Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
US9629247B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9629247-B2 |
| Application number | US-201414898757-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 3, 2014 |
| Priority date | Jun 20, 2013 |
| Publication date | Apr 18, 2017 |
| Grant date | Apr 18, 2017 |
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Various embodiments may relate to a lens for an illuminating device and an illuminating device having a lens of the above mentioned type, wherein the lens includes a bottom plate and at least one optical part formed on the bottom plate, wherein the lens further includes at least two assembly parts that are position-fixedly formed on the bottom plate, and the assembly parts are configured to be respectively aligned with assembly positions on a circuit board of the illuminating device and configured to allow to be soldered to the circuit board.
Opening claim text (preview).
The invention claimed is: 1. A lens for an illuminating device, the lens comprising: a bottom plate and at least one optical part formed on the bottom plate, wherein the lens further comprises at least two assembly parts that are position-fixedly formed on the bottom plate, and the assembly parts are configured to be respectively aligned with assembly positions on a circuit board of the illuminating device and configured to allow to be soldered to the circuit board. 2. The lens according to claim 1 , wherein the assembly parts are formed integrally with the bottom plate as one piece. 3. The lens according to claim 1 , wherein the assembly part is configured to allow the lens to be mounted to the circuit board through surface mount technology. 4. The lens according to claim 3 , wherein the assembly part is formed in the bottom plate through insert moulding process. 5. The lens according to claim 4 , wherein the assembly part is partially encapsulated in the bottom plate. 6. The lens according to claim 5 , wherein a thermal insulation layer is provided on a section of the assembly part that is encapsulated by the bottom plate. 7. The lens according to claim 6 , wherein the thermal conductivity of the thermal insulation layer is less than 0.5 W/(m*K). 8. The lens according to claim 5 , wherein the assembly part is configured to have a U-shaped section profile, wherein the U-shaped assembly part includes a first landing leg, a second landing leg, and a connecting part connected between the first landing leg and the second landing leg, wherein the first landing leg is configured as a part encapsulated by the bottom plate. 9. The lens according to claim 8 , wherein the U-shaped assembly part is configured in such a manner that after fixation onto the bottom plate, all the parts, with exception of the first landing leg, are separated from the bottom plate. 10. The lens according to claim 8 , wherein the assembly part is fixed in the bottom plate such that the second landing leg extends parallel to the circuit board, wherein one surface of the second landing leg forms a solder side. 11. The lens according to claim 1 , wherein the assembly parts respectively have a first reference position, and the assembly positions of the circuit board have a second reference position for alignment with the first reference position. 12. The lens according to claim 11 , wherein a free end of the second landing leg forms the first reference position. 13. The lens according to claim 1 , wherein the assembly part is formed by bending a sheet metal. 14. The lens according to claim 13 , wherein the sheet metal is made of copper. 15. An illuminating device, comprising: a circuit board; and at least one LED chip provided on the circuit board, wherein the illuminating device further comprises a lens, and the lens is soldered on the circuit board the lens comprising: a bottom plate, and at least one optical part formed on the bottom plate, wherein the lens further comprises at least two assembly parts that are position-fixedly formed on the bottom plate, and the assembly parts are configured to be respectively aligned with assembly positions on the circuit board of the illuminating device. 16. The illuminating device according to claim 15 , wherein at least two assembly positions are provided on the circuit board, and assembly parts of the lens are respectively soldered at the assembly positions. 17. The illuminating device according to claim 16 , wherein the assembly position is composed of a metal plate, wherein at least one edge position of the metal plate is configured as the second reference position.
with surface mounted components (H05K3/32 takes precedence) · CPC title
associated with surface mounted components · CPC title
Light emitting diode [LED] · CPC title
Cross-Sectional Technologies · mapped topic
Optical component, e.g. opto-electronic component · CPC title
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