Method of manufacturing display device

Patent metadata

Field	Value
Publication number	US-9630389-B2
Application number	US-201314139997-A
Country	US
Kind code	B2
Filing date	Dec 24, 2013
Priority date	Jan 8, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

According to one embodiment, a method of manufacturing a display device, includes preparing a first substrate in which a first display element part, a first extension part, a second display element part, and a second extension part, are formed, preparing a second substrate in which a first peeling auxiliary layer, a second peeling auxiliary layer, a sacrifice layer, a first color filter layer, and a second color filter layer, are formed, attaching the first substrate and the second substrate, and radiating a laser beam on the second substrate, and peeling a second support substrate from the first peeling auxiliary layer and the second peeling auxiliary layer while blocking the laser beam by the sacrifice layer.

First claim

What is claimed is:

1. A method of manufacturing a display device, comprising:
preparing a first substrate comprising a first support substrate, a first display element part including a first display element, a first extension part including a first mounting portion, a second display element part including a second display element, and a second extension part including a second mounting portion, the first display element part and the first extension part being located in a first region above the first support substrate, and the second display element part and the second extension part being located in a second region neighboring the first region above the first support substrate;
preparing a second substrate comprising a second support substrate, a first peeling auxiliary layer opposed to the first display element part, a second peeling auxiliary layer opposed to the second display element part and spaced apart from the first peeling auxiliary layer, and a sacrifice layer opposed to the first extension part and the second extension part, the first peeling auxiliary layer, the second peeling auxiliary layer, and the sacrifice layer being located above the second support substrate;
attaching the first substrate to the second substrate in a state in which the first extension part and the second extension part are opposed to the sacrifice layer, the first display element part is opposed to the first peeling auxiliary layer, and the second display element part is opposed to the second peeling auxiliary layer; and
radiating a laser beam on the second substrate, and peeling the second support substrate from the first peeling auxiliary layer and the second peeling auxiliary layer while blocking the laser beam by the sacrifice layer.

2. The method of claim 1 , wherein the first peeling auxiliary layer and the second peeling auxiliary layer are formed of a material consisting mainly of polyimide, and the sacrifice layer is formed of a material which consists mainly of polyimide and in which a coloring material having a higher energy absorption efficiency of the laser beam than the first peeling auxiliary layer and the second peeling auxiliary layer is dispersed.

3. The method of claim 1 , wherein in preparing the first substrate, a first color filter layer located above the first peeling auxiliary layer and a second color filter layer located above the second peeling auxiliary layer are formed,
each of the first color filter layer and the second color filter layer includes a red color filter, a green color filter, a blue color filter and a black matrix, and
the sacrifice layer is formed of the same material, and at the same time, as the black matrix.

4. The method of claim 1 , wherein a thickness of the sacrifice layer is less than a thickness of each of the first peeling auxiliary layer and the second peeling auxiliary layer.

5. The method of claim 1 , wherein in a step of preparing the first substrate, a third peeling auxiliary layer, which continuously extends over the first region and the second region above the first support substrate, is formed, and then the first display element part and the first extension part are formed in the first region above the third peeling auxiliary layer, and the second display element part and the second extension part are formed in the second region above the third peeling auxiliary layer.

6. The method of claim 5 , further comprising:
cutting the first substrate between the first region and the second region, after peeling the second support substrate; and
radiating a laser beam on the first substrate in each of the first region and the second region which are cut, and peeling the first support substrate from the third peeling auxiliary layer.

7. The method of claim 1 , wherein in a step of preparing the first substrate, a third peeling auxiliary layer and a fourth peeling auxiliary layer, which is spaced apart from the third peeling auxiliary layer, are formed above the first support substrate, and then the first display element part and the first mounting portion are formed above the third peeling auxiliary layer, and the second display element part and the second mounting portion are formed above the fourth peeling auxiliary layer.

8. The method of claim 7 , further comprising peeling the first support substrate from the third peeling auxiliary layer and the fourth peeling auxiliary layer by radiating a laser beam on the first substrate.

9. The method of claim 1 , wherein the sacrifice layer is formed of a metallic material.

10. The method of claim 9 , wherein a thickness of the sacrifice layer is 50 nm to 500 nm.

11. The method of claim 1 , wherein the sacrifice layer is formed of the same material, and at the same time, as a first peripheral light-shield layer covering an end face of the first peeling auxiliary layer and a second peripheral light-shield layer covering an end face of the second peeling auxiliary layer, and the sacrifice layer is continuous with each of the first peripheral light-shield layer and the second peripheral light-shield layer.

Assignees

• Japan Display Inc

Inventors

• Kawata Yasushi
• Murayama Akio

Classifications

• H10K59/8792

  comprising light absorbing layers, e.g. black layers · CPC title

• B32B38/10 Primary

  Removing layers, or parts of layers, mechanically or chemically · CPC title

• G02F1/133351 Primary

  Manufacturing of individual cells out of a plurality of cells, e.g. by dicing · CPC title

• B23K2203/172

  Operations & Transport · mapped topic

• B23K26/40

  taking account of the properties of the material involved · CPC title