Wafer container with door mounted shipping cushions

Patent metadata

Field	Value
Publication number	US-9633877-B2
Application number	US-201314398959-A
Country	US
Kind code	B2
Filing date	May 6, 2013
Priority date	May 4, 2012
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A cushioned wafer container system having removable wafer cushions for transporting large-diameter wafers. The system includes a wafer container enclosure defining a front opening and including a rear wall, and a plurality of wafer supports defining a plurality of slots; a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side; a primary wafer cushion coupled to a rear side of the front door at a central portion of the front door, the primary wafer cushion defining a plurality of wafer grooves, each of the grooves of the primary wafer cushion aligned with a slot of the wafer supports; and a first removable wafer cushion attachable to the rear side of the front door adjacent the primary wafer cushion, the first removable wafer cushion defining a plurality of wafer-receiving grooves in alignment with the grooves and slots.

First claim

What is claimed is:

1. A cushioned wafer container system having removable wafer cushions for transporting large-diameter wafers, the system comprising:
a wafer container enclosure configured to contain a plurality of semiconductor wafers, each wafer including a wafer periphery defining a first, second, third, and fourth quadrant, the wafer container defining a front opening and comprising a rear wall, and a plurality of wafer supports defining a plurality of slots for receiving edge portions of a plurality of wafers, the wafer supports supporting a first portion of a first quadrant periphery of the wafer and a first portion of a fourth quadrant periphery of the wafer;
a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side, the rear side presenting itself to an interior of the wafer enclosure;
a primary wafer cushion coupled to the rear side of the front door at a central portion of the front door, the primary wafer cushion defining a plurality of wafer grooves configured to receive and support a second portion of the first quadrant periphery of the wafer and a second portion of the fourth quadrant periphery of the wafer, each of the grooves of the primary wafer cushion aligned with a slot of the wafer supports;
a first removable wafer cushion separate from the primary wafer cushion and attachable to the rear side of the front door adjacent a first side of the primary wafer cushion, the first removable wafer cushion defining a plurality of wafer-receiving grooves in alignment with the grooves of the primary wafer cushions and the wafer support slots, the first removable wafer cushion configured to support a third portion of the first quadrant periphery of the wafer; and wafer support slots, the second removable wafer cushion configured to support a third portion of the fourth quadrant periphery of the wafer,
wherein the first quadrant periphery includes a fourth, unsupported portion, the fourth unsupported portion having a peripheral length less than a peripheral length of the third portion supported by the first removable wafer cushion.

2. The system of claim 1 , wherein the first removable wafer cushion includes a plurality of wafer engagement portions formed at an apex of the grooves and configured to engage an edge of one of the plurality of wafers when the wafer enclosure is oriented in a vertical shipping position.

3. The system of claim 1 , wherein the first removable wafer cushion includes a plurality of attachment tabs attaching the first wafer cushion to the rear side of the door.

4. The system of claim 3 , wherein the plurality of attachment tabs are received by a plurality of apertures in a vertical bulkhead of the door.

5. The system of claim 1 , wherein the first removable wafer cushion presents a leading each edge that is parallel and adjacent to lateral margins of the primary wafer cushion.

6. The system of claim 1 , further comprising a rear removable wafer cushion attached to the rear wall of the wafer enclosure and configured to engage and support portions of the wafers.

7. The system of claim 1 , wherein the first removable wafer cushion is removably attached to the rear side of the door.

8. The system of claim 1 , wherein the first and second removable cushions are configured to support a majority those peripheral portions of the wafer not supported by the primary cushion or the wafer supports, in the first and fourth quadrants of the wafer.

9. A cushioned wafer container system, comprising
a wafer container enclosure configured to contain a plurality of semiconductor wafers, the wafer container defining a front opening and comprising a rear wall, and a plurality of wafer supports defining a plurality of slots for receiving edge portions of a plurality of wafers;
a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side, the rear side presenting itself to an interior of the wafer enclosure;
a first wafer cushion removably attachable to a rear side of the front door, the first wafer cushion defining a plurality of wafer grooves for receiving edge portions of the plurality of wafers, each of the grooves of the first wafer cushion aligned with a slot of the wafer supports, the first wafer cushion configured to engage and support a plurality of wafers in a horizontal position; and
a second wafer cushion separate from the first wafer cushion and removably attachable to a rear side of the front door, the first wafer cushion defining a plurality of wafer grooves for receiving edge portions of the plurality of wafers, each of the grooves of the second wafer cushion aligned with a slot of the wafer supports, the second wafer cushion configured to engage and support the plurality of wafers in a vertical position, the second wafer cushion being selectively attachable to the rear side of the front door separately from the first wafer cushion;
wherein the front door is configured to receive either the first wafer cushion or the second wafer cushion.

10. The cushioned wafer container system of claim 9 , wherein the first wafer cushion comprises a primary wafer cushion attached to the door during a fabrication process.

11. The cushioned wafer container system of claim 9 , wherein the second wafer cushion is attached to the door during shipment.

12. The cushioned wafer container system of claim 9 , wherein the first wafer cushion includes a first plurality of engagement portions for engaging edge portions of the plurality of wafers, and the second wafer cushion includes a second plurality of engagement portions for engaging edge portions of the plurality of wafers.

13. The cushioned wafer container system of claim 12 , wherein each of the plurality of second engagement portions of the second wafer cushion engages a greater circumferential portion of each of the plurality of wafers as compared to the circumferential portion of each of the plurality of wafers as engaged by the first engagement portions of the first wafer cushion.

14. The cushioned wafer container system of claim 9 , wherein the second wafer cushion extends laterally, away from a center of the door, a distance that is greater than a lateral distance extended by the first wafer cushion.

15. A cushioned wafer container system having removable wafer cushions for transporting large-diameter wafers, the system comprising:
a wafer container enclosure configured to contain a plurality of semiconductor wafers, each wafer including a wafer periphery defining a first, second, third, and fourth quadrant, the wafer container defining a front opening and comprising a rear wall, and a plurality of wafer supports defining a plurality of slots for receiving edge portions of a plurality of wafers, the wafer supports supporting a first portion of a first quadrant periphery of the wafer and a first portion of a fourth quadrant periphery of the wafer;
a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side, the rear side presenting itself to an interior of the wafer enclosure;
a primary wafer cushion coupled to a rear side of the front door at a central portion of the front door, the primary wafer cushion defining a plurality of wafer grooves configured to receive and support a second portion of the first quadrant periphery of the wafer and a second portion of the fourth quadrant periphery of the wafer, each of the grooves of the primary wafer cushion aligned with a slot of the wafer supports;
a first removable wafer cushion separate from the primary wafer cushion and engageable with

Assignees

• Entegris Inc

Inventors

• Gregerson Barry

Classifications

• H10P72/1921

  characterised by substrate supports · CPC title

• H10P72/1912 Primary

  characterised by shock absorbing elements, e.g. retainers or cushions · CPC title

• H01L21/67369 Primary

  Electricity · mapped topic

• H01L21/67383

  Electricity · mapped topic

• H10P72/123

  characterised by a material, a roughness, a coating or the like · CPC title