Stamp structures and transfer methods using the same

Patent metadata

Field	Value
Publication number	US-9630440-B2
Application number	US-201314078763-A
Country	US
Kind code	B2
Filing date	Nov 13, 2013
Priority date	Nov 14, 2012
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A stamp structure includes a stamp frame having a plate part. The plate part includes a plurality of holes. The plurality of holes are configured to facilitate the adsorption of an object to the plate part during a transfer of the object from a donor substrate to a target substrate.

First claim

What is claimed is:

1. A stamp structure comprising:
a stamp frame having a plate part and a membrane on one side of the plate part, the stamp frame including a plurality of holes passing through the plate part, the plate part including a rigid material, and the membrane including a material more flexible than the rigid material,
wherein the plurality of holes are configured to facilitate the adsorption of an object to directly contact one of the plate part and the membrane during a transfer of the object from a donor substrate to a target substrate,
wherein the plate part has a first and second surface, the first surface facing the object during the transfer of the object and the second surface opposite the first surface, and
wherein the membrane contacts one of the first and second surfaces, the plurality of holes passing through the plate part and the membrane when the membrane contacts the first surface.

2. The stamp structure of claim 1 , wherein the plurality of holes include cylindrical holes or slit-shaped holes.

3. The stamp structure of claim 1 , wherein the stamp frame includes one of PMMS (poly(methyl-p-methoxyphenylsilylene), PC (polycarbonate), PU (polyurethane), PUA (polyurethane acrylate), glass, quartz, and metal.

4. The stamp structure of claim 1 , wherein the first surface includes alternating concave portions and convex portions.

5. The stamp structure of claim 1 , wherein the membrane contacts the second surface and covers the plurality of holes.

6. The stamp structure of claim 1 , wherein a bottom of the plate part is configured to face the object during the transfer of the object, the bottom of the plate part including alternating concave portions and convex portions.

7. The stamp structure of claim 1 , wherein the stamp frame and the plate part form an integral structure.

8. A transfer method comprising:
preparing a stamp structure, the stamp structure including a stamp frame, the stamp frame having a plate part and a membrane on one side of the plate part, the stamp frame including a plurality of holes passing through the plate part, the plate part including a rigid material and the membrane including a material more flexible than the rigid material;
attaching the stamp structure to a plurality of objects on a donor substrate to separate the plurality of objects from the donor substrate, the stamp structure directly contacting the plurality of objects and each of the plurality of objects being adsorbed to at least one of the plurality of holes; and
moving the plurality of objects simultaneously to a target substrate and separating the stamp structure from the plurality of objects,
wherein the plate part has a first and second surface, the first surface facing the plurality of objects and the second surface opposite the first surface, and
wherein the membrane contacts one of the first and second surfaces, the plurality of holes passing through the plate part and the membrane when the membrane contacts the first surface.

9. The transfer method of claim 8 , wherein the preparing includes forming the plurality of holes to include at least one of cylindrical holes and slit-shaped holes.

10. The transfer method of claim 8 , wherein the attaching includes aligning the stamp structure with the plurality of objects such that at least one of the plurality of holes corresponds to a respective one of the plurality of objects.

11. The transfer method of claim 8 , wherein the attaching includes aligning the stamp structure with the plurality of objects such that at least two of the plurality of holes correspond to a respective one of the plurality of objects.

12. The transfer method of claim 8 , wherein the attaching includes a vacuum compression method of inhaling air through the plurality of holes.

13. The transfer method of claim 8 , wherein the separating the stamp structure from the plurality of objects includes an air pressing method of injecting air through the plurality of holes.

14. The transfer method of claim 8 , wherein the attaching includes an intermolecular force between the membrane and the plurality of objects.

15. The transfer method of claim 14 , wherein the separating the stamp structure from the plurality of objects includes an air pressing method of injecting air through the plurality of holes.

16. The transfer method of claim 8 , wherein the preparing prepares the stamp frame and the plate part as an integral structure.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Yang Ki-Yeon
• Nam Yun-Woo

Classifications

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• B41N6/00 Primary

  Mounting boards; {Sleeves} Make-ready devices, e.g. underlays, overlays; Attaching by chemical means, e.g. vulcanising · CPC title

• H01L21/6838

  Electricity · mapped topic

• H10P76/204 Primary

  of organic photoresist masks · CPC title