Mixed alloy solder paste

Patent metadata

Field	Value
Publication number	US-9636784-B2
Application number	US-201514643868-A
Country	US
Kind code	B2
Filing date	Mar 10, 2015
Priority date	May 3, 2010
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.

First claim

The invention claimed is:

1. A solder paste, consisting of:
an amount of a first solder alloy powder between 44 wt % to less than 60 wt %;
an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and
flux;
wherein the first solder alloy powder consists of a first solder alloy that has a solidus temperature above 260° C., wherein the first solder alloy is a Bi—Ag alloy, a Bi—Ag—Y alloy, a Bi—Cu alloy, a Bi—Cu—Y alloy, a Bi—Ag—Cu alloy, or a Bi—Ag—Cu—Y alloy, wherein Y consists of Al, Au, Co, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, Sn, or Zn; and
wherein the second solder alloy powder consists of a second solder alloy that has a solidus temperature that is less than 250° C.

2. The solder paste of claim 1 , wherein the second solder alloy has a solidus temperature between 230° C. and 250° C.

3. The solder paste of claim 2 , wherein the second solder alloy is a Sn alloy, a Sn—Sb alloy, or a Sn—Sb—X (X═Ag, Al, Au, Bi, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, or Zn) alloy.

4. The solder paste of claim 1 , wherein the second solder alloy has a solidus temperature between 200° C. and 230° C.

5. The solder paste of claim 4 , wherein the second solder alloy is a Sn—Ag alloy, a Sn—Cu alloy, a Sn—Ag—X (X═Al, Au, Bi, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, or a Sn—Zn alloy.

6. The solder paste of claim 1 , wherein the second solder alloy has a solidus temperature below 200° C.

7. The solder paste of claim 6 , wherein the second solder alloy is a Sn—Bi alloy, a Sn—In alloy, a Bi—In alloy, a Sn—Bi—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, a Sn—In—X (X═Ag, Al, Au, Bi, Co, Cu, Ga, Ge, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, or a Bi—In—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy.

8. The solder paste of claim 1 , wherein the amount of the second solder alloy powder is between 2 wt % and 40 wt %.

9. The solder paste of claim 1 , wherein the second solder alloy is a Bi—Sb—Sn alloy consisting of greater than 0 wt % to 40 wt % Sb, greater than 0 wt % to 40 wt % Sn, and Bi.

10. The solder paste of claim 1 , wherein the second solder alloy is a Bi—Sb—Sn—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt or Zn) alloy consisting of greater than 0 wt % to 40 wt % Sb, greater than 0 wt % to 40 wt % Sn, greater than 0 wt % to 5 wt % X, and Bi.

11. The solder paste of claim 1 , wherein the first solder alloy is a Bi—Ag alloy, a Bi—Cu alloy, or a Bi—Ag—Cu alloy.

12. The solider paste of claim 1 , wherein the first solder alloy is a Bi—Ag—Y alloy, a Bi—Cu—Y alloy, or a Bi—Ag—Cu—Y alloy, wherein Y ranges from greater than 0 wt % to 5 wt %.

13. The solder paste of claim 1 , wherein the first solder alloy comprises from greater than 0 wt % to 20 wt % Ag with the remainder being Bi, from greater than 0 wt % to 5 wt % Cu with the remainder being Bi, or from greater than 0 wt % to 20 wt % Ag and from 0 to 5 wt % Cu, with the remainder being Bi.

14. The solder paste of claim 1 , wherein the first solder alloy comprises from 2.6 wt % to 15 wt % Ag with the remainder being Bi, from 0.2 wt % to 1.5 wt % of Cu with the remainder being Bi, or from 2.6 wt % to 15 wt % Ag, and from 0.2 wt % to 1.5 wt % Cu with the remainder being Bi.

15. The solder paste of claim 1 , wherein the solidus temperature of the first solder alloy is equal to or less than 280° C.

16. The solder paste of claim 1 , wherein:
the second solder alloy is a Bi—Sn alloy, Bi—In alloy, Bi—Sb—Sn alloy, Sn—Bi—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, a Sn—In—X (X═Ag, Al, Au, Bi, Co, Cu, Ga, Ge, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, a Bi—In—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, or a Bi—Sb—Sn—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt or Zn) alloy.

17. The solder paste of claim 1 , wherein the second solder alloy comprises a reactive component that reacts with a substrate to form an interfacial intermetallic compound layer.

18. The solder paste of claim 17 , wherein, the reactive component is present in an amount such that, after reflow, the reactive component is completely consumed into the interfacial intermetallic compound layer, or is completely consumed into the interfacial intermetallic compound layer and one or more additional intermetallic compounds inside a joint, the one or more additional intermetallic compounds consisting of one or more components of the second solder alloy and one or more components of the first solder alloy.

19. A solder paste, consisting of:
an amount of a first solder alloy powder between 44 wt % and 87 wt %;
an amount of a second solder alloy powder between 13 wt % and 48 wt %; and
flux;
wherein the first solder alloy powder consists of a first solder alloy that has a solidus temperature above 260° C., wherein the first solder alloy is a Bi—Ag alloy, a Bi—Ag—Y alloy, a Bi—Cu alloy, a Bi—Cu—Y alloy, a Bi—Ag—Cu alloy, or a Bi—Ag—Cu—Y alloy, wherein Y consists of Al, Au, Co, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, Sn, or Zn; and
wherein the second solder alloy powder consists of a second solder alloy that has a solidus temperature that is less than 250° C.

20. The solder paste of claim 19 , wherein the second solder alloy has a solidus temperature between 230° C. and 250° C.

21. The solder paste of claim 20 , wherein the second solder alloy is a Sn alloy, a Sn—Sb alloy, or a Sn—Sb—X (X═Ag, Al, Au, Bi Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, or Zn) alloy.

22. The solder paste of claim 19 , wherein the second solder alloy has a solidus temperature between 200° C. and 230° C.

23. The solder paste of claim 22 , wherein the second solder alloy is a Sn—Ag alloy, a Sn—Cu alloy, a Sn—Ag—X (X═Al, Au, Bi, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, or a Sn—Zn alloy.

24. The solder paste of claim 19 , wherein the second solder alloy has a solidus temperature below 200° C.

25. The solder paste of claim 24 , wherein the second solder alloy is a Sn—Bi alloy, a Sn—In alloy, a Bi—In alloy, Sn—Bi—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, a Sn—In—X (X═Ag, Al, Au, Bi, Co, Cu, Ga, Ge, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, or a Bi—In—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy.

26. The solder paste of claim 19 , wherein the amount of the second solder alloy powder is between 26 wt % and 40 wt %.

27. The solder paste of claim 19 , wherein the second solder alloy is a Bi—Sb—Sn alloy consisting of greater than 0 wt % to 40 wt % Sb, greater than 0 wt % to 40 wt % Sn, and Bi.

28. The solder paste of claim 19 , wherein the second solder alloy is a Bi—Sb—Sn—X (X═Ag, Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt or Zn) alloy consisting of greater than 0 wt % to 40 wt % Sb, greater than 0 wt % to 40 wt % Sn, greater than 0 wt % to 5 wt % X, and Bi.

29. The solder paste of claim 19 , wherein the first solder alloy is a Bi—Ag alloy, a Bi—Cu alloy, or a Bi—Ag—Cu alloy.

30. The solider paste of claim 19 , wherein the first solder alloy comprises is a Bi—Ag—Y alloy, a Bi—Cu—Y alloy, or a Bi—Ag—Cu—Y alloy, wherein Y ranges from greater than 0 wt % to 5 wt %.

31. The solder paste of claim 19 , wherein the first solder alloy comprises from greater than 0 wt % to 20 wt % Ag with the remainder being Bi, from greater than 0 wt % to 5 wt % Cu with the remainder

Assignees

• Indium Corp

Inventors

• Zhang Hongwen
• Lee Ning-Cheng

Classifications

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• H10W72/322

  Multilayered die-attach connectors, e.g. a coating on a top surface of a core · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title