Image sensors with interconnects in cover layer

Patent metadata

Field	Value
Publication number	US-9635228-B2
Application number	US-201414466770-A
Country	US
Kind code	B2
Filing date	Aug 22, 2014
Priority date	Aug 27, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

An image sensor die may include a pixel array formed in an image sensor substrate and covered by a transparent cover layer. The transparent cover layer may be attached to the image sensor substrate using adhesive. Electrical interconnect structures such as conductive vias may be formed in the transparent cover layer and may be used in conveying electrical signals between the image sensor and a printed circuit board. The conductive vias may have one end coupled to a bond pad on the upper surface of the transparent cover layer and an opposing end coupled to a bond pad on the upper surface of the image sensor substrate. The conductive vias may pass through openings that extend through the transparent cover layer and the adhesive. Conductive structures such as wire bonds, stud bumps, or solder balls may be coupled to the bond pads on the surface of the transparent cover layer.

First claim

What is claimed is:

1. An imaging system, comprising:
an image sensor having an array of image sensor pixels formed in a front surface of an image sensor substrate;
a transparent cover layer formed over the array of image sensor pixels, wherein the transparent cover layer comprises a first plurality of openings and a second plurality of openings; and
first conductive structures formed in the first plurality of openings and second conductive structures formed in the second plurality of openings, wherein the first conductive structures convey image data from the image sensor and wherein the second conductive structures control a flow of a fluid over the array of image sensor pixels.

2. The imaging system defined in claim 1 wherein the transparent cover layer transmits light corresponding to a first range of wavelengths and blocks light corresponding to a second range of wavelengths.

3. The imaging system defined in claim 1 wherein the transparent cover layer comprises opposing exterior and interior surfaces, wherein the second conductive structures comprise first and second electrodes formed on the interior surface of the transparent cover layer, and wherein the first and second electrodes have opposite polarity.

4. The imaging system defined in claim 1 further comprising:
an adhesive interposed between the image sensor substrate and the transparent cover layer, wherein the adhesive attaches the transparent cover layer to the image sensor substrate.

5. The imaging system defined in claim 4 wherein each of the first conductive structures comprises a conductive via that passes through an opening that extends through the transparent cover layer and the adhesive.

6. The imaging system defined in claim 5 wherein the conductive via comprises a conductive material that fills the opening.

7. The imaging system defined in claim 5 wherein the conductive via comprises a conductive material that lines the opening.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Borthakur Swarnal
• Lee Nathan
• Perkins Andrew
• Sulfridge Marc

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title