Polishing method involving a polishing member polishing at angle tangent to the substrate rotational direction

Patent metadata

Field	Value
Publication number	US-9630289-B2
Application number	US-201314034468-A
Country	US
Kind code	B2
Filing date	Sep 23, 2013
Priority date	Sep 24, 2012
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.

First claim

What is claimed is:

1. A polishing method, comprising:
rotating a substrate;
first polishing the substrate by pressing a polishing tape against an edge portion of the substrate by a pressing member by applying movement in a direction approximately perpendicular to a top surface of the substrate, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to form a step portion in the edge portion of the substrate and to bend the portion of the polishing tape along the pressing member; and
second polishing the substrate by pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member by applying movement in the radial direction of the substrate to polish a vertical surface of the step portion.

2. The polishing method according to claim 1 , wherein the bent portion of the polishing tape is longer than a depth of the step portion formed in the edge portion of the substrate in said first polishing.

3. The polishing method according to claim 1 , wherein at least one of said first polishing and said second polishing is performed while moving the polishing tape in its longitudinal direction.

4. The polishing method according to claim 3 , wherein a movement direction of the polishing tape is opposite to a movement direction of the edge portion of the rotating substrate.

5. A polishing method, comprising:
rotating a substrate;
first polishing the substrate by pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to form a step portion in the edge portion of the substrate;
after said first polishing, pressing the portion of the polishing tape against the step portion to bend the portion of the polishing tape along the pressing member; and
second polishing the substrate by pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member by applying movement in the radial direction of the substrate to polish a vertical surface of the step portion.

6. The polishing method according to claim 5 , wherein at least one of said first polishing and said second polishing is performed while moving the polishing tape in its longitudinal direction.

7. The polishing method according to claim 6 , wherein a movement direction of the polishing tape is opposite to a movement direction of the edge portion of the rotating substrate.

8. A polishing method, comprising:
rotating a substrate;
first polishing the substrate by pressing a first polishing tape against an edge portion of the substrate by a first pressing member, with a portion of the first polishing tape projecting from the first pressing member inwardly in a radial direction of the substrate, to form a step portion in the edge portion of the substrate;
positioning of second polishing tape and a second pressing member such that a portion of the second polishing tape projects from the second pressing member inwardly in the radial direction of the substrate;
pressing the portion of the second polishing tape against the step portion to bend the portion of the second polishing tape along the second pressing member; and
second polishing the substrate by pressing the bent portion of the second polishing tape inwardly in the radial direction of the substrate by the second pressing member to polish a vertical surface of the step portion.

9. The polishing method according to claim 8 , wherein performing said positioning comprises positioning the second polishing tape and the second pressing member such that an edge of the second pressing member is located radially outwardly of the vertical surface of the step portion and a horizontal distance between the edge of the second pressing member and the vertical surface is larger than a thickness of the second polishing tape.

10. The polishing method according to claim 8 , wherein:
the first polishing tape is a rough polishing tape; and
the second polishing tape is a fine polishing tape.

11. The polishing method according to claim 8 , wherein said first polishing is performed while moving the first polishing tape in its longitudinal direction.

12. The polishing method according to claim 11 , wherein a movement direction of the first polishing tape is opposite to a movement direction of the edge portion of the rotating substrate.

13. The polishing method according to claim 8 , wherein said second polishing is performed while moving the second polishing tape in its longitudinal direction.

14. The polishing method according to claim 13 , wherein a movement direction of the second polishing tape is opposite to a movement direction of the edge portion of the rotating substrate.

15. A polishing method, comprising:
rotating a substrate;
first polishing an edge portion of the substrate by pressing a polishing tool against the edge portion of the substrate in a direction substantially perpendicular to a flat surface of the substrate; and
after said first polishing, second polishing the edge portion of the substrate by pressing the polishing tool inwardly in the radial direction of the substrate.

16. A polishing method, comprising:
rotating a substrate;
slide-polishing an edge portion of the substrate by pressing a polishing tape against the edge portion of the substrate in a direction substantially perpendicular to a flat surface of the substrate by a pressing member while moving the polishing tape and the pressing member inwardly in a radial direction of the substrate until the polishing tape reaches a predetermined stop position;
repeating said slide-polishing; and
shifting slightly the stop position inwardly in the radial direction of the substrate each time said slide-polishing is performed.

17. A polishing method, comprising:
adjusting a pressing member in a position displaced along an inner edge of the pressing member by a predetermined distance such that an angle between the inner edge and a straight line, extending from a center of the substrate to a midpoint of the inner edge, is not a right angle as viewed from above the substrate;
locating the pressing member at the adjusted position;
rotating the substrate; and
pressing a polishing tape against an edge portion of the substrate by the pressing member in the adjusted position to form a horizontal surface on the edge portion of the substrate.

18. The polishing method according to claim 17 , wherein a polishing surface of the polishing tape when contacting the substrate is parallel to a surface of the substrate.

19. The polishing method according to claim 17 , wherein the predetermined distance is less than half a length of the inner edge of the pressing member.

20. A polishing method comprising:
locating a pressing member in a position displaced in a tangential direction of a substrate by a predetermined distance from an origin position that lies on a center line extending in a radial direction from a center of the substrate, said tangential direction being perpendicular to the center line;
rotating the substrate; and
pressing a polishing tape against an edge portion of the substrate by the pressing member in the displaced position to form a horizontal surface on the edge portion of the substrate,
wherein the polishing tape extends in the tangential direction when viewed from above the substrate.

21. The polishing method a

Assignees

• Ebara Corp

Inventors

• Togawa Tetsuji
• Yoshida Atsushi
• Yamashita Michiyoshi

Classifications

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B9/065 Primary

  of thin, brittle parts, e.g. semiconductors, wafers · CPC title

• B24B21/00

  Machines or devices using grinding or polishing belts (for sharpening cutting edges of tools B24B3/00; portable belt-grinding machines B24B23/06); Accessories therefor · CPC title

• B24B21/002 Primary

  for grinding edges or bevels · CPC title

• B24B21/20

  for controlling or adjusting the tracking or the tension of the grinding belt · CPC title