical device comprising an electrical conductor formed by the method of claim 7 .

Assignees

• Du Pont

Inventors

• Suh Seigi

Classifications

• C08G73/1039 Primary

  comprising halogen-containing substituents · CPC title

• H05K3/102

  by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence) · CPC title

• C08G73/1067

  Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound · CPC title

• H05K2203/1157

  Using means for chemical reduction · CPC title

• C09D179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title