Phosphorus-nitrogen-silicon-containing polymeric flame retardant and preparation method and application thereof
US-10844170-B2 · Nov 24, 2020 · US
together with monoepoxy compounds
together with monoepoxy compounds · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/223 |
| Official title | {together with monoepoxy compounds} |
| Display label | together with monoepoxy compounds |
| Total patents | 166 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 7 |
| 2017 | 14 |
| 2018 | 5 |
| 2019 | 15 |
| 2020 | 13 |
| 2021 | 14 |
| 2022 | 23 |
| 2023 | 16 |
| 2024 | 25 |
| 2025 | 22 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electrochromic multi-layer devices with cross-linked ion conducting polymer
US-2020354509-A1 · Nov 12, 2020 · US
Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material
US-2020325398-A1 · Oct 15, 2020 · US
Method of producing epoxy compound and catalyst composition for epoxidation reaction
US-10730846-B2 · Aug 4, 2020 · US
Electrochromic multi-layer devices with cross-linked ion conducting polymer
US-10723835-B2 · Jul 28, 2020 · US
Composition for encapsulating organic electronic element
US-2020127206-A1 · Apr 23, 2020 · US
Encapsulating composition
US-2020095455-A1 · Mar 26, 2020 · US
Conductive paste composition, device comprising electrode formed from same, and method for producing conductive paste composition
US-2020095370-A1 · Mar 26, 2020 · US
Encapsulating composition
US-2020095456-A1 · Mar 26, 2020 · US
A Resin Formulation and Uses Thereof
US-2020087443-A1 · Mar 19, 2020 · US
Automotive parts and processes for producing the same
US-2020079972-A1 · Mar 12, 2020 · US
Photocurable resin composition, adhesive, stacked structure, method for fabricating the stacked structure, and display device
US-2020040131-A1 · Feb 6, 2020 · US
Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same
US-10501618-B2 · Dec 10, 2019 · US
Cationically photopolymerizable composition, bonding method, electronic device, method for manufacturing electronic device, display device and method for manufacturing display device
US-10487250-B2 · Nov 26, 2019 · US
Heat-Curable Hybrid Epoxy Functional Composition and Transparent Heat-Cured Caustic-Resistant Coatings Prepared Therefrom
US-2019345286-A1 · Nov 14, 2019 · US
Curing agent for epoxy resins, and epoxy resin composition obtained using same
US-10435583-B2 · Oct 8, 2019 · US
Encapsulating composition
US-2019300746-A1 · Oct 3, 2019 · US
Phosphorus-nitrogen-silicon-containing polymeric flame retardant and preparation method and application thereof
US-2019276599-A1 · Sep 12, 2019 · US
Adhesive composition
US-2019225740-A1 · Jul 25, 2019 · US
Epoxy resin composition and electro-conductive adhesive containing the same
US-2019177582-A1 · Jun 13, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/223?
- CPC C08G59/223 is the Cooperative Patent Classification code for “together with monoepoxy compounds.”
- How many patents are filed under CPC C08G59/223 (together with monoepoxy compounds)?
- Our database includes 166 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/223 growing?
- Publication counts under this code: 25 in 2024 vs 22 in 2025 (latest complete years).