Compositions and methods for producing electrically conductive coordination polymers and uses thereof
US-2024018310-A1 · Jan 18, 2024 · US
Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
US9637598B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9637598-B2 |
| Application number | US-201414766433-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 3, 2014 |
| Priority date | Feb 8, 2013 |
| Publication date | May 2, 2017 |
| Grant date | May 2, 2017 |
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- Title
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Abstract
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A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of curing a thermosetting resin composition, comprising: preparing a thermosetting resin composition comprising a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound; and heating the thermosetting resin composition to be cured, wherein the thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound. 2. The method of curing the thermosetting resin composition according to claim 1 , wherein the thermosetting resin composition is heated to 50° C. or more to be cured. 3. The method of curing the thermosetting resin composition according to claim 1 , wherein the triazine thiol compound includes a compound having three or more thiol groups in one molecule. 4. The method of curing the thermosetting resin composition according to claim 1 , wherein the triazine thiol compound includes a compound having a triazine ring and a thiol group directly bound to the triazine ring. 5. The method of curing the thermosetting resin composition according claim 1 , wherein a percentage of the triazine thiol compound to an entirety of the thermosetting resin composition is within a range of 0.1 to 30% by mass. 6. The method of curing the thermosetting resin composition according to claim 1 , wherein the curing accelerator further includes imidazole. 7. The method of curing the thermosetting resin composition according to claim 1 , wherein the thermosetting resin further includes an epoxy resin.
Assignees
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Classifications
containing a filler · CPC title
Organic materials · CPC title
- C08K5/378Primary
containing heterocyclic rings · CPC title
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title
Electricity · mapped topic
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- What does patent US9637598B2 cover?
- A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.
- Who is the assignee on this patent?
- Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08K5/378. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 02 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).