Atomic layer deposition carousel with continuous rotation and methods of use

Patent metadata

Field	Value
Publication number	US-9631277-B2
Application number	US-201113189719-A
Country	US
Kind code	B2
Filing date	Jul 25, 2011
Priority date	Mar 1, 2011
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

Provided are atomic layer deposition apparatus and methods including a rotating wheel with a plurality of substrate carriers for continuous processing of substrates. The processing chamber may have a loading station on the front end which is configured with one or more robots to load and unload substrates from the substrate carriers without needing to stop the rotating wheel.

First claim

What is claimed is:

1. A deposition system for processing a plurality of substrates, comprising:
a processing chamber;
a rotatable wheel disposed inside the processing chamber, the wheel having a plurality of circumferentially distributed substrate carriers to carry one of the plurality of substrates, the substrate carriers having a set of lift pins configured to move between a lower position to seat a wafer on a surface of the substrate carrier and a position extended above a surface of the substrate carrier to lift a wafer above the surface of the substrate carrier;
a plurality of gas distribution plates circumferentially arranged in the processing chamber such that each of the plurality of circumferentially distributed substrate carriers pass under the plurality of gas distribution plates as the rotatable wheel rotates, each of the plurality of gas distribution plates including a plurality of elongate gas ports to direct flows of gases toward the plurality of substrate carriers;
a loading station on a front end of and within the processing chamber having a first multi-jointed robot mounted within the loading station to load one of the plurality of substrates onto one of the plurality of substrate carriers and a second multi-jointed robot mounted within the loading station to unload another of the plurality of substrates from one of the plurality of substrate carriers, wherein the first robot and the second robot follow the motion of the rotating wheel while loading and unloading; and
a controller configured to rotate the rotatable wheel and to move the first multi-jointed robot and the second multi-jointed robot to follow the motion of the rotating wheel to load and unload wafers from the lift pins without slowing the rotation of the rotatable wheel, the controller further configured to raise and lower the set of lift pins to raise and lower a wafer from the surface of the substrate carrier to allow the first multi-jointed robot and the second multi-jointed robot to load and unload wafers from the substrate carriers without slowing the rotation of the rotatable wheel.

2. The deposition system of claim 1 , wherein the loading station is isolated from ambient environment.

3. The deposition system of claim 1 , further comprising at least one load lock chamber on a front end of the loading station, the load lock chamber isolating the loading station and the processing chamber from the ambient environment.

4. The deposition system of claim 1 , wherein there are two load lock chambers, a first load lock chamber to introduce substrates to the loading station from the ambient environment and a second load lock chamber to remove processed substrates from the loading station.

5. The deposition system of claim 1 , wherein each of the plurality of substrate carriers rotates in addition to the rotation of the rotatable wheel while the rotatable wheel is rotating.

6. The deposition system of claim 5 , wherein the substrate carriers are configured to rotate the substrate in a direction opposite the direction of rotation of the rotatable wheel.

7. The deposition system of claim 6 , wherein the substrate carriers are configured to rotate in the opposite direction at a speed sufficient so that a wafer passing the gas distribution plate would have equal residence times at an inner radius and an outer radius of the wafer.

8. The deposition system of claim 1 , wherein the plurality of gas distribution plates deposits different layers on the substrate.

9. The deposition system of claim 1 , further comprising a substrate carrier cleaning station in the processing chamber, and a substrate heating station circumferentially arranged in the processing chamber such that each of the plurality of circumferentially distributed substrate carriers pass under the substrate heating station as the rotatable wheel rotates.

10. The deposition system of claim 9 , wherein the substrate carrier cleaning station is circumferentially arranged in the processing chamber with the gas distribution plates and the substrate heating station.

11. The deposition system of claim 1 , further comprising a heating station circumferentially arranged within the processing chamber with the plurality of gas distribution plates such that each of the plurality of circumferentially distributed substrate carriers pass under the heating station.

12. The deposition system of claim 11 , wherein the heating station comprises a radiant heat source directed at a top surface of the substrate carriers.

13. The deposition system of claim 11 , further comprising a radiant heat source under the substrate carriers.

14. The deposition system of claim 1 , wherein the loading station further comprises a first substrate buffer region accessible to the first robot and a second substrate buffer region accessible to the second robot.

Assignees

• Yudovsky Joseph
• Applied Materials Inc

Inventors

• Yudovsky Joseph

Classifications

• C23C16/45578

  Elongated nozzles, tubes with holes · CPC title

• C23C16/45551

  for relative movement of the substrate and the gas injectors or half-reaction reactor compartments · CPC title

• C23C16/458 Primary

  characterised by the method used for supporting substrates in the reaction chamber · CPC title

• C23C16/54

  Apparatus specially adapted for continuous coating · CPC title

• C23C16/44 Primary

  characterised by the method of coating (C23C16/04 takes precedence) · CPC title