System in package fan out stacking architecture and process flow

Patent metadata

Field	Value
Publication number	US-9633974-B2
Application number	US-201514638925-A
Country	US
Kind code	B2
Filing date	Mar 4, 2015
Priority date	Mar 4, 2015
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL.

First claim

What is claimed is:

1. A package comprising:
a first die including a bottom surface that includes a first contact pad and a passivation layer;
a first redistribution layer (RDL);
wherein the first die is attached to a front side of the first RDL such that the front side of the first RDL is directly on the first contact pad and the passivation layer;
a first molding compound encapsulating the first die on the front side of the first RDL;
a top surface of a second die attached to a back side of the first RDL with a die attach film such that the second die is facing back to the first RDL;
a second RDL;
a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL;
a second molding compound encapsulating the second die and the plurality of conductive pillars between the back side of the first RDL and the front side of the second RDL.

2. The package of claim 1 , further comprising a plurality of conductive bumps on a back side of the second RDL.

3. The package of claim 1 , wherein the first molding compound does not completely cover a top surface of the first die.

4. The package of claim 3 , wherein the second molding compound does not completely cover a bottom surface of the second die adjacent the second RDL.

5. The package of claim 1 , wherein the second RDL comprises a second redistribution line formed directly on one of the plurality of conductive pillars.

6. The package of claim 5 , wherein the die attach film is a cured film.

7. The package of claim 5 , wherein the second RDL comprises a third redistribution line formed directly on a conductive contact of the second die.

8. The package of claim 5 , wherein a bottom surface of a conductive contact of the second die, and bottom surfaces of the plurality of conductive pillars are coplanar.

9. A package comprising:
a first element including a bottom surface that includes a first contact pad and a passivation layer;
a first redistribution layer (RDL);
wherein the first element is attached to a front side of the first RDL such that the front side of the first RDL is directly on the first contact pad and the passivation layer;
a first molding compound encapsulating the first element on the front side of the first RDL;
a top surface of a second die attached to a back side of the first RDL with a die attach film such that the second die is facing back to the first RDL;
a second RDL;
a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL;
a second molding compound encapsulating the second die and the plurality of conductive pillars between the back side of the first RDL and the front side of the second RDL.

10. The package of claim 9 , wherein the second die is a logic die.

11. The package of claim 10 , wherein the first element is a memory die.

12. The package of claim 9 , wherein the first RDL is less than 50 μm thick.

13. The package of claim 9 , wherein the second RDL is less than 50 μm thick.

14. The package of claim 9 , wherein the second RDL comprises a second redistribution line formed directly on one of the plurality of conductive pillars.

15. The package of claim 9 , wherein the second RDL comprises redistribution lines formed directly on one of the plurality of conductive pillars, and directly on a conductive contact of the second die.

16. The package of claim 15 , wherein the die attach film is a cured film.

Assignees

• Apple Inc

Inventors

• Zhai Jun
• Hu Kunzhong
• Lai Kwan-Yu
• Pang Mengzhi
• Zhong Chonghua
• Yang Se Young

Classifications

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/721

  of bump connectors · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title