Methods for masking and applying protective coatings to electronic assemblies

Patent metadata

Field	Value
Publication number	US-9627194-B2
Application number	US-201414542318-A
Country	US
Kind code	B2
Filing date	Nov 14, 2014
Priority date	Jan 10, 2012
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

First claim

What is claimed:

1. A method for coating an electronic device, comprising:
assembling at least first and second components of an electronic device to form an electronic assembly, the first component including at least one of an exterior component of the electronic device, light emission element of the electronic device, an imaging element of the electronic device, or a sensor of the electronic device;
applying a mask over at least one of the light emission element, the imaging element or the sensor of the electronic assembly, the mask shielding the light emission element, the imaging element or the sensor, wherein the mask covers portions of opposite surfaces of the electronic assembly;
applying a water-resistant protective coating to at least two components of the electronic assembly with the mask in place; and
removing the mask from the electronic assembly, the water-resistant protective coating remaining on coated portions of the electronic assembly, uncoated portions of the electronic assembly, including the light emission element, the imaging element or the sensor, being exposed through removal of the mask.

2. The method of claim 1 , wherein applying the mask comprises applying a fluid masking material.

3. The method of claim 2 , further comprising: hardening the fluid masking material to form the mask.

4. The method of claim 3 , wherein hardening the fluid masking material comprises curing the fluid masking material.

5. The method of claim 2 , wherein removing the mask comprises mechanically removing the mask from the electronic assembly.

6. The method of claim 2 , wherein removing the mask comprises chemically removing the mask from the electronic assembly, the chemically removing being effected without removing the protective coating.

7. The method of claim 1 , wherein applying the mask comprises assembling a mask with the electronic assembly, the mask covering the at least one light emission element, the at least one imaging element or the at least one sensor of the electronic assembly.

8. The method of claim 7 , wherein removing the mask from the electronic assembly comprises disassembling the mask from the electronic assembly.

9. The method of claim 8 , further comprising:
cleaning the mask after disassembling the mask from the electronic assembly; and
assembling the mask with another electronic assembly.

10. The method of claim 7 , wherein assembling the mask comprises assembling a plurality of electronic assemblies with the mask.

11. The method of claim 1 , wherein assembling the at least first and second components comprises assembling a plurality of components to be located at least partially within an interior of the electronic device.

12. The method of claim 1 , wherein the at least one exterior component of the electronic device defines at least a portion of an interior of the electronic device, at least a portion of the protective coating and at least a portion of the electronic assembly located within the interior of the electronic device.

13. The method of claim 1 , further comprising:
after removing the mask, assembling at least one additional component with the electronic assembly;
applying another mask to the electronic assembly to shield at least a portion of the at least one additional component;
applying another protective coating over the another mask and to at least a portion of the at least one additional component exposed through the another mask; and
removing the another mask from the electronic assembly, the another protective coating remaining on a coated portion of the additional component, at least one uncoated portion of the electronic assembly being exposed through the another mask.

Assignees

• Hzo Inc

Inventors

• Stevens Blake
• Sorenson Max
• Martin Iii Sidney Edward

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10P14/6502 Primary

  of treatments performed before formation of the materials · CPC title

• H05K2203/0173

  Template for holding a PCB having mounted components thereon · CPC title

• Y10T29/49002

  Electrical device making · CPC title