Laser-based marking method and apparatus

US9636776B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9636776-B2
Application numberUS-201114070908-A
CountryUS
Kind codeB2
Filing dateMay 2, 2011
Priority dateMay 2, 2011
Publication dateMay 2, 2017
Grant dateMay 2, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for marking a thin workpiece is designed to prevent deformation of the workpiece. A plurality of lasers are opposed to respective opposite sides of the workpiece so as to both sides are heat treated. The lasers can operate synchronously with the respective emitted beams aligned with one another. As a result, the workpiece does not exhibit signs of deformation upon the completion of the marking. The workpiece is made either from plastic or metals and has a thickness not exceeding 2 millimeters. The lasers each are configured as either a fiber laser or a gas laser. The marking can be performed by lasers which are configured uniformly or non-uniformly and includes annealing, engraving and ablating. The marking can be performed synchronously or sequentially. The multi-surface marking could also be used to cause “distortion of the surface in a more controlled or desired fashion.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for thermally treating a workpiece, comprising energizing a first fiber laser which emits a first laser beam, thereby marking a predetermined area of a face side of the workpiece by the first laser beam; and energizing a second fiber laser generating a second laser beam heating an area of a backside of the workpiece across the predetermined area on the backside; wherein the first and second fiber lasers operate to treat the workpiece, which is made from material selected from metal or plastic and has a thickness of up to about two millimeters, so as to create a permanent mark on the workpiece without removing the material while minimizing a deformation of the workpiece. 2. The method of claim 1 , wherein the marking and heating of respective face and back sides are provided simultaneously by respective first and second laser-generated beams which are aligned. 3. The method of claim 1 , wherein the marking and heating are sequentially conducted. 4. The method of clam 1 , wherein the first and second fiber lasers each are selected from the group consisting of CW and pulsed lasers, the first and second fiber lasers providing marking and heating, respectively, being uniformly configured or non-uniformly configured. 5. The method of clam 1 further comprising controlling a laser parameter selected from the group consisting of a focal spot diameter, power on workpiece, marking speed, line spacing, repetition rate, marking direction and pulse length, and a combination thereof. 6. A laser system for thermal treating a workpiece, comprising: a mount configured to support the workpiece with a thickness of up to 2 mm and made from metal or plastic; first and second fiber lasers opposing respective face and back sides of the workpiece and operative to emit respective beams so as to mark the workpiece without removal of material and substantial deformation of the workpiece during heat treatment. 7. The laser system of claim 6 , wherein the first and second fiber lasers, heating the face and back sides of the workpiece, respectively, each are selected from the group consisting of CW and pulsed lasers. 8. The laser system of claim 6 further comprising a controller coupled to the plurality of lasers. 9. The laser system of claim 8 , wherein the controller is operative to energize the plurality of lasers simultaneously with one another so that the lasers operate synchronously and emit respective beams aligned to one another. 10. The laser system of claim 8 , wherein the controller is operative to energize the plurality of lasers simultaneously with one another so that the lasers operate asynchronously. 11. The laser system of claim 8 , wherein the controller is operative to monitor a laser operation by controlling a laser parameters which is selected from the group consisting of a focal spot diameter, power on workpiece, marking speed, line spacing, repetition rate, marking direction and pulse length, and a combination thereof.

Assignees

Inventors

Classifications

  • by direct application of electrical or wave energy; by particle radiation · CPC title

  • by shaping pulses · CPC title

  • Laser etching · CPC title

  • Process control or regulation for heat treatments · CPC title

  • Thermal after-treatment {(B29C71/0063 and B29C71/0072 take precedence)} · CPC title

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Frequently asked questions

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What does patent US9636776B2 cover?
A method for marking a thin workpiece is designed to prevent deformation of the workpiece. A plurality of lasers are opposed to respective opposite sides of the workpiece so as to both sides are heat treated. The lasers can operate synchronously with the respective emitted beams aligned with one another. As a result, the workpiece does not exhibit signs of deformation upon the completion of the…
Who is the assignee on this patent?
Dallarosa Joseph, Nemera Andrey, Ipg Photonics Corp
What technology area does this patent fall under?
Primary CPC classification B23K26/0619. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 02 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).