Deposition apparatus and deposition method

Patent metadata

Field	Value
Publication number	US-2017361404-A1
Application number	US-201615253901-A
Country	US
Kind code	A1
Filing date	Sep 1, 2016
Priority date	Jun 20, 2016
Publication date	Dec 21, 2017
Grant date	—

Abstract

A deposition apparatus and a deposition method are described. The deposition apparatus includes an accommodating element, a plurality of lasers and a carrier. The accommodating element is configured to accommodate a material. The lasers are disposed at a periphery of the accommodating element, and are configured to simultaneously emit a plurality of laser beams toward the material to melt the material to form a deposition liquid. The carrier is disposed under the accommodating element and the lasers, and are configured to carry the deposition liquid.

First claim

What is claimed is:

1 . A deposition apparatus comprising:
an accommodating element configured to accommodate a material; a plurality of lasers disposed at a periphery of the accommodating element, and configured to simultaneously emit a plurality of laser beams toward the material to melt the material into a deposition liquid; and a carrier disposed under the accommodating element and the lasers, and configured to carry the deposition liquid.

2 . The deposition apparatus of claim 1 , wherein
the material is a welding rod; and the accommodating element is a clamp, and is suitable to hold the welding rod.

3 . The deposition apparatus of claim 1 , wherein
the material is a powder; and the accommodating element is a nozzle, and is suitable to jet the powder.

4 . The deposition apparatus of claim 1 , wherein the accommodating element is a movable device, and is suitable to move in relation to the carrier.

5 . The deposition apparatus of claim 1 , wherein the carrier is a movable device, and is suitable to move in relation to the accommodating element.

6 . The deposition apparatus of claim 1 , wherein powers of the lasers range from 30 W to 1000 W.

7 . The deposition apparatus of claim 1 , wherein the lasers are equidistantly disposed at the periphery of the accommodating element.

8 . The deposition apparatus of claim 1 , further comprising a cover which is configured to cover the accommodating element and the lasers.

9 . The deposition apparatus of claim 1 , further comprising a charge-coupled device disposed on the accommodating element and configured to monitor the deposition liquid.

10 . The deposition apparatus of claim 1 , further comprising at least one gas nozzle, wherein a bottom of the accommodating element has a material supplying hole, the at least one gas nozzle is disposed on the bottom of the accommodating element and is located outside the material supplying hole, and the at least one gas nozzle is configured to jet an inert gas to form a gas wall surrounding the material supplying hole.

11 . A deposition method comprising:
supplying a material by using a material supplying hole in a bottom of an accommodating element; emitting a plurality of laser beams toward the material simultaneously under the bottom of the accommodating element to melt the material into a deposition liquid; and carrying the deposition liquid by using a carrier.

12 . The deposition method of claim 11 , wherein the material is a welding rod, the accommodating element is a clamp, and the welding rod is held in the material supplying hole.

13 . The deposition method of claim 11 , wherein the material is a powder, and the accommodating element is a nozzle, and the powder is jetted from the material supplying hole.

14 . The deposition method of claim 11 , wherein emitting laser beams toward the material simultaneously comprises using a plurality of lasers to emit the laser beams, and powers of the lasers range from 30 W to 1000 W.

15 . The deposition method of claim 14 , wherein the lasers are disposed at a periphery of the accommodating element, and are equidistantly disposed at the periphery.

16 . The deposition method of claim 14 , further comprising using a cover to cover the accommodating element and the lasers.

17 . The deposition method of claim 11 , wherein supplying the material comprises using at least one nozzle to jet an inert gas to form a gas wall surrounding the material supplying hole.

18 . The deposition method of claim 11 , wherein carrying the deposition liquid by using the carrier comprises moving the carrier in relation to the accommodating element according to a predetermined pattern.

19 . The deposition method of claim 11 , wherein carrying the deposition liquid by using the carrier comprises moving the accommodating element in relation to the carrier according to a predetermined pattern.

20 . The deposition method of claim 11 , wherein carrying the deposition liquid by using the carrier comprises using a charge-coupled device to monitor the deposition liquid.

Assignees

• Univ Nat Cheng Kung

Inventors

• Huang Chi-Chuan
• Yang Chane-Yuan
• Lin Tzu-Hsiang

Classifications

• B22F10/22

  Direct deposition of molten metal · CPC title

• B22F12/90

  Means for process control, e.g. cameras or sensors · CPC title

• B22F10/36

  of energy beam parameters · CPC title

• B22F12/45

  Two or more · CPC title

• B22F12/53

  Nozzles · CPC title