Curing agents for low-emission epoxy resin products

US9631047B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9631047-B2
Application numberUS-201314759538-A
CountryUS
Kind codeB2
Filing dateDec 20, 2013
Priority dateJan 8, 2013
Publication dateApr 25, 2017
Grant dateApr 25, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to curing agents for epoxy resins, containing at least one adduct of a primary diamine and an aromatic monoepoxide, at least one primary diamine and at least one secondary diamine which is free of primary amino groups and free of hydroxyl groups. The curing agent is of low viscosity and cures, together with epoxy resins, rapidly and without blushing, even under damp, cold conditions, to form films of high hardness and low brittleness. It is particularly well suited for low-emission coatings that cure at room temperature.

First claim

Opening claim text (preview).

The invention claimed is: 1. A curing agent, suitable for curing epoxy resins, comprising: at least one adduct of at least one primary diamine P1 and at least one aromatic monoepoxide, wherein the adduct is a reaction product of the at least one primary diamine P1 with the at least one aromatic monoepoxide in a ratio of moles of the at least one primary diamine P1 to moles of the at least one aromatic monoepoxide ranging from 1/1 to 1/1.5; at least one primary diamine P2; and at least one secondary diamine, which is 1,3-bis(2-ethylhexylaminomethyl)benzene or 1,3-bis(2-phenylethylaminomethyl)benzene. 2. The curing agent according to claim 1 , wherein the monoepoxide is a cresyl glycidyl ether. 3. The curing agent according to claim 1 , wherein the primary diamine P1 is selected from the group consisting of 1,6-hexanediamine, 1,5-diamino-2-methylpentane, 2,2,4- and 2,4,4-trimethylhexamethylenediamine, isophoronediamine, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 2- and 4-methyl-1,3-diaminocyclohexane and mixtures thereof, and 1,3-bis(aminomethyl)benzene. 4. The curing agent according to claim 1 , wherein the adduct is a reaction product of 1,5-diamino-2-methylpentane with a cresyl glycidyl ether in a ratio of moles of the 1,5-diamino-2-methylpentane to moles of the cresyl glycidyl ether ranging from 1/1 to 1/1.2. 5. The curing agent according to claim 1 , wherein the primary diamine P2 has a molecular weight ranging from 140 to 300 g/mol, and is selected from the group consisting of isophoronediamine, 2,2,4- and 2,4,4-trimethylhexamethylenediamine, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, 4,7-dioxadecane-1,10-diamine, polyoxypropylenediamines and cycloaliphatic ether group-containing diamines from the propoxylation and subsequent amination of 1,4-dimethylolcyclohexane. 6. The curing agent according to claim 5 , wherein the primary diamine P2 is a polyoxypropylenediamine or a cycloaliphatic ether group-containing diamine from the propoxylation and subsequent amination of 1,4-dimethylolcyclohexane. 7. The curing agent according to claim 1 , wherein the ratios of the at least one adduct, the at least one primary diamine P2 and the at least one secondary diamine are such that, of the total number of amine hydrogens thereof that are reactive to epoxy groups, 15 to 75% are from the at least one adduct, 15 to 60% are from the at least one primary diamine P2, and 10 to 40% are from the at least one secondary diamine. 8. An epoxy resin composition containing at least one epoxy resin and at least one curing agent according to claim 1 . 9. The epoxy resin composition according to claim 8 , being a two-component composition, consisting of: (i) a resin component containing at least one epoxy resin and (ii) a curing agent component containing the curing agent. 10. A cured composition obtained by curing a composition according to claim 8 . 11. A curing agent, suitable for curing epoxy resins, comprising: at least one adduct of at least one primary diamine P1 and at least one aromatic monoepoxide; at least one primary diamine P2; and at least one secondary diamine, which is 1,3-bis(2-ethylhexylaminomethyl)benzene or 1,3-bis(2-phenylethylaminomethyl)benzene. 12. The curing agent according to claim 11 , wherein the monoepoxide is a cresyl glycidyl ether. 13. The curing agent according to claim 12 , wherein the primary diamine P1 is selected from the group consisting of 1,6-hexanediamine, 1,5-diamino-2-methylpentane, 2,2,4- and 2,4,4-trimethylhexamethylenediamine, isophoronediamine, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 2- and 4-methyl-1,3-diaminocyclohexane and mixtures thereof, and 1,3-bis(aminomethyl)benzene. 14. The curing agent according to claim 13 , wherein the adduct is a reaction product of 1,5-diamino-2-methylpentane with a cresyl glycidyl ether in a ratio of moles of the 1,5-diamino-2-methylpentane to moles of the cresyl glycidyl ether ranging from 1/0.9 to 1/1.2.

Assignees

Inventors

Classifications

  • C08G59/56Primary

    together with other curing agents · CPC title

  • C08G59/184Primary

    with amines · CPC title

  • Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

  • containing nitrogen, e.g. polyetheramines or Jeffamines(r) · CPC title

  • together with monoepoxy compounds · CPC title

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What does patent US9631047B2 cover?
The present invention relates to curing agents for epoxy resins, containing at least one adduct of a primary diamine and an aromatic monoepoxide, at least one primary diamine and at least one secondary diamine which is free of primary amino groups and free of hydroxyl groups. The curing agent is of low viscosity and cures, together with epoxy resins, rapidly and without blushing, even under dam…
Who is the assignee on this patent?
Sika Tech Ag
What technology area does this patent fall under?
Primary CPC classification C08G59/56. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 25 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).