Semiconductor device and a method for forming a semiconductor device

Patent metadata

Field	Value
Publication number	US-9628918-B2
Application number	US-201314088747-A
Country	US
Kind code	B2
Filing date	Nov 25, 2013
Priority date	Nov 25, 2013
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A semiconductor device includes a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die. The microphone module includes a movable microphone element arranged at a main side of the first semiconductor die and the second semiconductor die is mounted to the main side of the first semiconductor die.

First claim

What is claimed is:

1. A semiconductor device comprising:
a microphone module implemented on a first semiconductor die, wherein the microphone module comprises a moveable microphone element arranged at a main side of the first semiconductor die;
a signal processing module implemented on a second, different semiconductor die, wherein the second semiconductor die is mounted to the main side of the first semiconductor die;
a lead frame mounted to a back side of the first semiconductor die, the lead frame comprising a hole to access the microphone module, wherein the hole extends through the lead frame and is arranged opposite to the moveable microphone element; and
a circuit board mounted to the lead frame, wherein a gap between the lead frame and the circuit board is sealed around the hole of the lead frame with exception of an opening located in a preferred sensitivity direction in the gap between the lead frame and the circuit board.

2. The semiconductor device according to claim 1 , wherein the second semiconductor die comprises a hole extending through the second semiconductor die.

3. The semiconductor device according to claim 2 , further comprising a moulding compound structure partly enclosing the first semiconductor die and the second semiconductor die, wherein the moulding compound structure comprises a hole extending from the hole of the second semiconductor die through the moulding compound structure.

4. The semiconductor device according to claim 2 , wherein a lateral size of the hole of the second semiconductor die is smaller than a lateral size of the moveable microphone element.

5. The semiconductor device according to claim 1 , wherein the first semiconductor die comprises at least one signal output interface at the main side electrically connected to at least one signal input interface of the second semiconductor die, wherein the microphone module is configured to provide a microphone signal to the at least one signal output, wherein the microphone signal comprises information on a movement of the moveable microphone element.

6. The semiconductor device according to claim 5 , wherein the at least one signal input interface of the second semiconductor die is arranged at a side of the second semiconductor die facing the first semiconductor die.

7. The semiconductor device according to claim 1 , wherein the second semiconductor die is mounted to the first semiconductor die based on a flip chip assembly.

8. The semiconductor device according to claim 5 , wherein the at least one signal input interface of the second semiconductor die is arranged at a side of the second semiconductor die opposite to the first semiconductor die.

9. The semiconductor device according to claim 1 , wherein the second semiconductor die is mounted to the first semiconductor die based on a wire bond assembly.

10. The semiconductor device according to claim 1 , wherein the first semiconductor die and the second semiconductor die comprise the same lateral die size.

11. The semiconductor device according to claim 1 , wherein the first semiconductor die or the second semiconductor die comprises at least one through silicon via for providing a signal processed by the signal processing module to an output interface of the semiconductor device.

12. The semiconductor device according to claim 1 , wherein the lead frame comprises at least one pad connected to an output interface of the first semiconductor die arranged at the backside of the first semiconductor die.

13. The semiconductor device according to claim 12 , wherein the output interface arranged at the backside of the first semiconductor die is connected through a through silicon via to an output interface of the second semiconductor die.

14. The semiconductor device according to claim 1 , wherein the lead frame comprises at least one pad connected to an output interface of the first semiconductor die arranged at the main side of the first semiconductor die through a wire bond.

15. A method for forming a semiconductor device comprising a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die, wherein the microphone module comprises a moveable microphone element arranged at a main side of the first semiconductor die, wherein the method comprises:
mounting the second semiconductor die to the main side of the first semiconductor die;
mounting a lead frame to a back side of the first semiconductor die, the lead frame comprising a hole to access the microphone module, wherein the hole extends through the lead frame and is arranged opposite to the moveable microphone element; and
mounting a circuit board to the lead frame, wherein a gap between the lead frame and the circuit board is sealed around the hole of the lead frame with exception of an opening located in a preferred sensitivity direction in the gap between the lead frame and the circuit board.

16. The semiconductor device according to claim 1 , wherein the second semiconductor die has no lateral overlap with the moveable microphone element.

Assignees

• Infineon Technologies Ag

Inventors

• Ng Chee Yang

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title